公开(公告)号：US20130181343A1

公开(公告)日：2013-07-18

申请号：US13653727

申请日：2012-10-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jung-Seok AHN ,  Sang-Won KIM ,  Young-Sang CHO ,  Kwang-Chul CHOI ,  Sung-Eun PYO

IPC: H01L21/78 ,  H01L23/498

CPC classification number: H01L25/0657 ,  H01L21/561 ,  H01L23/3157 ,  H01L23/5226 ,  H01L23/528 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/73 ,  H01L24/81 ,  H01L24/94 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/0557 ,  H01L2224/06181 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/14181 ,  H01L2224/16146 ,  H01L2224/16148 ,  H01L2224/2919 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/9202 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06541 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2224/11 ,  H01L2224/81 ,  H01L2924/014 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2924/00012 ,  H01L2924/0665 ,  H01L2224/05552 ,  H01L2924/00

Abstract: A multi-chip package includes a first semiconductor chip and a second semiconductor chip. The first semiconductor chip has a first active surface. The second semiconductor chip has a second active surface facing the first active surface. The second active surface is electrically connected with the first active surfaceand the first active surface of the first semiconductor chip and the second active surface of the second semiconductor chip are bonded to each other without an adhesive.

Abstract translation: 多芯片封装包括第一半导体芯片和第二半导体芯片。 第一半导体芯片具有第一有源表面。 第二半导体芯片具有面向第一有源表面的第二有源表面。 第二有源表面与第一有源表面电连接，第一半导体芯片的第一有源表面和第二半导体芯片的第二有源表面彼此结合，而无需粘合剂。