公开(公告)号：US20240195152A1

公开(公告)日：2024-06-13

申请号：US18194143

申请日：2023-03-31

Applicant: Lumentum Operations LLC

Inventor： Wei SHI ,  Joseph LEIGH ,  Suhit Ranjan DAS ,  Huanlin ZHU ,  Raman SRINIVASAN ,  Gianluca BACCHIN ,  Yuefa LI ,  Jacob U. LOPEZ RUVALCABA ,  Lijun ZHU ,  Qianhuan YU

IPC: H01S5/42 ,  H01S5/0234 ,  H01S5/0237

CPC classification number: H01S5/423 ,  H01S5/0234 ,  H01S5/0237

Abstract: In some implementations, an emitter assembly includes a vertical cavity surface emitting laser (VCSEL) chip including a plurality of VCSELs. The emitter assembly may include a plurality of conductive pillars electrically connected to the VCSEL chip, and a conductive pillar, of the plurality of conductive pillars, may have a solder cap at an end of the conductive pillar. The emitter assembly may include a pin extending into the solder cap.

公开(公告)号：US20240396297A1

公开(公告)日：2024-11-28

申请号：US18362569

申请日：2023-07-31

Applicant: Lumentum Operations LLC

Inventor： Siu Kwan CHEUNG ,  Lijun ZHU ,  Qianhuan YU ,  Benjamin KESLER ,  Wei SHI ,  Joseph LEIGH

IPC: H01S5/042 ,  H01S5/42

Abstract: In some implementations, an emitter assembly includes a vertical cavity surface emitting laser (VCSEL) device. The VCSEL device may include a substrate. The VCSEL device may include a plurality of VCSELs on the substrate. The VCSEL device may include at least one anode layer on the substrate and electrically connected to the plurality of VCSELs. The VCSEL device may include a cathode electrode over at least a portion of multiple VCSELs, of the plurality of VCSELs, and electrically connected to the multiple VCSELs. The cathode electrode may include multiple cathode electrode fingers. The emitter assembly may include a bridge element that electrically connects a first finger of the multiple cathode electrode fingers and a second finger of the multiple cathode electrode fingers.

公开(公告)号：US20240195153A1

公开(公告)日：2024-06-13

申请号：US18194156

申请日：2023-03-31

Applicant: Lumentum Operations LLC

Inventor： Wei SHI ,  Joseph LEIGH ,  Suhit Ranjan DAS ,  Huanlin ZHU ,  Raman SRINIVASAN ,  Gianluca BACCHIN ,  Yuefa LI ,  Jacob U. LOPEZ RUVALCABA ,  Lijun ZHU ,  Qianhuan YU

IPC: H01S5/42 ,  H01S5/0234 ,  H01S5/0237 ,  H01S5/024 ,  H01S5/183

CPC classification number: H01S5/423 ,  H01S5/0234 ,  H01S5/0237 ,  H01S5/02469 ,  H01S5/18305

Abstract: In some implementations, an emitter assembly includes a vertical cavity surface emitting laser (VCSEL) chip including a plurality of VCSELs in a bottom-emitting configuration, and multiple VCSELs, of the plurality of VCSELs, may be grouped in a cluster. The emitter assembly may include a carrier, and the VCSEL chip may be in a flip chip configuration with the carrier. The emitter assembly may include a conductive pillar electrically connected to the multiple VCSELs grouped in the cluster.

公开(公告)号：US20240195151A1

公开(公告)日：2024-06-13

申请号：US18194133

申请日：2023-03-31

Applicant: Lumentum Operations LLC

Inventor： Wei SHI ,  Joseph LEIGH ,  Suhit Ranjan DAS ,  Huanlin ZHU ,  Raman SRINIVASAN ,  Gianluca BACCHIN ,  Yuefa LI ,  Jacob U. LOPEZ RUVALCABA ,  Lijun ZHU ,  Qianhuan YU

IPC: H01S5/42 ,  H01S5/0234 ,  H01S5/0237

CPC classification number: H01S5/423 ,  H01S5/0234 ,  H01S5/0237

Abstract: In some implementations, an emitter assembly includes a vertical cavity surface emitting laser (VCSEL) chip including a plurality of VCSELs. The emitter assembly may include a plurality of conductive pillars electrically connected to the VCSEL chip. The emitter assembly may include a dummy pillar, electrically isolated from the VCSEL chip, mating with a slot. The VCSEL chip may include one of the dummy pillar or the slot.

公开(公告)号：US20240195145A1

公开(公告)日：2024-06-13

申请号：US18194123

申请日：2023-03-31

Applicant: Lumentum Operations LLC

Inventor： Wei SHI ,  Joseph LEIGH ,  Eric R. HEGBLOM ,  Suhit Ranjan DAS ,  Huanlin ZHU ,  Raman SRINIVASAN ,  Gianluca BACCHIN ,  Yuefa LI ,  Jacob U. LOPEZ RUVALCABA ,  Lijun ZHU ,  Qianhuan YU

IPC: H01S5/0239 ,  H01S5/0234 ,  H01S5/0237 ,  H01S5/02375 ,  H01S5/183 ,  H01S5/42

CPC classification number: H01S5/0239 ,  H01S5/0234 ,  H01S5/0237 ,  H01S5/02375 ,  H01S5/18305 ,  H01S5/423

Abstract: In some implementations, an emitter assembly includes a vertical cavity surface emitting laser (VCSEL) chip including a plurality of VCSELs respectively associated with a plurality of first electrical contacts. A first spacing of the plurality of first electrical contacts may define a first pitch. The emitter assembly may include a redistribution layer, disposed on the VCSEL chip, to increase the first pitch of the plurality of first electrical contacts. The emitter assembly may include a carrier having a plurality of second electrical contacts. A second spacing of the plurality of second electrical contacts may define a second pitch greater than the first pitch. The emitter assembly may include a plurality of conductive pillars that electrically connect the plurality of first electrical contacts and the plurality of second electrical contacts via the redistribution layer. The plurality of conductive pillars may be arranged according to the second spacing.