公开(公告)号：US20140175423A1

公开(公告)日：2014-06-26

申请号：US13896045

申请日：2013-05-16

Applicant: Samsung Display Co., Ltd.

Inventor： Chang-Oh JEONG ,  Kyung Seop KIM ,  Hong Long NING ,  Byeong-Beom KIM ,  Joon Yong PARK ,  Jin Ho HWANG ,  Dong Min LEE

IPC: H01L27/12

CPC classification number: H01L27/1225 ,  H01L29/66969 ,  H01L29/7869

Abstract: A thin film transistor array panel is provided. The thin film transistor array panel includes a substrate, a seed layer positioned on the substrate, and a semiconductor layer positioned on the seed layer, wherein a lattice mismatch between the seed layer and the semiconductor layer is equal to or less than 1.4%.

Abstract translation: 提供薄膜晶体管阵列面板。 所述薄膜晶体管阵列面板包括基板，位于所述基板上的种子层和位于所述籽晶层上的半导体层，其中所述籽晶层与所述半导体层之间的晶格失配为1.4％以下。

公开(公告)号：US20240357872A1

公开(公告)日：2024-10-24

申请号：US18528982

申请日：2023-12-05

Applicant: Samsung Display Co., LTD.

Inventor： Jin Ho HWANG ,  Sang Jin PARK

IPC: H10K59/122 ,  H10K59/12 ,  H10K59/80

CPC classification number: H10K59/122 ,  H10K59/1201 ,  H10K59/873

Abstract: A display device includes a pixel defining layer on a substrate and including a bank including first through third bank layers, in order from the substrate, an inorganic pixel defining layer between the bank and the substrate, and the bank together with the inorganic pixel defining layer defining a light emission opening, an a light emitting element in the light emission opening. Each of the first and third bank layers has a side surface which defines the light emission opening, the third bank layer protrudes further than the side surface of the first bank layer to define a tip of the third bank layer which defines the side surface of the third bank layer, and the side surface of the third bank layer is inclined relative to the substrate and defines an inclined side surface of the third bank layer.

公开(公告)号：US20140076714A1

公开(公告)日：2014-03-20

申请号：US13760758

申请日：2013-02-06

Applicant: SAMSUNG DISPLAY CO., LTD.

Inventor： Jin Ho HWANG ,  Do-Hyun KIM ,  Sang Won SHIN ,  Woo Song KIM ,  Chang-Oh JEONG

IPC: C23C14/35

CPC classification number: C23C14/352 ,  C23C14/0063 ,  C23C14/35 ,  C23C16/455 ,  C23C16/45565 ,  H01J37/3244 ,  H01J37/32449 ,  H01J37/32834 ,  H01J37/3411 ,  H01J37/3417 ,  H01J37/3435 ,  H01J37/3438

Abstract: A sputtering device includes: a sputtering target; a substrate supporter facing the sputtering target and upon which a substrate is disposed; an anode mask between the sputtering target and the substrate which is on the substrate supporter; and a gas distribution member between the anode mask and the sputtering target, and including a plurality of gas distribution tubes separated from each other. Each gas distribution tube includes a plurality of discharge holes defined therein and through which gas is discharged to a vacuum chamber configured to receive the sputtering device.

Abstract translation: 溅射装置包括：溅射靶; 面向溅射靶的衬底支撑件，并且衬底被设置在衬底支撑件上; 位于所述基板支撑体上的所述溅射靶和所述基板之间的阳极掩模; 以及位于阳极掩模和溅射靶之间的气体分配构件，并且包括彼此分离的多个气体分配管。 每个气体分配管包括限定在其中的多个排放孔，并且气体被排出到被配置为接收溅射装置的真空室。