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公开(公告)号：US10511268B2
公开(公告)日：2019-12-17
申请号：US15636626
申请日：2017-06-28
Applicant: QUALCOMM Incorporated
Inventor： Daeik Daniel Kim , Manuel Aldrete , Bonhoon Koo
Abstract: An exemplary improved ground for a power amplifier circuit may include structural separation of the drive amplifier and the power amplifier grounds and cut-off of the power amplifier induced feedback current to ensure stability under a wide-range of operating conditions. The exemplary power amplifier may include a first ground coupled to a first amplifier circuit, a second ground coupled to a second amplifier circuit separate from the first ground, and the first amplifier circuit generates a drive current for the second amplifier circuit.
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公开(公告)号：US11817239B2
公开(公告)日：2023-11-14
申请号：US16210594
申请日：2018-12-05
Applicant: QUALCOMM Incorporated
Inventor： Daniel Daeik Kim , Bonhoon Koo , Babak Nejati
CPC classification number: H01F17/0013 , H01F27/363 , H01F41/041 , H04B1/40 , H01F27/36 , H01F2017/002 , H01F2017/008 , H04B1/04
Abstract: A vertical inductor structure includes a first laminate substrate forming a first portion of the vertical inductor structure and a second laminate substrate forming a second portion. Each laminate substrate includes a plurality of first traces embedded in a layer of the laminate substrate, a plurality of first vertical columns, and a plurality of second vertical columns. Each first vertical columns is coupled to a first end of a respective first trace, and each second vertical column is coupled to a second end of a respective first trace. The second laminate substrate is mounted on the first laminate substrate such that each first vertical column of the first laminate substrate is coupled to a respective first vertical column of the second laminate substrate, and each second vertical column of the first laminate substrate is coupled to a respective second vertical column of the second laminate substrate.
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Patent Agency Ranking
公开(公告)号：US10431511B2
公开(公告)日：2019-10-01
申请号：US15584000
申请日：2017-05-01
Applicant: QUALCOMM Incorporated
Inventor： Daeik Daniel Kim , Shu Zhang , Bonhoon Koo , Manuel Aldrete , Jie Fu , Chin-Kwan Kim , Babak Nejati , Husnu Ahmet Masaracioglu
IPC: H01L23/12 , H01L23/66 , H01L23/498 , H01L23/552
Abstract: In exemplary aspects of the disclosure, magnetic coupling problems in a power amplifier/antenna circuit may be address by using a self-shielded RF inductor mounted over the PA output match inductor embedded in the substrate to offer full RF isolation of both PA output match inductors (self-shielded and embedded) or using a self-shielded RF inductor mounted over the PA output match inductor embedded in the substrate along with a component level conformal shield around the self-shielded inductor on the assembly structure.
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公开(公告)号：US11011461B2
公开(公告)日：2021-05-18
申请号：US16254735
申请日：2019-01-23
Applicant: QUALCOMM Incorporated
Inventor： Shu Zhang , Daniel Daeik Kim , Chenqian Gan , Bonhoon Koo , Babak Nejati
IPC: H01L23/522 , H01L49/02 , H01F27/28 , H01F41/04 , H01L23/64 , H01F17/02 , H01F17/00 , H01L23/498
Abstract: Some features pertain to a substrate, and a first inductor integrated into the substrate. The first inductor includes a plurality of first inductor windings in a first metal layer and a second metal layer. A second inductor is integrated into the substrate. The second inductor includes a first spiral in a third metal layer. The first spiral is located at least partially inside the plurality of first inductor windings, wherein the second inductor is perpendicular to the first inductor.
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公开(公告)号：US20190189327A1
公开(公告)日：2019-06-20
申请号：US16210594
申请日：2018-12-05
Applicant: QUALCOMM Incorporated
Inventor： Daniel Daeik Kim , Bonhoon Koo , Babak Nejati
CPC classification number: H01F17/0013 , H01F27/365 , H01F41/041 , H01F2017/002 , H01F2017/008 , H04B1/40
Abstract: A vertical inductor structure includes a first laminate substrate forming a first portion of the vertical inductor structure and a second laminate substrate forming a second portion. Each laminate substrate includes a plurality of first traces embedded in a layer of the laminate substrate, a plurality of first vertical columns, and a plurality of second vertical columns. Each first vertical columns is coupled to a first end of a respective first trace, and each second vertical column is coupled to a second end of a respective first trace. The second laminate substrate is mounted on the first laminate substrate such that each first vertical column of the first laminate substrate is coupled to a respective first vertical column of the second laminate substrate, and each second vertical column of the first laminate substrate is coupled to a respective second vertical column of the second laminate substrate.
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公开(公告)号：US11380471B2
公开(公告)日：2022-07-05
申请号：US16034653
申请日：2018-07-13
Applicant: QUALCOMM Incorporated
Inventor： Daniel Daeik Kim , Bonhoon Koo , Babak Nejati
Abstract: A spiral inductor includes a spiral trace and a plurality of first projections extending along a first edge of the spiral trace. The spiral inductor may further include a plurality of second projections extending along a second edge of the spiral trace, the second edge being opposite the first edge.
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公开(公告)号：US10832848B2
公开(公告)日：2020-11-10
申请号：US15722446
申请日：2017-10-02
Applicant: QUALCOMM Incorporated
Inventor： Daeik Daniel Kim , Bonhoon Koo , Babak Nejati
Abstract: A multi-layer spiral inductive array includes a first multi-layer spiral inductor with a second layer matching a spiral pattern of a first layer. The multi-layer spiral inductive array also includes a second multi-layer spiral inductor with a third layer matching a spiral pattern of a fourth layer. The second multi-layer spiral inductor is coupled in series with the first multi-layer spiral inductor.
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