公开(公告)号：US20210217707A1

公开(公告)日：2021-07-15

申请号：US17111456

申请日：2020-12-03

Applicant: MEDIATEK INC.

Inventor： Yi-Lin Tsai ,  Shih-Chao Chiu ,  Wen-Sung Hsu ,  Sang-Mao Chiu ,  Chi-Yuan Chen ,  Yao-Pang Hsu

IPC: H01L23/00 ,  H01L23/498

Abstract: A semiconductor package includes a substrate component having a first surface, a second surface opposite to the first surface, and a sidewall surface extending between the first surface and the second surface; a re-distribution layer (RDL) structure disposed on the first surface and electrically connected to the first surface through first connecting elements comprising solder bumps or balls; a plurality of ball grid array (BGA) balls mounted on the second surface of the substrate component; and at least one integrated circuit die mounted on the RDL structure through second connecting elements.

公开(公告)号：US12080614B2

公开(公告)日：2024-09-03

申请号：US17493853

申请日：2021-10-05

Applicant: MEDIATEK INC.

Inventor： Shih-Chao Chiu ,  Chi-Yuan Chen ,  Wen-Sung Hsu ,  Ya-Jui Hsieh ,  Yao-Pang Hsu ,  Wen-Chun Huang

IPC: H01L23/31 ,  H01L23/40 ,  H01L23/473 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03

CPC classification number: H01L23/31 ,  H01L23/4006 ,  H01L23/473 ,  H05K5/0052 ,  H05K5/0221 ,  H05K5/03

Abstract: A semiconductor package includes a substrate having a top surface and a bottom surface; a semiconductor die mounted on the top surface of the substrate; and a two-part lid mounted on a perimeter of the top surface of the substrate and housing the semiconductor die. The lid comprises an annular lid base and a cover plate removably installed on the annular lid base. The semiconductor package can be uncovered by removing the cover plate and a forced cooling module can be installed in place of the cover plate.

公开(公告)号：US20240429113A1

公开(公告)日：2024-12-26

申请号：US18822254

申请日：2024-09-01

Applicant: MEDIATEK INC.

Inventor： Shih-Chao Chiu ,  Chi-Yuan Chen ,  Wen-Sung Hsu ,  Ya-Jui Hsieh ,  Yao-Pang Hsu ,  Wen-Chun Huang

IPC: H01L23/31 ,  H01L23/40 ,  H01L23/473 ,  H05K5/00 ,  H05K5/02 ,  H05K5/03

Abstract: A semiconductor package includes a substrate having a top surface and a bottom surface; a semiconductor die mounted on the top surface of the substrate; and a two-part lid mounted on a perimeter of the top surface of the substrate and housing the semiconductor die. The lid comprises an annular lid base and a cover plate removably installed on the annular lid base. The semiconductor package can be uncovered by removing the cover plate and a forced cooling module can be installed in place of the cover plate.

公开(公告)号：US20230307849A1

公开(公告)日：2023-09-28

申请号：US18113606

申请日：2023-02-23

Applicant: MEDIATEK INC.

Inventor： Ya-Jui Hsieh ,  Chi-Yuan Chen ,  Shih-Chao Chiu ,  Yao-Pang Hsu

IPC: H01Q21/08 ,  H01Q9/04 ,  H01L25/16

CPC classification number: H01Q21/08 ,  H01Q9/0407 ,  H01L25/16

Abstract: An antenna-in-module package-on-package includes an antenna package having a top surface and a bottom surface opposing the top surface. The antenna package includes a radiative antenna element on the bottom surface. A chip package is mounted on the top surface of the antenna package. The chip package includes a semiconductor chip. Conductive elements are disposed between the antenna package and the chip package to electrically interconnect the chip package and the antenna package. A radiative antenna element is disposed on the bottom surface of the antenna package. At least one air trench is disposed on the bottom surface of the antenna package.

公开(公告)号：US20220130734A1

公开(公告)日：2022-04-28

申请号：US17493853

申请日：2021-10-05

Applicant: MEDIATEK INC.

Inventor： Shih-Chao Chiu ,  Chi-Yuan Chen ,  Wen-Sung Hsu ,  Ya-Jui Hsieh ,  Yao-Pang Hsu ,  Wen-Chun Huang

IPC: H01L23/31 ,  H01L23/40 ,  H05K5/02 ,  H05K5/00 ,  H01L23/473

Abstract: A semiconductor package includes a substrate having a top surface and a bottom surface; a semiconductor die mounted on the top surface of the substrate; and a two-part lid mounted on a perimeter of the top surface of the substrate and housing the semiconductor die. The lid comprises an annular lid base and a cover plate removably installed on the annular lid base. The semiconductor package can be uncovered by removing the cover plate and a forced cooling module can be installed in place of the cover plate.