公开(公告)号：US20160104629A1

公开(公告)日：2016-04-14

申请号：US14972505

申请日：2015-12-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： HONGJIN KIM ,  KYOUNGSEOB KIM ,  SUNGHO SHIN ,  KUNTACK LEE ,  KIHONG CHO

IPC: H01L21/306

CPC classification number: H01L21/30625 ,  B24C1/08 ,  H01L21/02021 ,  H01L21/02057 ,  H01L21/465 ,  H01L21/67219

Abstract: A substrate treating method may include jetting a fluid containing an abrasive onto a substrate, and polishing the substrate using the jetted fluid.