Abstract:
An embodiment of the present inventive concept provides a display device including: a mother substrate on which a plurality of display modules are located; and a mother film located on a rear surface of the mother substrate, wherein the mother film may include a first layer, and a second layer disposed between the first layer and the mother substrate, the second layer has a thickness of from about 40 μm to about 60 μm, and a thickness of the first layer may be greater than that of the second layer.
Abstract:
An organic light-emitting diode (OLED) display, electronic device including the same and method of manufacturing the OLED display are disclosed. In one aspect, the OLED display includes a first plastic layer, a first barrier layer formed over the first plastic layer and a first intermediate layer formed over the first barrier layer. The OLED display also includes a second plastic layer formed over the first intermediate layer, a second intermediate layer formed over the second plastic layer and a second barrier layer formed over the second intermediate layer. The OLED display further includes an OLED layer formed over the second barrier layer and a thin-film encapsulation layer encapsulating the OLED layer.
Abstract:
An organic light-emitting diode (OLED) display, electronic device including the same and method of manufacturing the OLED display are disclosed. In one aspect, the OLED display includes a first plastic layer, a first barrier layer formed over the first plastic layer and a first intermediate layer formed over the first barrier layer. The OLED display also includes a second plastic layer formed over the first intermediate layer, a second intermediate layer formed over the second plastic layer and a second barrier layer formed over the second intermediate layer. The OLED display further includes an OLED layer formed over the second barrier layer and a thin-film encapsulation layer encapsulating the OLED layer.
Abstract:
A method for manufacturing a flexible display device includes: manufacturing a flexible substrate on a substrate by: forming a first organic layer on the substrate, removing foreign particles formed on the first organic layer and forming a recessed first repair groove in the first organic layer, forming a first inorganic layer on the first organic layer, forming a second organic layer on the first inorganic layer and forming a second inorganic layer on the second organic layer, forming a display for displaying an image on the flexible substrate and removing the substrate from the first organic layer.
Abstract:
A display device and a method of manufacturing the same are disclosed. In one aspect, the display device includes a display area formed over a substrate and configured to display an image, and a pad area formed over the substrate surrounding the display area and configured to provide an electrical signal to the display area. The pad area includes a first electrode layer formed over the substrate and electrically connected to the display area and a second electrode layer formed over the first electrode layer and electrically connected to the first electrode layer. The pad area also includes a first organic layer bonded to a portion of the second electrode layer at a first adhesion strength, a third electrode layer bonded to the first organic layer at a second adhesion strength and electrically connected to the second electrode layer, and a flexible PCB electrically connected to the third electrode layer.
Abstract:
A display device and a method of manufacturing the same are disclosed. In one aspect, the display device includes a display area formed over a substrate and configured to display an image, and a pad area formed over the substrate surrounding the display area and configured to provide an electrical signal to the display area. The pad area includes a first electrode layer formed over the substrate and electrically connected to the display area and a second electrode layer formed over the first electrode layer and electrically connected to the first electrode layer. The pad area also includes a first organic layer bonded to a portion of the second electrode layer at a first adhesion strength, a third electrode layer bonded to the first organic layer at a second adhesion strength and electrically connected to the second electrode layer, and a flexible PCB electrically connected to the third electrode layer.