公开(公告)号：US20170016109A1

公开(公告)日：2017-01-19

申请号：US15277977

申请日：2016-09-27

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Yong-Suk Lee ,  Myung-Soo Huh ,  Cheol-Rae Jo ,  Sang-Hyuk Hong ,  Jeong-Ho Yi ,  Suk-Won Jung ,  Sun-Ho Kim ,  Mi-Ra An

IPC: C23C14/12 ,  C23C14/58 ,  C23C14/24 ,  C23C14/22

CPC classification number: C23C14/12 ,  C23C14/228 ,  C23C14/246 ,  C23C14/58 ,  C23C14/584

Abstract: A thin film depositing apparatus and a thin film deposition method using the apparatus. The thin film depositing apparatus includes a chamber configured to have a substrate mounted therein, an ejection unit configured to move in the chamber and to eject a deposition vapor to the substrate, and a source supply unit configured to supply a source of the deposition vapor to the ejection unit.

Abstract translation: 一种薄膜沉积设备和使用该设备的薄膜沉积方法。 该薄膜沉积设备包括：一个被配置为具有安装在其中的基板的腔室;喷射单元，被配置为在腔室中移动并将沉积蒸气喷射到基底;以及源供应单元，其构造成将沉积蒸气源供应到 喷射单元。

公开(公告)号：US10214808B2

公开(公告)日：2019-02-26

申请号：US15492941

申请日：2017-04-20

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Myung-Soo Huh ,  Suk-Won Jung ,  Jeong-Ho Yi ,  Sang-Hyuk Hong ,  Yong-Suk Lee

IPC: H01L27/00 ,  C23C16/04 ,  C23C16/458 ,  H01L21/68 ,  H01L27/32 ,  H01L21/687 ,  C23C16/44 ,  C23C16/50 ,  C23C16/52 ,  H01L51/00 ,  H01L51/56

Abstract: A deposition apparatus for performing a deposition process by using a mask with respect to a substrate, the deposition apparatus includes a chamber, a support unit in the chamber, the support unit including first holes and being configured to support the substrate, a supply unit configured to supply at least one deposition raw material toward the substrate, and movable alignment units through the first holes of the support unit, the alignment units being configured to support the mask and to align the mask with respect to the substrate.

公开(公告)号：US09142415B2

公开(公告)日：2015-09-22

申请号：US14269175

申请日：2014-05-04

Applicant: Samsung Display Co., Ltd.

Inventor： Myung-Soo Huh ,  Suk-Won Jung ,  Sung-Chul Kim ,  Sang-Hyuk Hong ,  Choel-Min Jang

IPC: H01L21/285 ,  H01L21/02 ,  H01L51/56 ,  H01L51/00

CPC classification number: H01L21/28506 ,  C23C16/452 ,  C23C16/45565 ,  C23C16/45578 ,  C23C16/458 ,  C23C16/509 ,  H01J37/32357 ,  H01J37/3244 ,  H01L21/02274 ,  H01L51/001 ,  H01L51/56

Abstract: A deposition apparatus for performing a deposition process on a substrate includes: an injection unit including a plasma generating member which receives a raw material gas and converts the raw material gas to a deposition source material in a radical form; and a plasma processor disposed adjacent to the injection unit and facing a side of the injection unit, wherein the plasma processor performs a plasma process in a direction facing the substrate.

Abstract translation: 用于在基板上进行沉积处理的沉积装置包括：注入单元，其包括等离子体产生元件，该等离子体产生元件接纳原料气体，并将原料气体以基本形式转化为沉积源材料; 以及等离子体处理器，其与所述注入单元相邻并且面向所述注入单元的一侧，其中所述等离子体处理器在面向所述基板的方向上执行等离子体处理。

公开(公告)号：US09673265B2

公开(公告)日：2017-06-06

申请号：US14020849

申请日：2013-09-08

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Myung-Soo Huh ,  Suk-Won Jung ,  Jeong-Ho Yi ,  Sang-Hyuk Hong ,  Yong-Suk Lee

IPC: H01L21/68 ,  H01L27/32 ,  C23C16/04 ,  C23C16/458 ,  H01L21/687

CPC classification number: C23C16/042 ,  C23C16/4405 ,  C23C16/4585 ,  C23C16/50 ,  C23C16/52 ,  H01L21/681 ,  H01L21/682 ,  H01L21/68735 ,  H01L21/68742 ,  H01L27/3244 ,  H01L51/0012 ,  H01L51/56

Abstract: A deposition apparatus for performing a deposition process by using a mask with respect to a substrate, the deposition apparatus includes a chamber, a support unit in the chamber, the support unit including first holes and being configured to support the substrate, a supply unit configured to supply at least one deposition raw material toward the substrate, and movable alignment units through the first holes of the support unit, the alignment units being configured to support the mask and to align the mask with respect to the substrate.