METHOD OF IP2 CALIBRATION FOR WIRELESS TRANSCEIVER AND DEVICE FOR PERFORMING IP2 CALIBRATION

    公开(公告)号:US20250167973A1

    公开(公告)日:2025-05-22

    申请号:US18927234

    申请日:2024-10-25

    Abstract: A device configured to perform second order intercept point (IP2) calibration for a wireless transceiver includes a memory storing instructions, an interface, and at least one processor communicatively coupled to the interface and to the memory. The interface is configured to receive, from the wireless transceiver, a signal including second order intermodulation distortion (IMD2), and transmit, to the wireless transceiver, an in-phase correction code (I-correction code) and a quadrature-phase correction code (Q-correction code). The at least one processor is configured to execute the instructions to analyze a level of the IMD2 based on a plurality of heterogeneous methods, and adjust at least one of the I-correction code or the Q-correction code based on analysis results.

    ELECTRONIC DEVICE WITH TOUCH INPUT SENSITIVITY AND OPERATING METHOD THEREOF

    公开(公告)号:US20250165103A1

    公开(公告)日:2025-05-22

    申请号:US19028359

    申请日:2025-01-17

    Abstract: An electronic device includes one or more processors, a memory storing instructions, and a user interface including at least one touch button, a capacitor coupled with the at least one touch button, and a switch configured to charge the capacitor and to discharge the capacitor. The instructions, when executed by the one or more processors individually or collectively, cause the electronic device to spread an operating frequency into a plurality of spread frequencies within a frequency range, determine, based on the plurality of spread frequencies, whether to at least one of charge the capacitor or discharge the capacitor by controlling the switch to at least one of turn on or turn off, measure a charging time of the capacitor, according to the controlling of the switch, and determine whether a touch input on the at least one touch button occurs, based on the measured charging time.

    METHOD FOR PROVIDING ROUTE INFORMATION AND APPARATUS THEREFOR

    公开(公告)号:US20210033413A1

    公开(公告)日:2021-02-04

    申请号:US16966633

    申请日:2019-01-31

    Abstract: The disclosure relates to a method and apparatus for providing route information, The method of providing the route information, the method being performed by a base station, according to an embodiment of the disclosure, may include obtaining information about a route between a location of a user and a destination requested by the user, receiving metadata representing at least one of a geographical feature and an object within a preset coverage from a connectivity node, determining a final route to the destination based on the obtained information about the route and the received metadata, and transmitting information about the determined final route to a terminal of the user.

    METHOD FOR PROVIDING CONTENT AND ELECTRONIC DEVICE SUPPORTING THE SAME

    公开(公告)号:US20190341042A1

    公开(公告)日:2019-11-07

    申请号:US16383968

    申请日:2019-04-15

    Abstract: An electronic device and a computer program product are provided herein. The electronic device includes: an audio module, a communication module, a microphone, a memory storing programming instructions, and a processor, which executes the program product, causing the electronic device to receive a voice command from a user via the microphone, request, upon receiving the voice command, situation information from a first external electronic device based on device information and the voice command, and after receiving the situation information, transmit the situation information to a second external electronic device via the communication module, and receiving content corresponding to the situation information from the second external electronic device and reproducing the received content

    SEMICONDUCTOR PACKAGES AND METHOD OF MANUFACTURING THE SAME

    公开(公告)号:US20230178470A1

    公开(公告)日:2023-06-08

    申请号:US18074007

    申请日:2022-12-02

    Inventor: Jiyoung LEE

    Abstract: A semiconductor package is provided. The semiconductor package includes a first redistribution layer, a first semiconductor chip disposed on the first redistribution layer, a molding layer disposed on the first redistribution layer to cover a side surface of the first semiconductor chip, a second redistribution layer disposed on the molding layer, and a connecting pillar disposed to penetrate the molding layer and configured to connect the first redistribution layer to the second redistribution layer, the connecting pillar including a lower area having a first width in a first direction parallel to an upper surface of the first semiconductor chip and an upper area integrally connected to the lower area and having a second width that is less than the first width in the first direction.

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