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    STRETCHABLE FLEXIBLE SUBSTRATE INCLUDING FIRST INSULATING LAYER, SECOND INSULATING LAYER, FIRST METAL LAYER, AND SECOND METAL LAYER
    1.
    发明申请
    STRETCHABLE FLEXIBLE SUBSTRATE INCLUDING FIRST INSULATING LAYER, SECOND INSULATING LAYER, FIRST METAL LAYER, AND SECOND METAL LAYER 有权
    包括第一绝缘层，第二绝缘层，第一金属层和第二金属层的可拉伸柔性基板

    公开(公告)号：US20160353567A1

    公开(公告)日：2016-12-01

    申请号：US15158591

    申请日：2016-05-19

    Applicant: Panasonic Intellectual Property Management Co., Ltd.

    Inventor： TAKASHI ICHIRYU ,  KOJI KAWAKITA ,  MASANORI NOMURA ,  YOSHIHIRO TOMITA

    IPC: H05K1/02 ,  H05K1/18

    CPC classification number: H05K1/0283 ,  H05K1/185 ,  H05K2201/10151

    Abstract: A stretchable flexible substrate according to one aspect of the present disclosure includes: an electronic component; a first insulating layer located around the electronic component and having first and second main surfaces facing each other; a first metal layer that is in contact with the first main surface; a second metal layer that is in contact with the second main surface and electrically connected to the electronic component; and a second insulating layer that seals the electronic component, first insulating layer, and second metal layer, in plan view, a curved wiring portion extending from a central portion made up of at least the electronic component, portions of the first insulating layer and first and second metal layers, the curved wiring portion being made up of at least other portions of the first insulating layer, first and second metal layers, and the curved wiring portion being curved at least partially.

    Abstract translation: 根据本公开的一个方面的可拉伸柔性基板包括：电子部件; 位于所述电子部件周围的具有彼此面对的第一和第二主表面的第一绝缘层; 与第一主表面接触的第一金属层; 第二金属层，其与所述第二主表面接触并电连接到所述电子部件; 以及在平面图中密封电子部件，第一绝缘层和第二金属层的第二绝缘层，从由至少电子部件构成的中心部分延伸的弯曲布线部分，第一绝缘层的第一绝缘层和第一绝缘层的第一绝缘层 和第二金属层，所述弯曲布线部分由所述第一绝缘层，第一和第二金属层的至少其他部分构成，并且所述弯曲布线部分至少部分地弯曲。

    CONTROL SYSTEM AND CONTROL METHOD FOR DUAL-GATE BIDIRECTIONAL SWITCH
    3.
    发明公开
    CONTROL SYSTEM AND CONTROL METHOD FOR DUAL-GATE BIDIRECTIONAL SWITCH 审中-公开

    公开(公告)号：US20230231018A1

    公开(公告)日：2023-07-20

    申请号：US18001864

    申请日：2021-04-13

    Applicant: Panasonic Intellectual Property Management Co., Ltd.

    Inventor： YUSUKE KINOSHITA ,  MASANORI NOMURA ,  SATOSHI NAKAZAWA

    IPC: H01L29/20 ,  H01L29/778

    CPC classification number: H01L29/2003 ,  H01L29/7787

    Abstract: Current collapse of a normally-on type dual-gate bidirectional switch is suppressed. Dual-gate bidirectional switch includes first gate, first source, second gate, and second source. Control system includes first gate drive circuit, second gate drive circuit, and controller. Controller controls first gate drive circuit and second gate drive circuit. At the time of turning on dual-gate bidirectional switch and when the potential of first source is lower than the potential of second source, controller applies a first positive voltage for a first period between first gate and first source from first gate drive circuit, and applies a voltage smaller than the first positive voltage after the first period has elapsed.

    ELECTRONIC PART PACKAGE
    4.
    发明申请
    ELECTRONIC PART PACKAGE 有权
    电子零件包装

    公开(公告)号：US20150364661A1

    公开(公告)日：2015-12-17

    申请号：US14730200

    申请日：2015-06-03

    Applicant: Panasonic Intellectual Property Management Co., Ltd.

    Inventor： SUSUMU SAWADA ,  YOSHIHIRO TOMITA ,  KOJI KAWAKITA ,  MASANORI NOMURA

    IPC: H01L33/54 ,  H01L33/62 ,  H01L33/60

    CPC classification number: H01L33/54 ,  H01L21/568 ,  H01L24/19 ,  H01L24/96 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/04105 ,  H01L2224/16227 ,  H01L2224/18 ,  H01L2924/1815

    Abstract: An electronic part package comprises a sealing resin layer, an electronic part and a metal plating pattern layer. The sealing resin layer is provided with a principal surface including a first region that has a bellows-like shape having alternate ridges and valleys and a second region that is flat. The electronic part includes an electrode having a principal surface and is covered by the sealing resin layer except the principal surface, which is surrounded by the second region. The metal plating pattern layer is integrally provided on the first and second regions and on the principal surface of the electrode. A portion of the metal plating pattern layer, the portion located on the first region, has a bellows-like shape having alternate ridges and valleys along an outline of the first region.

    Abstract translation: 电子部件包装包括密封树脂层，电子部件和金属电镀图案层。 密封树脂层设置有主表面，该主表面包括具有交替的脊和谷的波纹管状的第一区域和平坦的第二区域。 电子部件包括具有主表面的电极，并被除了由第二区域包围的主表面之外的密封树脂层覆盖。 金属电镀图案层一体地设置在电极的第一和第二区域和主表面上。 金属电镀图案层的位于第一区域的部分的一部分具有沿着第一区域的轮廓具有交替的脊和谷的波纹管状形状。

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