公开(公告)号：US20240175629A1

公开(公告)日：2024-05-30

申请号：US18334011

申请日：2023-06-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： SANGJINE PARK ,  Ji Hwan PARK ,  KUNTACK LEE

IPC: F26B5/00 ,  F26B25/16

CPC classification number: F26B5/005 ,  F26B25/16

Abstract: Disclosed are substrate processing baffles, substrate processing apparatuses, and substrate processing apparatus fabrication methods. The substrate processing baffle comprises a plate body having a central axis that extends in a first direction, and an upper body on the plate body. The upper body includes an upper flow path connected to a top surface of the upper body. The plate body includes a lower flow path connected to the upper flow path and a bottom surface of the plate body, and a coupling hole extending through a top surface of the plate body. The coupling hole includes a placement hole. The placement hole includes a position setting aperture whose width decreases with decreasing distance from the top surface of the plate body.

公开(公告)号：US20250014915A1

公开(公告)日：2025-01-09

申请号：US18390182

申请日：2023-12-20

Applicant: Samsung Electronics Co., Ltd.

Inventor： SANGJINE PARK ,  Ji Hwan PARK ,  KUNTACK LEE

IPC: H01L21/67 ,  G03F7/16 ,  H01L21/66

Abstract: Disclosed are substrate processing systems and substrate processing methods. The substrate processing method comprises performing an exposure process on a substrate, removing moisture on the substrate after the exposure process, performing a wetting process on the substrate from which the moisture is removed, and performing a drying process on the substrate after the wetting process. The step of removing the moisture on the substrate includes measuring a weight of the substrate and heating the substrate whose weight is measured. The step of performing the drying process on the substrate includes placing the substrate into a dry chamber and supplying the dry chamber with a supercritical fluid to dry a fluid on the substrate.

公开(公告)号：US20240173751A1

公开(公告)日：2024-05-30

申请号：US18336217

申请日：2023-06-16

Applicant: Samsung Electronics Co., Ltd.

Inventor： SANGJINE PARK ,  Ji Hwan PARK ,  KUNTACK LEE

IPC: B08B3/02 ,  B08B3/08 ,  F26B5/00 ,  G03F7/38 ,  H01L21/02

CPC classification number: B08B3/022 ,  B08B3/08 ,  F26B5/005 ,  G03F7/38 ,  H01L21/02057 ,  G03F7/0042

Abstract: A method of processing a substrate includes wetting a substrate, supplying a supercritical fluid onto the wetted substrate to dry the substrate, and cleaning the dried substrate. The cleaning of the substrate includes supplying a cleaning solution onto a top surface of the substrate, and supplying a cleaning solution onto a bottom surface of the substrate.

公开(公告)号：US20240069451A1

公开(公告)日：2024-02-29

申请号：US18130001

申请日：2023-04-03

Applicant: Samsung Electronics Co., Ltd.

Inventor： SANGJINE PARK ,  Ji Hwan PARK ,  KUNTACK LEE

IPC: G03F7/00 ,  G03F7/16

CPC classification number: G03F7/70808 ,  G03F7/168

Abstract: Disclosed are supercritical fluid supply apparatuses, substrate processing apparatuses, and substrate processing methods. The substrate processing apparatus comprises a dry chamber including a dry space configured in which to dispose a substrate, and a supercritical fluid supply apparatus configured to supply the dry chamber with a supercritical fluid. The supercritical fluid supply apparatus includes a fluid supply tank, a high-temperature fluid tank configured in which to store a fluid supplied from the fluid supply tank at a first temperature, and a low-temperature fluid tank configured in which to store a fluid supplied from the fluid supply tank at a second temperature different from the first temperature. The high-temperature fluid tank and the low-temperature fluid tank are connected in parallel between the fluid supply tank and the dry chamber.

公开(公告)号：US20160104629A1

公开(公告)日：2016-04-14

申请号：US14972505

申请日：2015-12-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： HONGJIN KIM ,  KYOUNGSEOB KIM ,  SUNGHO SHIN ,  KUNTACK LEE ,  KIHONG CHO

IPC: H01L21/306

CPC classification number: H01L21/30625 ,  B24C1/08 ,  H01L21/02021 ,  H01L21/02057 ,  H01L21/465 ,  H01L21/67219

Abstract: A substrate treating method may include jetting a fluid containing an abrasive onto a substrate, and polishing the substrate using the jetted fluid.

公开(公告)号：US20230400252A1

公开(公告)日：2023-12-14

申请号：US18095125

申请日：2023-01-10

Applicant: Samsung Electronics Co., Ltd.

Inventor： SANGJINE PARK ,  Ji Hwan PARK ,  KUNTACK LEE

IPC: F26B5/00 ,  F26B5/04

CPC classification number: F26B5/005 ,  F26B5/04 ,  H01L21/02057

Abstract: A method of processing a substrate includes disposing a substrate in a drying chamber, and supplying a fluid into the drying chamber in which the substrate is disposed. The supplying of the fluid into the drying chamber includes supplying a gas into the drying chamber, and supplying a supercritical fluid into the drying chamber after the supplying of the gas is started.

公开(公告)号：US20210362198A1

公开(公告)日：2021-11-25

申请号：US17081855

申请日：2020-10-27

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： YONGHEE LEE ,  BYOUNGHO KWON ,  KUNTACK LEE

IPC: B08B1/00 ,  B08B13/00 ,  B08B1/04 ,  B08B3/04 ,  A46B13/00 ,  A46B13/02

Abstract: A substrate-cleaning apparatus may include a tilting arm to which a roll brush and a motor are coupled, a support arm positioned on the tilting arm, a first spring and a second spring coupling the tilting arm to the support arm, a first air bag and a second air bag mounted between the tilting arm and the support arm, and a controller configured to adjust an internal pressure of each of the first air bag and the second air bag. The controller may adjust a difference in internal pressure between the first air bag and the second air bag to control the inclination of the roll brush, and may adjust the internal pressure of each of the first air bag and the second air bag to move the roll brush vertically.

公开(公告)号：US20210210342A1

公开(公告)日：2021-07-08

申请号：US16925532

申请日：2020-07-10

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： JUNYEONG LEE ,  MINKYU PARK ,  INSUN YI ,  BEOMSEOK KIM ,  YOUNGSEOK KIM ,  KUNTACK LEE

IPC: H01L21/02 ,  H01L29/66 ,  H01L27/108 ,  H01L27/115 ,  H01J37/32 ,  C23C16/511 ,  C23C16/46 ,  C23C16/40

Abstract: A thin film formation apparatus includes a chamber, a platen disposed within the chamber, a heater configured to heat the platen within the chamber, a gas inlet communicating with an interior of the chamber and configured to supply a reducing gas and inert gas to the interior of the chamber, a target disposed within the chamber and spatially separated from the platen, and a microwave plasma source disposed adjacent to the target. The reducing gas includes at least one of hydrogen (H2) and deuterium (D2)

公开(公告)号：US20240280906A1

公开(公告)日：2024-08-22

申请号：US18244974

申请日：2023-09-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： SANGJINE PARK ,  Ji Hwan PARK ,  KUNTACK LEE

IPC: G03F7/16 ,  H01L21/67

CPC classification number: G03F7/168 ,  H01L21/67034

Abstract: Disclosed are substrate processing baffle, substrate processing apparatuses, and substrate processing methods. The substrate processing baffle comprises a plate body having a central axis extending in a first direction, an upper body on the plate body, and partition members extending in a second direction intersecting the first direction. The plate body includes a fine passage that connects a top surface of the plate body to a bottom surface of the plate body, and a coupling hole downwardly recessed from the top surface of the plate body. The partition members are spaced apart from each other in a third direction that intersects each of the first direction and the second direction. The partition members are lower than the coupling hole.

公开(公告)号：US20230046060A1

公开(公告)日：2023-02-16

申请号：US17706336

申请日：2022-03-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： SANGJINE PARK ,  SEUNGMIN SHIN ,  JIHOON JEONG ,  YOUNG-HOO KIM ,  KUNTACK LEE

IPC: G03F7/30 ,  H01L21/687 ,  H01L21/68 ,  H02J7/00 ,  H02J50/20 ,  H01M10/46 ,  H01M10/44

Abstract: A substrate rotating apparatus may include a spin chuck supporting a substrate and a stage rotating the spin chuck about an axis parallel to a first direction. The spin chuck may include a first magnetic element and a substrate supporting member thereon. The stage may include a stage housing, a rotating part rotating about the axis, an inner control unit controlling rotation of the rotating part, a power supplying part supplying a power to the rotating part, and a wireless communication part receiving a control signal from an outside and transmitting the control signal to the inner control unit. The rotating part may include a second magnetic element spaced apart from the first magnetic element and a rotation driver rotating the second magnetic element. The rotating part, the inner control unit, the power supplying part, and the wireless communication part may be placed in the stage housing.