公开(公告)号：US10794839B2

公开(公告)日：2020-10-06

申请号：US16283690

申请日：2019-02-22

Applicant: KLA-Tencor Corporation

Inventor： Aaron J. Rosenberg ,  Jonathan Iloreta ,  Thaddeus G. Dziura ,  Antonio Gellineau ,  Yin Xu ,  Kaiwen Xu ,  John Hench ,  Abhi Gunde ,  Andrei Veldman ,  Liequan Lee ,  Houssam Chouaib

IPC: G01N21/00 ,  G01N21/95 ,  H01L27/02 ,  H01L27/088 ,  H01L27/108 ,  G06T17/10 ,  G06T15/20 ,  G01N21/956 ,  H01L27/115 ,  G06F30/39

Abstract: A semiconductor metrology tool inspects an area of a semiconductor wafer. The inspected area includes a plurality of instances of a 3D semiconductor structure arranged periodically in at least one dimension. A computer system generates a model of a respective instance of the 3D semiconductor structure based on measurements collected during the inspection. The computer system renders an image of the model that shows a 3D shape of the model and provides the image to a device for display.

公开(公告)号：US09553033B2

公开(公告)日：2017-01-24

申请号：US14594917

申请日：2015-01-12

Applicant: KLA-Tencor Corporation

Inventor： Jonathan Iloreta ,  Matthew A. Laffin ,  Leonid Poslavsky ,  Torsten Kaack ,  Qiang Zhao ,  Lie-Quan Lee

IPC: G06F17/50 ,  H01L21/66

CPC classification number: H01L22/12

Abstract: Methods and tools for generating measurement models of complex device structures based on re-useable, parametric models are presented. Metrology systems employing these models are configured to measure structural and material characteristics associated with different semiconductor fabrication processes. The re-useable, parametric sub-structure model is fully defined by a set of independent parameters entered by a user of the model building tool. All other variables associated with the model shape and internal constraints among constituent geometric elements are pre-defined within the model. In some embodiments, one or more re-useable, parametric models are integrated into a measurement model of a complex semiconductor device. In another aspect, a model building tool generates a re-useable, parametric sub-structure model based on input from a user. The resulting models can be exported to a file that can be used by others and may include security features to control the sharing of sensitive intellectual property with particular users.

Abstract translation: 提出了基于可重复使用的参数模型生成复杂设备结构测量模型的方法和工具。 采用这些模型的计量系统被配置为测量与不同半导体制造工艺相关联的结构和材料特性。 可重复使用的参数子结构模型由模型构建工具的用户输入的一组独立参数完全定义。 与模型形状相关联的所有其他变量和组成几何元素之间的内部约束在模型中被预先定义。 在一些实施例中，将一个或多个可重复使用的参数模型集成到复合半导体器件的测量模型中。 在另一方面，模型构建工具基于来自用户的输入生成可重复使用的参数子结构模型。 所得到的模型可以导出到其他人可以使用的文件，并且可能包括用于控制与特定用户共享敏感知识产权的安全功能。

公开(公告)号：US20200271595A1

公开(公告)日：2020-08-27

申请号：US16283690

申请日：2019-02-22

Applicant: KLA-Tencor Corporation

Inventor： Aaron J. Rosenberg ,  Jonathan Iloreta ,  Thaddeus G. Dziura ,  Antonio Gellineau ,  Yin Xu ,  Kaiwen Xu ,  John Hench ,  Abhi Gunde ,  Andrei Veldman ,  Liequan Lee ,  Houssam Chouaib

IPC: G01N21/95 ,  G06F17/50 ,  H01L27/02 ,  H01L27/088 ,  H01L27/108 ,  H01L27/115 ,  G06T17/10 ,  G06T15/20 ,  G01N21/956

Abstract: A semiconductor metrology tool inspects an area of a semiconductor wafer. The inspected area includes a plurality of instances of a 3D semiconductor structure arranged periodically in at least one dimension. A computer system generates a model of a respective instance of the 3D semiconductor structure based on measurements collected during the inspection. The computer system renders an image of the model that shows a 3D shape of the model and provides the image to a device for display.

公开(公告)号：US20150199463A1

公开(公告)日：2015-07-16

申请号：US14594917

申请日：2015-01-12

Applicant: KLA-Tencor Corporation

Inventor： Jonathan Iloreta ,  Matthew A. Laffin ,  Leonid Poslavsky ,  Torsten Kaack ,  Qiang Zhao ,  Lie-Quan Lee

IPC: G06F17/50

CPC classification number: H01L22/12

Abstract: Methods and tools for generating measurement models of complex device structures based on re-useable, parametric models are presented. Metrology systems employing these models are configured to measure structural and material characteristics associated with different semiconductor fabrication processes. The re-useable, parametric sub-structure model is fully defined by a set of independent parameters entered by a user of the model building tool. All other variables associated with the model shape and internal constraints among constituent geometric elements are pre-defined within the model. In some embodiments, one or more re-useable, parametric models are integrated into a measurement model of a complex semiconductor device. In another aspect, a model building tool generates a re-useable, parametric sub-structure model based on input from a user. The resulting models can be exported to a file that can be used by others and may include security features to control the sharing of sensitive intellectual property with particular users.

Abstract translation: 提出了基于可重复使用的参数模型生成复杂设备结构测量模型的方法和工具。 采用这些模型的计量系统被配置为测量与不同半导体制造工艺相关联的结构和材料特性。 可重复使用的参数子结构模型由模型构建工具的用户输入的一组独立参数完全定义。 与模型形状相关联的所有其他变量和组成几何元素之间的内部约束在模型中被预先定义。 在一些实施例中，将一个或多个可重复使用的参数模型集成到复合半导体器件的测量模型中。 在另一方面，模型构建工具基于来自用户的输入生成可重复使用的参数子结构模型。 所得到的模型可以导出到其他人可以使用的文件，并且可能包括用于控制与特定用户共享敏感知识产权的安全功能。