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公开(公告)号：US09805871B2
公开(公告)日：2017-10-31
申请号：US15352670
申请日：2016-11-16
IPC分类号： H01G4/30 , H01G4/248 , H01G4/005 , H01F27/29 , H01C7/00 , H01L41/047 , H01L41/293 , H01G4/008 , H01G4/12 , H01F27/28
CPC分类号： H01G4/30 , H01C7/008 , H01F27/2804 , H01F27/29 , H01F2027/2809 , H01G4/005 , H01G4/008 , H01G4/12 , H01G4/248 , H01L41/0472 , H01L41/293
摘要： External electrodes, electrically connected to exposed portions of internal electrodes, are arranged on end surfaces of a ceramic main body of a laminated ceramic capacitor. Alloy layers of a metal contained in internal electrodes, and a metal contained in external electrodes, are arranged at the boundaries between external electrodes, and the ceramic main body and internal electrodes. Plating layers are provided on surfaces of external electrodes. A ceramic electronic component having a reduced ESR is thus provided.
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公开(公告)号：US11315734B2
公开(公告)日：2022-04-26
申请号：US16788427
申请日：2020-02-12
摘要： A multilayer ceramic capacitor includes a capacitive element including ceramic layers and internal electrodes, and external electrodes on the capacitive element. The external electrodes include a Ni underlying electrode layer mainly made of Ni, a Cu plating electrode layer, and at least one second plating electrode layer. The Cu plating electrode layer includes a Ni diffused Cu plating electrode layer on a side closer to the Ni underlying electrode layer and including Ni diffused therein and a non-Ni diffused Cu plating electrode layer on a side closer to the second plating electrode layer and not including Ni diffused therein. The Cu plating electrode layer has a thickness of about 3 μm or more and about 12 μm or less and the non-Ni diffused Cu plating electrode layer has a thickness of about 0.5 μm or more.
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3.发明授权Ceramic electronic component with low equivalent series resistance and method for manufacturing the same 有权具有低等效串联电阻的陶瓷电子元件及其制造方法公开(公告)号：US09530560B2
公开(公告)日：2016-12-27
申请号：US14324397
申请日：2014-07-07
IPC分类号： H01G4/005 , H01G4/30 , H01F27/29 , H01C7/00 , H01L41/047 , H01L41/293
CPC分类号： H01G4/30 , H01C7/008 , H01F27/2804 , H01F27/29 , H01F2027/2809 , H01G4/005 , H01G4/008 , H01G4/12 , H01G4/248 , H01L41/0472 , H01L41/293
摘要： External electrodes, electrically connected to exposed portions of internal electrodes, are arranged on end surfaces of a ceramic main body of a laminated ceramic capacitor. Alloy layers of a metal contained in internal electrodes, and a metal contained in external electrodes, are arranged at the boundaries between external electrodes, and the ceramic main body and internal electrodes. Plating layers are provided on surfaces of external electrodes. A ceramic electronic component having a reduced ESR is thus provided.
摘要翻译： 电连接到内部电极的露出部分的外部电极设置在层叠陶瓷电容器的陶瓷主体的端面上。 包含在内部电极中的金属和外部电极中包含的金属的合金层被布置在外部电极和陶瓷主体和内部电极之间的边界处。 电镀层设置在外部电极的表面上。 因此提供了具有减小的ESR的陶瓷电子部件。
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公开(公告)号：US12100558B2
公开(公告)日：2024-09-24
申请号：US18121042
申请日：2023-03-14
发明人： Taisuke Kanzaki , Kosuke Onishi
CPC分类号： H01G4/30 , H01G4/008 , H01G4/012 , H01G4/1227 , H01G4/1245 , H01G4/232
摘要： A multilayer ceramic electronic component includes a multilayer body and external electrodes provided on opposing end surfaces of the multilayer body. Each external electrode includes an underlying electrode layer including metal components and ceramic components, and plating layers on the underlying electrode layer. A metal of the plating layer on the underlying electrode layer diffuses into the underlying electrode layer, and exists at an interface where the metal components included in the underlying electrode layer are in contact with each other and an interface where the metal component and the ceramic component included in the underlying electrode layer are in contact with each other.
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公开(公告)号：US11915877B2
公开(公告)日：2024-02-27
申请号：US18124019
申请日：2023-03-21
发明人： Taisuke Kanzaki , Kosuke Onishi , Akitaka Doi
摘要： A multilayer ceramic electronic component includes a multilayer body and an external electrode on each of both end surfaces of the multilayer body. The external electrode includes an underlying electrode layer and a plating layer that is disposed on the underlying electrode layer. The underlying electrode layer includes Ni as a first metal component, Sn as a second metal component, and a ceramic material, and includes an alloy portion that is provided around the ceramic material and includes an alloyed Ni defining the first metal component and an alloyed Sn defining the second metal component.
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公开(公告)号：US11636982B2
公开(公告)日：2023-04-25
申请号：US17205067
申请日：2021-03-18
发明人： Taisuke Kanzaki , Kosuke Onishi
摘要： A multilayer ceramic electronic component includes a multilayer body and external electrodes provided on opposing end surfaces of the multilayer body. Each external electrode includes an underlying electrode layer including metal components and ceramic components, and plating layers on the underlying electrode layer. A metal of the plating layer on the underlying electrode layer diffuses into the underlying electrode layer to extend from a surface layer of the underlying electrode layer to an interface of the multilayer body, and exists at an interface where the metal components included in the underlying electrode layer are in contact with each other, an interface where the metal component and the ceramic component included in the underlying electrode layer are in contact with each other, and an interface between the metal component included in the underlying electrode layer and the multilayer body.
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公开(公告)号：US11636980B2
公开(公告)日：2023-04-25
申请号：US17101026
申请日：2020-11-23
发明人： Taisuke Kanzaki , Kosuke Onishi , Akitaka Doi
摘要： A multilayer ceramic electronic component includes a multilayer body and an external electrode on each of both end surfaces of the multilayer body. The external electrode includes an underlying electrode layer and a plating layer that is disposed on the underlying electrode layer. The underlying electrode layer includes Ni as a first metal component, Sn as a second metal component, and a ceramic material, and includes an alloy portion that is provided around the ceramic material and includes an alloyed Ni defining the first metal component and an alloyed Sn defining the second metal component.
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公开(公告)号：US11482378B2
公开(公告)日：2022-10-25
申请号：US16788430
申请日：2020-02-12
摘要： A three-terminal multilayer ceramic capacitor includes a capacitor including a ceramic layer, first and second internal electrodes, first and second end surface electrodes, and first and second side surface electrodes, and has a lengthwise dimension of about 1300 μm or more and about 1500 μm or less, a widthwise dimension of about 1000 μm or more and about 1200 μm or less, a heightwise dimension of about 570 μm or more and about 680 μm or less, and a capacitance of about 12 μF or more and about 32 μF or less. The first and second end surface electrodes, and the first and second side surface electrodes include a Ni underlying electrode layer and at least one plating electrode layer. The first and second end surface electrodes have a thickness of about 0.73% or more and about 3.00% or less relative to the lengthwise dimension.
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