公开(公告)号：US11011461B2

公开(公告)日：2021-05-18

申请号：US16254735

申请日：2019-01-23

Applicant: QUALCOMM Incorporated

Inventor： Shu Zhang ,  Daniel Daeik Kim ,  Chenqian Gan ,  Bonhoon Koo ,  Babak Nejati

IPC: H01L23/522 ,  H01L49/02 ,  H01F27/28 ,  H01F41/04 ,  H01L23/64 ,  H01F17/02 ,  H01F17/00 ,  H01L23/498

Abstract: Some features pertain to a substrate, and a first inductor integrated into the substrate. The first inductor includes a plurality of first inductor windings in a first metal layer and a second metal layer. A second inductor is integrated into the substrate. The second inductor includes a first spiral in a third metal layer. The first spiral is located at least partially inside the plurality of first inductor windings, wherein the second inductor is perpendicular to the first inductor.

公开(公告)号：US10431511B2

公开(公告)日：2019-10-01

申请号：US15584000

申请日：2017-05-01

Applicant: QUALCOMM Incorporated

Inventor： Daeik Daniel Kim ,  Shu Zhang ,  Bonhoon Koo ,  Manuel Aldrete ,  Jie Fu ,  Chin-Kwan Kim ,  Babak Nejati ,  Husnu Ahmet Masaracioglu

IPC: H01L23/12 ,  H01L23/66 ,  H01L23/498 ,  H01L23/552

Abstract: In exemplary aspects of the disclosure, magnetic coupling problems in a power amplifier/antenna circuit may be address by using a self-shielded RF inductor mounted over the PA output match inductor embedded in the substrate to offer full RF isolation of both PA output match inductors (self-shielded and embedded) or using a self-shielded RF inductor mounted over the PA output match inductor embedded in the substrate along with a component level conformal shield around the self-shielded inductor on the assembly structure.