Imaging Performance Optimization Methods for Semiconductor Wafer Inspection
    1.
    发明申请
    Imaging Performance Optimization Methods for Semiconductor Wafer Inspection 审中-公开
    半导体晶圆检测成像性能优化方法

    公开(公告)号:US20170061597A1

    公开(公告)日:2017-03-02

    申请号:US15207364

    申请日:2016-07-11

    Abstract: Inspection systems and methods for adjusting/optimizing imaging performances of the inspection systems are disclosed. An inspection system may include an optical component configured to deliver inspection light to a subject and a detector configured to obtain an image of the subject at least partially based on the inspection light delivered to the subject. The inspection system may also include a processor in communication with the optical component and the detector. The processor may be configured to: measure an aberration of the optical component based on the image of the subject obtained by the detector; and adjust the optical component to compensate for a change in the aberration.

    Abstract translation: 公开了用于调整/优化检查系统的成像性能的检查系统和方法。 检查系统可以包括被配置为向被检体传送检查光的光学部件和被配置为至少部分地基于传送到被检体的检查光获得被检体的图像的检测器。 检查系统还可以包括与光学部件和检测器通信的处理器。 处理器可以被配置为:基于由检测器获得的对象的图像来测量光学部件的像差; 并调整光学部件以补偿像差的变化。

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