Electronic component
    3.
    发明授权
    Electronic component 有权
    电子元器件

    公开(公告)号:US09558886B2

    公开(公告)日:2017-01-31

    申请号:US14033958

    申请日:2013-09-23

    摘要: A laminate body includes a plurality of ceramic layers and capacitor conductors embedded in the laminate body so as to be opposed to each other via one of the ceramic layers. The capacitor conductors are made of an Al-based material, and the capacitor conductors include narrow portions, respectively, which function as fuse elements. The narrow portions have an average width smaller than an average width of portions of the capacitor conductors other than the narrow portions. As a result, the electronic component has an improved capability to protect its function as a capacitor when a short circuit occurs between capacitor conductors.

    摘要翻译: 层压体包括多个陶瓷层和电容器导体,该多个陶瓷层和电容器导体嵌入在层压体中,以便经由一个陶瓷层彼此相对。 电容器导体由Al基材料制成,并且电容器导体分别包括用作熔丝元件的窄部分。 窄部的平均宽度比除窄部以外的电容器导体的部分的平均宽度小。 结果,当电容器导体之间发生短路时,电子部件具有改进的保护其作为电容器的功能的能力。

    Multilayer ceramic capacitor and method for manufacturing multilayer ceramic capacitor

    公开(公告)号:US11315734B2

    公开(公告)日:2022-04-26

    申请号:US16788427

    申请日:2020-02-12

    摘要: A multilayer ceramic capacitor includes a capacitive element including ceramic layers and internal electrodes, and external electrodes on the capacitive element. The external electrodes include a Ni underlying electrode layer mainly made of Ni, a Cu plating electrode layer, and at least one second plating electrode layer. The Cu plating electrode layer includes a Ni diffused Cu plating electrode layer on a side closer to the Ni underlying electrode layer and including Ni diffused therein and a non-Ni diffused Cu plating electrode layer on a side closer to the second plating electrode layer and not including Ni diffused therein. The Cu plating electrode layer has a thickness of about 3 μm or more and about 12 μm or less and the non-Ni diffused Cu plating electrode layer has a thickness of about 0.5 μm or more.

    Multilayer ceramic electronic component

    公开(公告)号:US11636980B2

    公开(公告)日:2023-04-25

    申请号:US17101026

    申请日:2020-11-23

    摘要: A multilayer ceramic electronic component includes a multilayer body and an external electrode on each of both end surfaces of the multilayer body. The external electrode includes an underlying electrode layer and a plating layer that is disposed on the underlying electrode layer. The underlying electrode layer includes Ni as a first metal component, Sn as a second metal component, and a ceramic material, and includes an alloy portion that is provided around the ceramic material and includes an alloyed Ni defining the first metal component and an alloyed Sn defining the second metal component.

    Multilayer ceramic capacitor including a perovskite compound

    公开(公告)号:US09870865B2

    公开(公告)日:2018-01-16

    申请号:US14885101

    申请日:2015-10-16

    发明人: Taisuke Kanzaki

    IPC分类号: H01G4/30 H01G4/12 H01G4/008

    摘要: A multilayer ceramic capacitor includes a ceramic multilayer body including dielectric ceramic layers and inner electrodes laminated with the dielectric ceramic layers interposed therebetween, wherein the dielectric ceramic layers include a perovskite compound containing Ba and Ti, and the inner electrodes (a) contain Ni as a main component, (b) include segregation with the perovskite compound containing Ba and Ti, which is scattered in the inner electrodes and embedded in the inner electrodes, in amount equal to or higher than about 2%, and (c) include columnar segregation with the perovskite compound containing Ba and Ti, which penetrates through the inner electrodes from one main surface side to the other main surface side, in an amount equal to or lower than about 5%, or do not include the columnar segregation. Further, an average thickness of the inner electrodes is equal to or smaller than about 0.4 μm.