公开(公告)号：US20200002533A1

公开(公告)日：2020-01-02

申请号：US16481202

申请日：2018-03-22

Applicant: SABIC GLOBAL TECHNOLOGIES B.V.

Inventor： Mian DAI ,  Liang SHEN ,  Wei SHAN ,  Miao SHEN ,  Hariharan RAMALINGAM

IPC: C08L79/08 ,  C08L69/00 ,  C08L83/10 ,  C08G64/12 ,  C08G73/10 ,  C08K5/00

Abstract: A thermoplastic polymer composition including 10 to 99 wt % of a phthalimidine copolycarbonate having a glass transition temperature of greater than 150° C., preferably greater than 170° C., as measured using differential scanning calorimetry; 1 to 90 wt % of a poly(etherimide-siloxane) copolymer; and 0 to 10 wt % of an additive is provided.

公开(公告)号：US20190177519A1

公开(公告)日：2019-06-13

申请号：US16300991

申请日：2017-05-25

Applicant: SABIC Global Technologies B.V.

Inventor： Jian WANG ,  Shijie SONG ,  Zhenke WEI ,  Qin WANG ,  Mian DAI

IPC: C08L23/12 ,  C08L71/12 ,  C08L69/00 ,  C08K7/14 ,  C08L67/02 ,  C08L23/08 ,  C08L25/08

Abstract: A thermoplastic composition includes from about 50 wt. % to about 90 wt. % of a polymeric base resin and from about 10 wt. % to about 50 wt. % of a low dielectric constant (Dk)/low dissipation factor (Df) glass fiber component. The low Dk/low Df glass fiber component has a Dk of less than about 5.0 at a frequency of from 1 MHz to 1 GHz and a Df of less than about 0.002 at a frequency of from 1 MHz to 1 GHz. In certain aspects the thermoplastic composition has a Dk that is at least about 0.1 lower than a substantially identical reference composition that does not include the low Dk/low Df glass fiber component.