公开(公告)号：US10700110B2

公开(公告)日：2020-06-30

申请号：US16132757

申请日：2018-09-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Hyun Lim ,  Yoon Seok Seo ,  Kyung Moon Jung ,  Eun Jin Kim

IPC: H01L31/0203 ,  H01L27/146 ,  H01L31/0232

Abstract: A fan-out sensor package includes: a substrate in which a through-hole is formed and portions of a wiring layer are exposed from an insulating layer; an image sensor having an active surface having a sensing region disposed below the through-hole of the substrate and connection pads disposed in the vicinity of the sensing region; an optical member disposed on the active surface of the image sensor; a dam member disposed in the vicinity of the sensing region; and an encapsulant encapsulating the substrate and the image sensor, wherein the third wiring layer and the connection pads are electrically connected to each other by connection members.

公开(公告)号：US20170172536A1

公开(公告)日：2017-06-22

申请号：US15389370

申请日：2016-12-22

Applicant: Samsung Electronics Co., Ltd

Inventor： Sang Ha Song ,  Jae Hyun Lim

IPC: A61B6/00

CPC classification number: A61B6/587 ,  A61B6/06 ,  A61B6/4283 ,  A61B6/4405 ,  A61B6/4417 ,  A61B6/4464 ,  A61B6/461 ,  A61B6/547 ,  A61B6/548 ,  A61B6/583 ,  A61B6/588

Abstract: Disclosed herein are an X-ray imaging apparatus for photographing a marker provided in an X-ray detector with a camera to acquire information about the distance between the X-ray detector and an X-ray source or information about the pose of the X-ray detector at low cost The X-ray imaging apparatus may include an X-ray source that generates X-rays and irradiates the X-rays. A photographing device installed in the X-ray source photographs a marker image. A controller outputs, when a marker of a plurality of markers constituting a multi-marker array formed in a surface of an X-ray detector is not detected from the marker image, a notice informing that no marker is detected. The controller detects a single marker from another marker image photographed after the notice informing that the marker is not detected is outputted.

公开(公告)号：US10790239B2

公开(公告)日：2020-09-29

申请号：US16207053

申请日：2018-11-30

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Hyun Lim ,  Chul Kyu Kim ,  Kyung Moon Jung ,  Han Kim ,  Yoon Seok Seo

IPC: H01L23/552 ,  H01L23/31 ,  H01L23/367 ,  H01L23/538 ,  H01L23/00 ,  H01L21/48 ,  H01L21/56

Abstract: A semiconductor package includes a semiconductor chip having an active surface on which connection pads are disposed and an inactive surface opposing the active surface, an encapsulant disposed to cover at least a portion of the semiconductor chip, and a connection member including a redistribution layer. The redistribution layer includes a plurality of first pads, a plurality of second pads surrounding the plurality of first pads, and a plurality of third pads surrounding the plurality of second pads. Each of the plurality of second pads and each of the plurality of third pads have shapes different from a shape of each of the plurality of first pads. Gaps between the plurality of second pads and gaps between the plurality of third pads are staggered with each other.

公开(公告)号：US10607914B2

公开(公告)日：2020-03-31

申请号：US16110436

申请日：2018-08-23

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Hyun Lim ,  Han Kim ,  Yoon Seok Seo ,  Sang Jong Lee

IPC: H01L23/367 ,  H01L23/31 ,  H01L23/00 ,  H01L23/498 ,  H01L25/10

Abstract: A semiconductor package includes a first semiconductor package including a core member having a through-hole, a first semiconductor chip disposed in the through-hole and having an active surface with a connection pad disposed thereon, a first encapsulant for encapsulating at least a portion of the first semiconductor chip, and a connection member disposed on the active surface of the first semiconductor chip and including a redistribution layer electrically connected to the connection pad of the first semiconductor chip, a second semiconductor package disposed on the first semiconductor package and including a wiring substrate electrically connected to the connection member, at least one second semiconductor chip disposed on the wiring substrate, and a second encapsulant for encapsulating at least a portion of the second semiconductor chip, and a heat dissipation member covering a lateral surface of the second semiconductor package and exposing an upper surface of the second encapsulant.

公开(公告)号：US10998362B2

公开(公告)日：2021-05-04

申请号：US16915274

申请日：2020-06-29

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Hyun Lim ,  Yoon Seok Seo ,  Kyung Moon Jung ,  Eun Jin Kim

IPC: H01L27/146 ,  H01L31/0203 ,  H01L31/0232

Abstract: A fan-out sensor package includes: a substrate in which a through-hole is formed and portions of a wiring layer are exposed from an insulating layer; an image sensor having an active surface having a sensing region disposed below the through-hole of the substrate and connection pads disposed in the vicinity of the sensing region; an optical member disposed on the active surface of the image sensor; a dam member disposed in the vicinity of the sensing region; and an encapsulant encapsulating the substrate and the image sensor, wherein the third wiring layer and the connection pads are electrically connected to each other by connection members.

公开(公告)号：US10886192B2

公开(公告)日：2021-01-05

申请号：US16821305

申请日：2020-03-17

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jae Hyun Lim ,  Han Kim ,  Yoon Seok Seo ,  Sang Jong Lee

IPC: H01L23/367 ,  H01L23/498 ,  H01L23/31 ,  H01L25/10 ,  H01L23/00

Abstract: A semiconductor package includes a first semiconductor package including a core member having a through-hole, a first semiconductor chip disposed in the through-hole and having an active surface with a connection pad disposed thereon, a first encapsulant for encapsulating at least a portion of the first semiconductor chip, and a connection member disposed on the active surface of the first semiconductor chip and including a redistribution layer electrically connected to the connection pad of the first semiconductor chip, a second semiconductor package disposed on the first semiconductor package and including a wiring substrate electrically connected to the connection member, at least one second semiconductor chip disposed on the wiring substrate, and a second encapsulant for encapsulating at least a portion of the second semiconductor chip, and a heat dissipation member covering a lateral surface of the second semiconductor package and exposing an upper surface of the second encapsulant.

公开(公告)号：US10285664B2

公开(公告)日：2019-05-14

申请号：US15389370

申请日：2016-12-22

Applicant: Samsung Electronics Co., Ltd

Inventor： Sang Ha Song ,  Jae Hyun Lim

IPC: A61B6/00 ,  A61B6/06

Abstract: Disclosed herein are an X-ray imaging apparatus for photographing a marker provided in an X-ray detector with a camera to acquire information about the distance between the X-ray detector and an X-ray source or information about the pose of the X-ray detector at low cost The X-ray imaging apparatus may include an X-ray source that generates X-rays and irradiates the X-rays. A photographing device installed in the X-ray source photographs a marker image. A controller outputs, when a marker of a plurality of markers constituting a multi-marker array formed in a surface of an X-ray detector is not detected from the marker image, a notice informing that no marker is detected. The controller detects a single marker from another marker image photographed after the notice informing that the marker is not detected is outputted.