公开(公告)号：US10747074B2

公开(公告)日：2020-08-18

申请号：US16042401

申请日：2018-07-23

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Chong-Guk Lee ,  Joo-Yeon Won ,  Se-Hul Jang ,  Su-Mi Moon ,  Dong-Wook Lee

IPC: G02F1/1345 ,  H05K1/02 ,  H01L23/498 ,  H01L27/12 ,  H01L23/00 ,  H05K1/18

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

公开(公告)号：US11215883B2

公开(公告)日：2022-01-04

申请号：US16924618

申请日：2020-07-09

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Chong-Guk Lee ,  Joo-Yeon Won ,  Se-Hul Jang ,  Su-Mi Moon ,  Dong-Wook Lee

IPC: H05K1/02 ,  G02F1/1345 ,  H01L23/498 ,  H01L27/12 ,  H01L23/00 ,  H05K1/18

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

公开(公告)号：US10031385B2

公开(公告)日：2018-07-24

申请号：US15604877

申请日：2017-05-25

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Chong-Guk Lee ,  Joo-Yeon Won ,  Se-Hui Jang ,  Su-Mi Moon ,  Dong-Wook Lee

IPC: H01L23/48 ,  G02F1/1345 ,  H01L27/12 ,  H05K1/02 ,  H01L23/498 ,  H05K1/18 ,  H01L23/00

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

公开(公告)号：US20150230337A1

公开(公告)日：2015-08-13

申请号：US14527229

申请日：2014-10-29

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： DONG-IN KIM ,  Hyun-Seok Hong ,  Sang-Min Jeon ,  Joo-Yeon Won ,  Chong-Guk Lee

IPC: H05K1/11 ,  H05K3/36 ,  H05K1/18

CPC classification number: H05K1/118 ,  H05K1/111 ,  H05K1/147 ,  H05K1/181 ,  H05K1/189 ,  H05K3/361 ,  H05K2201/10128 ,  Y10T29/49126

Abstract: A display device includes a display panel including a display area and a non-display area, a plurality of driver integrated circuits mounted on the non-display area of the display panel by a COG method, a printed circuit board (PCB) configured to provide a signal to the plurality of driver integrated circuits, and a flexible printed circuit (FPC) configured to transfer the signal from the PCB to the plurality of driver integrated circuits. The FPC has a first end portion and a second end portion opposite to the first end portion. The first end portion is attached on the non-display area of the display panel by a FOG method, and the second end portion is attached on the PCB. A width of the second end portion is different from a width of the first end portion.

Abstract translation: 显示装置包括显示面板和非显示区域的显示面板，通过COG方法安装在显示面板的非显示区域上的多个驱动器集成电路，印刷电路板（PCB） 向多个驱动器集成电路提供的信号，以及被配置为将信号从PCB传送到多个驱动器集成电路的柔性印刷电路（FPC）。 FPC具有与第一端部相对的第一端部和第二端部。 第一端部通过FOG方法附着在显示面板的非显示区域上，第二端部附着在PCB上。 第二端部的宽度与第一端部的宽度不同。

公开(公告)号：US20180329253A1

公开(公告)日：2018-11-15

申请号：US16042401

申请日：2018-07-23

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Chong-Guk Lee ,  Joo-Yeon Won ,  Se-Hul Jang ,  Su-Mi Moon ,  Dong-Wook Lee

IPC: G02F1/1345 ,  H01L23/498 ,  H05K1/02 ,  H01L27/12 ,  H05K1/18 ,  H01L23/00

CPC classification number: G02F1/13452 ,  H01L23/4985 ,  H01L24/16 ,  H01L24/48 ,  H01L27/124 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/81191 ,  H01L2924/00014 ,  H01L2924/15159 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/09227 ,  H05K2201/09272 ,  H05K2201/09281 ,  H05K2201/10674 ,  H01L2224/45099

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

公开(公告)号：US09664964B2

公开(公告)日：2017-05-30

申请号：US14678406

申请日：2015-04-03

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Chong-Guk Lee ,  Joo-Yeon Won ,  Se-Hui Jang ,  Su-Mi Moon ,  Dong-Wook Lee

IPC: H01L23/48 ,  G02F1/1345 ,  H01L27/12 ,  H01L23/498 ,  H05K1/02 ,  H01L23/00 ,  H05K1/18

CPC classification number: G02F1/13452 ,  H01L23/4985 ,  H01L24/16 ,  H01L24/48 ,  H01L27/124 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/81191 ,  H01L2924/00014 ,  H01L2924/15159 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/09227 ,  H05K2201/09272 ,  H05K2201/09281 ,  H05K2201/10674 ,  H01L2224/45099

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate. The IC Chip is electrically connected to the input line. The output line includes a main output and a sub output line. The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

公开(公告)号：US09354468B2

公开(公告)日：2016-05-31

申请号：US14522191

申请日：2014-10-23

Applicant: Samsung Display Co., Ltd.

Inventor： Sang Hwan Lee ,  Young Dae Song ,  Jae-Hwan Jeon ,  Yong Woo Kim ,  Sung-Dong Park ,  Hyeok-Tae Kwon ,  Joo-Yeon Won ,  Chong Guk Lee ,  Byung Goo Jung

IPC: G02F1/1333 ,  G02F1/1335

CPC classification number: G02F1/133528 ,  G02F1/133308 ,  G02F2001/133317 ,  G02F2001/133374 ,  G02F2202/28

Abstract: A liquid crystal display according to an exemplary embodiment of the present invention includes a first display panel and a second display panel which are opposite to each other, a driving unit connection line which is formed in the first display panel, a driving circuit portion which is connected to the driving unit connection line, a backlight unit which is disposed so as to be adjacent to the first display panel, a polarizer which is disposed on a surface of the second display panel and overlaps the driving unit connection line and the driving circuit portion, and a reinforcement unit that overlaps the driving unit connection line, and the polarizer may be disposed on the reinforcement unit.

Abstract translation: 根据本发明的示例性实施例的液晶显示器包括彼此相对的第一显示面板和第二显示面板，形成在第一显示面板中的驱动单元连接线，驱动电路部分 连接到驱动单元连接线的背光单元，被布置为与第一显示面板相邻;偏振器，设置在第二显示面板的表面上，并与驱动单元连接线和驱动电路部分重叠 以及与驱动单元连接线重叠的加强单元，并且偏振器可以设置在加强单元上。

公开(公告)号：US20160062172A1

公开(公告)日：2016-03-03

申请号：US14678406

申请日：2015-04-03

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Chong-Guk Lee ,  Joo-Yeon Won ,  Se-Hui Jang ,  Su-Mi Moon ,  Dong-Wook Lee

IPC: G02F1/1345 ,  H01L23/00 ,  H01L27/12

CPC classification number: G02F1/13452 ,  H01L23/4985 ,  H01L24/16 ,  H01L24/48 ,  H01L27/124 ,  H01L2224/16227 ,  H01L2224/48227 ,  H01L2224/81191 ,  H01L2924/00014 ,  H01L2924/15159 ,  H05K1/028 ,  H05K1/189 ,  H05K2201/09227 ,  H05K2201/09272 ,  H05K2201/09281 ,  H05K2201/10674 ,  H01L2224/45099

Abstract: A chip on film package includes a base substrate, an input line, an integrated circuit (IC) chip and an output line. The input line is disposed on the base substrate, The IC Chip is electrically connected to the input line. The output line includes a main output and a sub output line, The main output line is electrically connected to the IC chip and extends in a first direction from the IC chip. The sub output line is electrically connected to the IC chip. The sub output line includes at least six bending parts, and is extended in the first direction.

Abstract translation: 薄膜封装芯片包括基底基板，输入线，集成电路（IC）芯片和输出线。 输入线设置在基底基板上.IC芯片电连接到输入线。 输出线包括主输出和副输出线。主输出线与IC芯片电连接，并从IC芯片沿第一方向延伸。 副输出线电连接到IC芯片。 子输出线包括至少六个弯曲部分，并且沿第一方向延伸。

公开(公告)号：US09087748B2

公开(公告)日：2015-07-21

申请号：US14333747

申请日：2014-07-17

Applicant: Samsung Display Co., Ltd.

Inventor： Joo-Yeon Won ,  Yun Hee Kwak ,  Sung-Dong Park ,  Chong Guk Lee ,  Byung Goo Jung

IPC: H01L27/13 ,  H01L27/12 ,  G02F1/1362 ,  H01L23/528

CPC classification number: H01L27/124 ,  G02F1/136259 ,  G02F2001/136263 ,  G02F2001/136272 ,  H01L23/528 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A thin film transistor substrate includes: first and second driving chips; a plurality of signal lines respectively connected to the first and second driving chips; a plurality of first and second branch repair lines extended across the plurality of signal lines connected to the first driving chip; a plurality of third and fourth branch repair lines extended across the plurality of signal lines connected to the second driving chip; an insulating layer between the plurality of first and second branch repair lines and the plurality of signal lines connected to the first driving chip, and between the plurality of third and fourth branch repair lines and the plurality of signal lines connected to the second driving chip; a first repair line connecting the first and second branch repair lines to each other; and a second repair line connecting the third and fourth branch repair lines to each other.

Abstract translation: 薄膜晶体管基板包括：第一和第二驱动芯片; 分别连接到第一和第二驱动芯片的多条信号线; 多个第一和第二分支修复线，跨越连接到第一驱动芯片的多条信号线延伸; 多个第三和第四分支修复线，跨越连接到第二驱动芯片的多条信号线延伸; 所述多个第一和第二分支修复线与连接到所述第一驱动芯片的多个信号线之间以及所述多个第三和第四分支修复线与连接到所述第二驱动芯片的所述多条信号线之间的绝缘层; 将第一和第二分支修复线彼此连接的第一修复线; 以及将第三和第四分支修复线彼此连接的第二修复线。

公开(公告)号：US09029710B2

公开(公告)日：2015-05-12

申请号：US13706622

申请日：2012-12-06

Applicant: Samsung Display Co., Ltd.

Inventor： Byung-Goo Jung ,  Joo-Yeon Won ,  Chong-Guk Lee ,  Sung-Dong Park

IPC: H05K1/00 ,  H05K7/06 ,  H05K1/03 ,  H01L23/495 ,  G02F1/1345

CPC classification number: H05K7/06 ,  G02F1/13452 ,  H01L23/49572 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2924/0002 ,  H05K1/0393 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A tape package includes a base substrate, an input lead line disposed on the base substrate, the input lead line including a main input lead line and a sub input lead line, the sub input lead line branching off and extending from the main input lead line, an integrated circuit chip electrically connected to the sub input lead line, and a sealing part fixing the integrated circuit chip on the base substrate and overlapping a portion of the main input lead line.

Abstract translation: 一种带式封装，包括基底基板，设置在基底基板上的输入引线，输入引线包括主输入引线和副输入引线，副输入引线从主输入引线 电连接到子输入引线的集成电路芯片，以及将集成电路芯片固定在基底基板上并与主输入引线的一部分重叠的密封部件。