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    CAMERA MODULE AND PHOTOSENSITIVE ASSEMBLY THEREOF, ELECTRONIC DEVICE, AND MANUFACTURING METHOD
    4.
    发明申请
    CAMERA MODULE AND PHOTOSENSITIVE ASSEMBLY THEREOF, ELECTRONIC DEVICE, AND MANUFACTURING METHOD 有权

    公开(公告)号：US20220294940A1

    公开(公告)日：2022-09-15

    申请号：US17607947

    申请日：2020-02-28

    Applicant: NINGBO SUNNY OPOTECH CO., LTD.

    Inventor： Mingzhu WANG ,  Takehiko TANAKA ,  Xiaodi LIU ,  Zhen HUANG ,  Zhenyu CHEN

    IPC: H04N5/225

    Abstract: A camera module and a photosensitive assembly thereof, an electronic device, and a manufacturing method are provided. The photosensitive assembly includes a photosensitive chip having a photosensitive area and an electric connection area located around the photosensitive area, at least one resistance-capacitance device, a conducting element, an expanded wiring layer, and a molded base. The expanded wiring layer has a top surface and a bottom surface. The at least one resistance-capacitance device is electrically connected to the bottom surface of the expanded wiring layer. The conducting element extends between the bottom surface of the expanded wiring layer and the electric connection area of the photosensitive chip, so as to electrically connect the photosensitive chip to the expanded wiring layer by means of the conducting element. A light hole is formed in the expanded wiring layer, and the light hole corresponds to at least the photosensitive area of the photosensitive chip. The molded base is integrally combined with the photosensitive chip, the at least one resistance-capacitance device, and the expanded wiring layer.

    CAMERA MODULE, AND PHOTOSENSITIVE ASSEMBLY AND MANUFACTURING METHOD THEREFOR
    5.
    发明申请
    CAMERA MODULE, AND PHOTOSENSITIVE ASSEMBLY AND MANUFACTURING METHOD THEREFOR 有权

    公开(公告)号：US20220278151A1

    公开(公告)日：2022-09-01

    申请号：US17631605

    申请日：2020-07-30

    Applicant: NINGBO SUNNY OPOTECH CO., LTD.

    Inventor： Zhongyu LUAN ,  Zhen HUANG ,  Li LIU ,  Kai CHEN

    IPC: H01L27/146 ,  H01L23/00

    Abstract: Disclosed in the present application are a camera module, and a photosensitive assembly and a manufacturing method therefor. The photosensitive assembly comprises a circuit board, a photosensitive chip electrically connected to the circuit board, and a shaping member provided on the circuit board. A lower surface of the photosensitive chip is attached to the shaping member to form an accommodating space with the shaping member and the circuit board. The accommodating space is configured so that the photosensitive chip is bent downward during a process of assembling the photosensitive assembly. In this way, the photosensitive chip is bent into a shape adapted to the actual focal plane during the assembly process, so as to improve the imaging quality.

    CIRCUIT BOARD ASSEMBLY, PHOTOSENSITIVE ASSEMBLY, CAMERA MODULE, AND PREPARATION METHODS FOR CIRCUIT BOARD ASSEMBLY AND PHOTOSENSITIVE ASSEMBLY
    10.
    发明申请
    CIRCUIT BOARD ASSEMBLY, PHOTOSENSITIVE ASSEMBLY, CAMERA MODULE, AND PREPARATION METHODS FOR CIRCUIT BOARD ASSEMBLY AND PHOTOSENSITIVE ASSEMBLY 有权

    公开(公告)号：US20220367556A1

    公开(公告)日：2022-11-17

    申请号：US17770744

    申请日：2020-10-21

    Applicant: NINGBO SUNNY OPOTECH CO., LTD.

    Inventor： Zhen HUANG ,  Zhongyu LUAN ,  Yinbo ZHANG ,  Fengsheng XI ,  Hongfeng GAN

    IPC: H01L27/146

    Abstract: The present application relates to a circuit board assembly, a photosensitive assembly, a camera module, and preparation methods for the circuit board assembly and the photosensitive assembly. The photosensitive assembly includes a circuit board and a photosensitive chip. The circuit board includes a circuit board main body, a through hole formed through the circuit board main body, a set of circuit board electrical connecting terminals disposed on the lower surface of the circuit board main body, a conducting medium disposed on the circuit board electrical connecting terminals, and a non-conducting adhesive covering the conducting medium. The photosensitive chip includes chip electrical connecting terminals disposed in a non-photosensitive area. The chip electrical connecting terminals of the photosensitive chip is in contact with the conducting medium to be electrically connected to the circuit board electrical connecting terminals, and the photosensitive chip is bonded to the lower surface of the circuit board via the non-conducting adhesive, so that the photosensitive chip is electrically connected to the circuit board. In this way, the photosensitive chip is stably electrically connected to the circuit board with relatively low costs and relatively low process difficulty.

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