DEPOSITING APPARATUS AND METHOD FOR MEASURING DEPOSITION QUANTITY USING THE SAME

    公开(公告)号:US20170312773A1

    公开(公告)日:2017-11-02

    申请号:US15651425

    申请日:2017-07-17

    CPC classification number: B05B12/00 C23C14/04 C23C14/545

    Abstract: A deposition apparatus uniformly controlling deposited quantities of a plurality of depositing sources by efficiently determining an abnormal depositing source. The deposition apparatus may reduce loss of materials by exactly determining an abnormal depositing source. The deposition apparatus includes: a plurality of depositing sources spraying a deposition material; a substrate holder fixing a substrate to face the depositing source; a depositing source shutter disposed at one side of the depositing source and opening and closing an passage of each depositing source; and a main shutter disposed between the depositing source and the substrate fixed to the substrate holder and depositing a part of the deposition material on the substrate through the main shutter.

    Deposition apparatus and method of manufacturing organic light emitting diode display
    2.
    发明授权
    Deposition apparatus and method of manufacturing organic light emitting diode display 有权
    沉积装置和制造有机发光二极管显示器的方法

    公开(公告)号:US09267202B2

    公开(公告)日:2016-02-23

    申请号:US14074629

    申请日:2013-11-07

    CPC classification number: C23C14/568 C23C14/50 H01L51/0011 H01L51/56

    Abstract: A deposition apparatus includes a deposition chamber, a plurality of substrate holders comprising a first holder configured to maintain a substrate at a first substrate position in the deposition chamber and a second holder configured to maintain another substrate at a second substrate position in the deposition chamber, a deposition source disposed in the deposition chamber and configured to supply a deposition material to apply onto substrates placed at the first and second substrate positions, and a deposition source transfer mechanism configured to move the deposition source to be opposite to one of the first and second substrates in a first direction, a substrate transfer mechanism configured to transfer a substrate in a second direction to or from the first substrate position and further configured to transfer another substrate in the second direction to or from the second substrate position.

    Abstract translation: 沉积设备包括沉积室,多个衬底保持器,其包括构造成将衬底保持在沉积室中的第一衬底位置处的第一保持器和构造成将另一衬底保持在沉积室中的第二衬底位置处的第二保持器, 沉积源,设置在所述沉积室中并且被配置为提供沉积材料以施加到放置在所述第一和第二基板位置的基板上;沉积源传输机构,被配置为使所述沉积源移动以与所述第一和第二基板位置之一相反 衬底传送机构,其被配置为将衬底沿第二方向传送到第一衬底位置或从第一衬底位置移动,并且还被配置为将第二方向上的另一个衬底转移到第二衬底位置或从第二衬底位置传送另一个衬底。

    Depositing apparatus and method for measuring deposition quantity using the same

    公开(公告)号:US10596582B2

    公开(公告)日:2020-03-24

    申请号:US15651425

    申请日:2017-07-17

    Abstract: A deposition apparatus uniformly controlling deposited quantities of a plurality of depositing sources by efficiently determining an abnormal depositing source. The deposition apparatus may reduce loss of materials by exactly determining an abnormal depositing source. The deposition apparatus includes: a plurality of depositing sources spraying a deposition material; a substrate holder fixing a substrate to face the depositing source; a depositing source shutter disposed at one side of the depositing source and opening and closing an passage of each depositing source; and a main shutter disposed between the depositing source and the substrate fixed to the substrate holder and depositing a part of the deposition material on the substrate through the main shutter.

    Depositing apparatus and method for measuring deposition quantity using the same

    公开(公告)号:US09724715B2

    公开(公告)日:2017-08-08

    申请号:US13953982

    申请日:2013-07-30

    CPC classification number: B05B12/00 C23C14/04 C23C14/545

    Abstract: A deposition apparatus may uniformly control deposited quantities of a plurality of depositing sources by efficiently determining an abnormal depositing source. The deposition apparatus may reduce loss of materials by exactly determining an abnormal depositing source. The deposition apparatus includes: a plurality of depositing sources spraying a deposition material; a substrate holder fixing a substrate to face the depositing source; a depositing source shutter disposed at one side of the depositing source and opening and closing an passage of each depositing source; and a main shutter disposed between the depositing source and the substrate fixed to the substrate holder and depositing a part of the deposition material on the substrate through the main shutter.

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