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    Display device
    1.
    发明授权
    Display device 有权

    公开(公告)号：US11793040B2

    公开(公告)日：2023-10-17

    申请号：US16926384

    申请日：2020-07-10

    Applicant: Samsung Display Co., LTD.

    Inventor： Dae Geun Lee

    IPC: H10K59/131 ,  H01L23/498 ,  H05K1/11

    CPC classification number: H10K59/131 ,  H01L23/49838 ,  H05K1/111

    Abstract: A display device includes a base substrate in which a display area and a pad area disposed around the display area are defined, a plurality of panel pads disposed on the pad area of the base substrate, and a printed circuit board attached to the pad area of the base substrate. The printed circuit board includes a plurality of circuit pads, the plurality of circuit pads include a first lead align mark, and the first lead align mark includes a plurality of first patterns passing through the first lead align mark from a surface of the first lead align mark in a thickness direction.

    Array substrate and method of mounting integrated circuit using the same
    2.
    发明授权
    Array substrate and method of mounting integrated circuit using the same 有权

    公开(公告)号：US11081503B2

    公开(公告)日：2021-08-03

    申请号：US16510262

    申请日：2019-07-12

    Applicant: Samsung Display Co., Ltd.

    Inventor： Dae Geun Lee

    IPC: H05K1/11 ,  H01L27/12 ,  G02F1/1345 ,  H01L23/00 ,  H05K1/18 ,  H01L27/32

    Abstract: An electronic device, including an array substrate, a pad portion disposed on the array substrate, and an integrated circuit disposed on the pad portion and comprising a bump portion. The pad portion includes a first sub-pad unit including a first pad having an inclined shape and a second sub-pad unit including a second pad having an inclined shape. The first pad and the second pad are symmetrically arranged with respect to an imaginary line that divides the pad portion. The pad portion is electrically connected with the bump portion.

    Display device
    3.
    发明授权
    Display device 有权

    公开(公告)号：US10964680B2

    公开(公告)日：2021-03-30

    申请号：US16262607

    申请日：2019-01-30

    Applicant: Samsung Display Co., Ltd.

    Inventor： Dae Geun Lee ,  Kyung Mok Lee ,  Suk Ho Choi

    IPC: H01L25/18 ,  H01L23/00 ,  H01L27/32 ,  H01L51/00

    Abstract: The display device includes a flexible base layer including a first region and a second region located around the first; a display unit on one surface of the first region and including a light emitting element; a driving circuit on the second region and including a plurality of first bumps arranged in a first row and a plurality of second bumps arranged in a second row, the driving circuit includes a third bump in the first row and disposed outward relative to the plurality of first bumps, a first and second reference bump each disposed at a center of the plurality of first and second bumps that are disposed along a reference line defined in a column direction vertically intersecting a row direction, the remaining first and second bumps excluding the first reference bump and the second reference bump arranged to have a preset slope with respect to the reference line.

    Array substrate and method of mounting integrated circuit using the same
    4.
    发明授权
    Array substrate and method of mounting integrated circuit using the same 有权

    公开(公告)号：US10373987B2

    公开(公告)日：2019-08-06

    申请号：US15901846

    申请日：2018-02-21

    Applicant: Samsung Display Co., Ltd.

    Inventor： Dae Geun Lee

    IPC: H01L27/12 ,  H05K1/11 ,  G02F1/1345 ,  H01L23/00 ,  H05K1/18 ,  H01L27/32

    Abstract: An electronic device, including an array substrate, a pad portion disposed on the array substrate, and an integrated circuit disposed on the pad portion and comprising a bump portion. The pad portion includes a first sub-pad unit including a first pad having an inclined shape and a second sub-pad unit including a second pad having an inclined shape. The first pad and the second pad are symmetrically arranged with respect to an imaginary line that divides the pad portion. The pad portion is electrically connected with the bump portion.

    DISPLAY DEVICE HAVING ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF
    8.
    发明申请
    DISPLAY DEVICE HAVING ANISOTROPIC CONDUCTIVE FILM AND MANUFACTURING METHOD THEREOF 有权
    具有各向异性导电膜的显示装置及其制造方法

    公开(公告)号：US20150108436A1

    公开(公告)日：2015-04-23

    申请号：US14265737

    申请日：2014-04-30

    Applicant: Samsung Display Co., Ltd.

    Inventor： Jin Sic Min ,  Dae Geun Lee ,  Sang Urn Lim ,  Eu Tteum Kim

    IPC: H01L27/32 ,  H01L51/52 ,  H01L51/56

    CPC classification number: H01L27/3276 ,  H01L27/3255 ,  H01L51/524 ,  H01L51/529 ,  H01L51/56 ,  H01L2227/323 ,  H01L2251/5369

    Abstract: A display device includes a substrate including a wiring portion, a pad unit provided on the substrate and extended from the wiring portion, an integrated circuit chip electrically connected to the pad unit and mounted on the substrate, and an anisotropic conductive film configured to electrically connect the pad unit and the integrated chip to each other. The anisotropic conductive film includes an adhesive layer provided between the pad unit and the integrated circuit chip and at least one conductive ball scattered in the adhesive layer. A heat generator is also provided on the substrate. The heat generator is configured to come into contact with the anisotropic conductive film to supply heat to the anisotropic conductive film.

    Abstract translation: 显示装置包括：基板，具有布线部，设置在基板上并从布线部延伸的焊盘单元，与焊盘单元电连接并安装在基板上的集成电路芯片;以及各向异性导电膜， 垫单元和集成芯片彼此相连。 各向异性导电膜包括设置在焊盘单元和集成电路芯片之间的粘合剂层和在粘合剂层中散布的至少一个导电球。 在基板上还设有发热体。 发热体构成为与各向异性导电膜接触，向各向异性导电膜供给热量。

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