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公开(公告)号：US20220167497A1
公开(公告)日：2022-05-26
申请号：US17440453
申请日：2020-03-26
Inventor： Tomohiro FUKAO , Tomoaki SAWADA , Takatoshi ABE , Kyosuke MICHIGAMI , Makoto TAKASHIRO , Susumu FUKUSHIMA , Daisuke HONDA
Abstract: Provided is a stretchable circuit board including a stretchable insulating layer, and a wiring, in which the wiring is formed of a combination of a metal wiring portion that forms a main portion of the wiring, and a conductive stretchable portion disposed ancillary to the metal wiring portion.
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公开(公告)号：US20160152016A1
公开(公告)日：2016-06-02
申请号：US14925048
申请日：2015-10-28
Inventor： Takatoshi ABE , Tomoaki SAWADA , Shingo YOSHIOKA
CPC classification number: B32B27/36 , B32B3/08 , B32B3/30 , B32B7/045 , B32B27/08 , B32B27/20 , B32B27/38 , B32B2305/77 , B32B2307/202 , B32B2307/21 , B32B2307/50 , B32B2307/51 , B32B2307/546 , B32B2307/552 , B32B2307/734 , B32B2457/00 , B32B2457/20 , B32B2571/00 , C08G59/245 , C08G59/56 , C08L63/00 , C08L71/02 , C08L87/00
Abstract: Provided is a structural member for electronic devices which uses a material that is flexible and has excellent restoration properties after extension and stress relaxation properties. The structural member for electronic devices has the following properties A and B: (Property A) In a case where predetermined deformation is applied, stress that applies the deformation is relaxed (reduced) with time: and (Property B) In a case where the stress that applies deformation is 0, the deformation rarely remains while a resin composition is recovered. That is, when stress is 0, residual strain substantially becomes 0 (specifically 3% or lower).
Abstract translation: 本发明提供一种电子器件的结构构件，其使用柔性材料并且在延伸和应力松弛性能之后具有优异的恢复性能。 电子装置用结构体具有以下性质A，B :(属性A）在施加规定的变形的情况下，施加变形的应力随着时间而放宽（减少）：（性能B）在 施加变形的应力为0，在回收树脂组合物时，变形很少残留。 也就是说，当应力为0时，残余应变基本上变为0（具体为3％以下）。
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公开(公告)号：US20240425642A1
公开(公告)日：2024-12-26
申请号：US18819667
申请日：2024-08-29
Inventor： Tomohiro FUKAO , Tomoaki SAWADA , Takatoshi ABE
Abstract: An aspect of the present invention relates to a stretchable resin composition containing an epoxy resin and a curing agent, in which the epoxy resin has a weight average molecular weight of 50,000 or more and 3,000,000 or less and a polydispersity of average molecular weights (Mw/Mn) that satisfies the following Formula (1): 1.1≤Mw/Mn≤3.0(1) (wherein, Mn represents a number average molecular weight and Mw represents a weight average molecular weight), the curing agent is a crystalline compound, and a glass transition temperature of a cured product of the stretchable resin composition is 60° C. or less.
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公开(公告)号：US20220208411A1
公开(公告)日：2022-06-30
申请号：US17556119
申请日：2021-12-20
Inventor： Tomohiro FUKAO , Tomoaki SAWADA , Takatoshi ABE , Kyosuke MICHIGAMI
Abstract: An aspect of the present invention relates to a conductive resin composition containing an epoxy resin, a curing agent, and a conductive powder, in which a loss modulus of a dried product or semi-cured product of the conductive resin composition at 170° C. is 0.1 MPa or more and 15 MPa or less.
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公开(公告)号：US20220201850A1
公开(公告)日：2022-06-23
申请号：US17603781
申请日：2020-04-16
Inventor： Takatoshi ABE , Tomohiro FUKAO , Tomoaki SAWADA , Kyosuke MICHIGAMI
Abstract: A stretchable laminate to be fixed to a fabric includes a stretchable circuit board including a stretchable insulating layer having an elongation rate of 10% or more, a fabric base material, and an adhesive layer that bonds the stretchable circuit board and the fabric base material together.
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Patent Agency Ranking
公开(公告)号：US20220183154A1
公开(公告)日：2022-06-09
申请号：US17441492
申请日：2020-03-26
Inventor： Tomohiro FUKAO , Tomoaki SAWADA , Takatoshi ABE , Kyosuke MICHIGAMI
IPC: H05K1/03
Abstract: A fiber sheet includes: a resin layer containing a thermosetting resin; and a fiber layer, wherein the fiber sheet is stretchable by 1% or more, and an initial tensile elastic modulus of the fiber sheet is 1 MPa or more and 1 GPa or less.
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公开(公告)号：US20180061519A1
公开(公告)日：2018-03-01
申请号：US15692492
申请日：2017-08-31
Inventor： Takatoshi ABE , Tomoaki SAWADA
CPC classification number: H01B1/125 , C08F12/08 , C08F20/14 , C08F20/44 , C08F2500/01 , C08K3/08 , C08K9/06 , C08K2003/0806 , C08K2201/001 , C08L33/14
Abstract: The present invention relates to a conductive resin composition comprising, as essential components, a resin (A), a curing agent (B) reacting with the resin (A), and a conductive filler (C), wherein the resin (A) has a functional group, a functional group equivalent of 400 g/eq or more and 10,000 g/eq or less, a Tg (glass transition temperature) or a softening point of 40° C. or less, or an elastic modulus of less than 1.0 GPa at 30° C., and wherein the conductive filler (C) is made of a conductive material having a volume specific resistivity of 1×10−4 Ω·cm or less at room temperature.
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公开(公告)号：US20220175057A1
公开(公告)日：2022-06-09
申请号：US17603765
申请日：2020-04-16
Inventor： Takatoshi ABE , Tomohiro FUKAO , Tomoaki SAWADA , Susumu FUKUSHIMA
Abstract: A circuit mounted article to be fixed to a fabric is provided and includes a circuit board having flexibility, an electronic component mounted on a fabric facing face side, which faces the fabric, of the circuit board, and further a reinforcing portion to be used for fixing of the circuit mounted article to the fabric on the fabric facing face side of the circuit board.
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公开(公告)号：US20210301137A1
公开(公告)日：2021-09-30
申请号：US16625316
申请日：2018-06-29
Inventor： Takatoshi ABE , Tomoaki SAWADA
IPC: C08L87/00
Abstract: The present invention relates, in one aspect, to a thermosetting resin composition including an epoxy resin, an isocyanate resin, a polyrotaxane resin, and a curing agent, wherein the isocyanate resin includes a hexamethylene skeleton and at least one selected from a biuret skeleton, an isocyanurate skeleton, an allophanate skeleton, a neopentyl skeleton, a butylene skeleton, and a dicarboxyl skeleton in a structure thereof.
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公开(公告)号：US20210161004A1
公开(公告)日：2021-05-27
申请号：US16643764
申请日：2018-09-03
Inventor： Takatoshi ABE , Tomoaki SAWADA , Tomohiro FUKAO
Abstract: The present application relates to a circuit board for use in electronic components. Specifically, the present application relates to a stretchable circuit board including a stretchable base material, a stretchable wiring, and a land part that is in contact with the stretchable base material.
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