-
公开(公告)号：US11428382B2
公开(公告)日：2022-08-30
申请号：US17185640
申请日：2021-02-25
申请人： NICHIA CORPORATION
发明人： Seiji Kiyota , Kazuma Kozuru , Eiichiro Okahisa
IPC分类号： F21V5/00 , F21V5/04 , G02B19/00 , G02B3/00 , H01S5/40 , H01S5/00 , H01S5/02216 , H01S5/02253 , H01S5/02255 , H01S5/02345
摘要： A light-emitting device includes: a substrate including a base and a side wall; a plurality of semiconductor laser elements disposed in a row direction and in a column direction on an upper surface of the base; a plurality of pairs of wires that penetrate the side wall in the row direction; and a lens array fixed to the substrate, the lens array comprising a plurality of lens sections disposed in the row direction and in the column direction above the plurality of semiconductor laser elements. Each laser beam that is emitted from the semiconductor laser elements and is incident on a light incident surface of the lens array has a beam shape with a greater width in the column direction than in the row direction.
-
公开(公告)号：US10608406B2
公开(公告)日：2020-03-31
申请号：US16203477
申请日：2018-11-28
申请人： NICHIA CORPORATION
发明人： Takuya Hashimoto , Eiichiro Okahisa
摘要： A light emitting device includes: a base including: a main body, and a frame disposed on an upper surface of the main body; one or more laser elements disposed on the upper surface of the main body inward of the frame; a cover comprising: a support member that is fixed on an upper surface of the frame and has an opening inside the frame, and a light transmissive portion disposed so as to close the opening; and a lens body disposed above the light transmissive portion. The support member includes; a first portion fixed on the upper surface of the frame, a second portion on which the lens body is disposed, the second portion being positioned inward of and lower than the first portion, and a third portion on which the light transmissive portion is disposed, the third portion being disposed inward of and lower than the second portion.
-
公开(公告)号：US10215362B2
公开(公告)日：2019-02-26
申请号：US14979832
申请日：2015-12-28
申请人： NICHIA CORPORATION
发明人： Seiji Nagahara , Eiichiro Okahisa
IPC分类号： F21K9/64 , F21V5/00 , F21V5/04 , F21Y103/10 , F21Y115/30
摘要： A light source apparatus includes two or more light sources placed in one direction, and an array lens having two or more lenses, which corresponds to each of the light sources. In order to condense a light emitted from each of the lenses into one position, in a first lens in each of the lenses, an optical axis of the light source which corresponds to the first lens is shifted from an optical axis of said first lens in said one direction. The first lens is formed such that a length from the optical axis to one end of said first lens in the one direction is longer than a length from the optical axis to another end of the first lens in a direction which is opposite to the one direction.
-
公开(公告)号：US09459520B2
公开(公告)日：2016-10-04
申请号：US14449085
申请日：2014-07-31
申请人： Nichia Corporation
IPC分类号： G03B21/20 , G02B27/10 , H04N9/31 , G03B33/08 , H01S5/022 , H01S5/40 , F21V8/00 , G02B26/00 , H01S5/00
CPC分类号： G03B21/204 , G02B6/0096 , G02B26/008 , G02B27/102 , G03B21/208 , G03B33/08 , H01S5/005 , H01S5/0071 , H01S5/02248 , H01S5/02276 , H01S5/4012 , H01S5/4018 , H01S5/4025 , H01S5/4056 , H04N9/3114 , H04N9/3158 , H04N9/3161
摘要： Provided is a light source unit that includes: one or more kinds of phosphor; a substrate, on which the one or more kinds of phosphor is applied; a plurality of semiconductor laser elements arrayed at a predetermined interval in a package, wherein each of the semiconductor laser elements emits a laser light beam through a light emission region; and a first optical system that comprises a first lens system, a multiplexing optical member having a light entering surface and a light exiting surface, and a second lens system, wherein the first optical system directs the laser light beams emitted from the respective semiconductor laser elements toward the substrate, the first lens system receives the laser light beams emitted from the respective semiconductor laser elements directly without substantial parallelization of the respective received laser light beams, and condenses the received laser light beams on the light entering surface of the multiplexing optical member, the multiplexing optical member multiplexes the laser light beams condensed by the first lens system, into a multiplexed laser light beam having a spatially-uniform intensity distribution, and the second lens system condenses the multiplexed laser light beam that has exited from the light exiting surface of the multiplexing optical member onto the one or more kinds of phosphor.
-
公开(公告)号：US09077138B2
公开(公告)日：2015-07-07
申请号：US13748194
申请日：2013-01-23
申请人： NICHIA CORPORATION
发明人： Eiichiro Okahisa
CPC分类号： H01S5/02236 , H01L2224/48091 , H01S5/02212 , H01S5/024 , H01S5/02469 , H01S5/02476 , H01S5/32341 , H01L2924/00014
摘要： A semiconductor laser device having stable heat dissipation property is provided. The semiconductor laser device includes a semiconductor laser element, a mounting body on which the semiconductor laser element is mounted, and a base body connected to the mounting body. The base body has a recess configured to engage with the mounting body and a through portion penetrating through a part of a bottom of the recess. In the specification, the remainder, which is a part of the bottom of the recess except for the through portion has a thickness equal or less than half of the largest thickness of the base body. The lowermost surface of the mounting body is spaced apart from the lowermost surface of the base body through the remainder.
摘要翻译： 提供具有稳定散热性能的半导体激光器件。 半导体激光装置包括半导体激光元件，安装有半导体激光元件的安装体以及与安装体连接的基体。 基体具有凹部，该凹部构造成与安装体接合并穿过贯穿凹部的底部的一部分的贯穿部。 在说明书中，作为除了贯通部以外的凹部的一部分的其余部分的厚度等于或小于基体的最大厚度的一半。 安装体的最下表面通过其余部分与基体的最下表面间隔开。
-
公开(公告)号：US11892155B2
公开(公告)日：2024-02-06
申请号：US18298784
申请日：2023-04-11
申请人： NICHIA CORPORATION
发明人： Seiji Kiyota , Kazuma Kozuru , Eiichiro Okahisa
IPC分类号： F21V5/00 , H01S5/00 , F21V5/04 , G02B19/00 , G02B3/00 , H01S5/40 , H01S5/02216 , H01S5/02253 , H01S5/02255 , H01S5/02345
CPC分类号： F21V5/007 , F21V5/04 , G02B3/0056 , G02B19/0057 , H01S5/0071 , H01S5/02216 , H01S5/02253 , H01S5/02255 , H01S5/405 , H01S5/4018 , H01S5/4025 , H01S5/02345
摘要： A light-emitting device includes: a substrate including a base and a side wall; a plurality of semiconductor laser elements arrayed in a first direction on an upper surface of the base; a sealing member fixed to the substrate, wherein the sealing member and the substrate define a sealed space in which the semiconductor laser element is located; and a lens array disposed above the sealing member, the lens array including a plurality of lens sections arrayed in the first direction. In the lens array, a maximum outer diameter of each lens sections is 1.25 times or more than an inter-vertex distance between adjacent ones of the lens sections in the first direction.
-
公开(公告)号：US11149917B2
公开(公告)日：2021-10-19
申请号：US16297415
申请日：2019-03-08
申请人： NICHIA CORPORATION
发明人： Seiji Kiyota , Kazuma Kozuru , Eiichiro Okahisa
IPC分类号： F21V5/00 , F21V5/04 , G02B19/00 , G02B3/00 , H01S5/40 , H01S5/00 , H01S5/02216 , H01S5/02253 , H01S5/02255 , H01S5/02345
摘要： A light-emitting device includes a substrate; a lens array having a plurality of lens sections in a matrix pattern; and a plurality of semiconductor laser elements disposed on the substrate. Each of the semiconductor laser elements emits a respective laser beam, each laser beam having a beam shape with a greater width in a column direction than in a row direction on a light incident surface of each respective lens section. The lens sections have an inter-vertex distance in the row direction that is smaller than both (i) a maximum outer diameter of each of the lens sections, and (ii) an inter-vertex distance in the column direction. A curvature of the lens sections in the row direction is the same as a curvature of the lens sections in the column direction.
-
公开(公告)号：US20210265808A1
公开(公告)日：2021-08-26
申请号：US17319678
申请日：2021-05-13
申请人： NICHIA CORPORATION
发明人： Shohei Itonaga , Eiichiro Okahisa
IPC分类号： H01S5/0237 , B41M3/00 , B23K1/00 , H01S5/02216
摘要： A semiconductor device includes: a package including: a lower surface, at least one first metal surface at an outer periphery of the lower surface, and at least one second metal surface at the lower surface at a location different from the at least one first metal surface; a mounting substrate disposed below the package and including: an upper surface, at least one first metal pattern disposed at the upper surface below the at least one first metal surface, and at least one second metal pattern disposed at the upper surface below the at least one second metal surface; a first bonding member containing a metal material and bonding the at least one first metal surface and the at least one first metal pattern; and a second bonding member containing a metal material and bonding the at least one second metal surface and the at least one second metal pattern.
-
公开(公告)号：US10535972B2
公开(公告)日：2020-01-14
申请号：US16055416
申请日：2018-08-06
摘要： An electronic component package includes: a metal plate; a metal wall that is disposed on the metal plate; a metal frame that is disposed on the metal plate so as to be opposed to the metal wall; a through hole that is formed in the metal wall; an opening hole that is formed in the metal frame so as to be opposed to the through hole; and a lead that is hermetically sealed with a sealing portion provided in the through hole, and that is inserted into the opening hole and the through hole. The metal frame includes: a side plate that is opposed to the metal wall; a bent portion that is connected to the side plate and has a round shape; and a welding portion that is connected to the bent portion and to which a lid member is to be bonded.
-
公开(公告)号：US10439358B2
公开(公告)日：2019-10-08
申请号：US15496846
申请日：2017-04-25
申请人： NICHIA CORPORATION
发明人： Soichiro Miura , Seiji Kiyota , Eiichiro Okahisa
摘要： A method of manufacturing a light-emitting device includes providing a base body including a base section; fixing a plurality of semiconductor laser elements on an upper surface of the base section; and fixing an optical member to the base body, the optical member including a plurality of lens sections, and a non-lens section disposed at a periphery of the plurality of lens sections in a top view. In the step of fixing the optical member: the optical member is arranged above the base body; (i) an inclination and a height of the optical member are adjusted after interposing an adhesive between the base body and the non-lens section, or (ii) an adhesive is interposed between the base body and the non-lens section after adjusting the inclination and the height of the optical member; and subsequently, the adhesive is cured to fix the optical member to the base body.
-
-
-
-
-
-
-
-
-
搜索结果
41 条记录 (耗时 0.016 秒)
