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公开(公告)号：US11823925B2
公开(公告)日：2023-11-21
申请号：US16665960
申请日：2019-10-28
Applicant: KLA-Tencor Corporation
Inventor： Mei Sun , Earl Jensen , Jing G Zhou , Ran Liu
IPC: H01L21/67 , H01L21/687
CPC classification number: H01L21/67253 , H01L21/67248 , H01L21/68764
Abstract: An apparatus includes an instrumented substrate apparatus, a substrate assembly including a bottom and top substrate mechanically coupled, an electronic assembly, a nested enclosure assembly including an outer and inner enclosure wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses the electronic assembly. An insulating medium between the inner and outer enclosure and a sensor assembly communicatively coupled to the electronic assembly including one or more sensors disposed at one or more locations within the substrate assembly wherein the electronic assembly is configured to receive one or more measurement parameters from the one or more sensors.
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公开(公告)号：US20150176980A1
公开(公告)日：2015-06-25
申请号：US14536428
申请日：2014-11-07
Applicant: KLA- Tencor Corporation
Inventor： Earl Jensen , Kevin O'Brien
IPC: G01B11/14
CPC classification number: H01L21/68 , H01L21/681
Abstract: Some aspects of the present disclosure relate to a system having a substrate device, a substrate support surface, and a substrate handler that positions the substrate device on the substrate support surface. The substrate device and the substrate support surface may have counterpart coarse position units and fine position units. The system may measure coarse positional offsets between the first and second coarse position units, re-position the substrate device on the substrate support surface based on the coarse positional offsets, and subsequently measure fine positional offsets between the first and second fine position units. In some implementations, the substrate device is integrally coupled to the substrate handler via a wireless communication link in order to communicate position information as feedback for further placement.
Abstract translation: 本公开的一些方面涉及具有衬底装置，衬底支撑表面和将衬底装置定位在衬底支撑表面上的衬底处理器的系统。 基板装置和基板支撑面可以具有对应的粗略位置单元和精细位置单元。 该系统可以测量第一和第二粗略位置单元之间的粗略的位置偏移，基于粗略的位置偏移将基板装置重新定位在基板支撑表面上，随后测量第一和第二精细位置单元之间的精细位置偏移。 在一些实施方案中，衬底装置经由无线通信链路一体地耦合到衬底处理器，以便将位置信息作为反馈传达以进一步放置。
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公开(公告)号：US10900843B2
公开(公告)日：2021-01-26
申请号：US16037445
申请日：2018-07-17
Applicant: KLA-Tencor Corporation
Inventor： Earl Jensen
Abstract: A sensor for detecting a temperature distribution imparted on a substrate in an environment is disclosed. The sensor includes a sensor substrate with one or more temperature sensing elements formed on the sensor substrate. In embodiments, a temperature sensing element includes at least one cavity with a thermally expandable material disposed within the cavity and a channel extending from the cavity with a slug disposed within the channel. In embodiments, the cavity has a fixed volume and is enclosed by a cover layer disposed or formed over the cavity. The thermally expandable material is configured to extend from the cavity into the channel to actuate the slug from a first position within the channel to at least a second position within the channel, where the position of the slug is indicative of a temperature of a respective portion of the sensor substrate.
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4.发明申请公开(公告)号：US20170365495A1
公开(公告)日：2017-12-21
申请号：US15277792
申请日：2016-09-27
Applicant: KLA-Tencor Corporation
Inventor： Mei Sun , Earl Jensen , Jing G. Zhou , Ran Liu
IPC: H01L21/67 , H01L21/687
CPC classification number: H01L21/67253 , H01L21/67248 , H01L21/68764
Abstract: An apparatus includes an instrumented substrate apparatus, a substrate assembly including a bottom and top substrate mechanically coupled, an electronic assembly, a nested enclosure assembly including an outer and inner enclosure wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses the electronic assembly. An insulating medium between the inner and outer enclosure and a sensor assembly communicatively coupled to the electronic assembly including one or more sensors disposed at one or more locations within the substrate assembly wherein the electronic assembly is configured to receive one or more measurement parameters from the one or more sensors.
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5.发明申请Method and System for Measuring Radiation and Temperature Exposure of Wafers Along a Fabrication Process Line 有权用于测量沿着制造工艺线的晶片的辐射和温度暴露的方法和系统公开(公告)号：US20160138969A1
公开(公告)日：2016-05-19
申请号：US14880899
申请日：2015-10-12
Applicant: KLA-Tencor Corporation
Inventor： Mei Sun , Earl Jensen , Kevin O'Brien
CPC classification number: G01J1/429 , G01J1/0204 , G01J1/0271 , G01J1/0407 , G01J1/58 , G01J5/04 , G01J5/0818 , G01J5/10 , G01K11/20 , H01L21/67248 , H01L21/67253 , H01L22/10
Abstract: A measurement wafer device for measuring radiation intensity and temperature includes a wafer assembly including one or more cavities. The measurement wafer device further includes a detector assembly. The detector assembly is disposed within the one or more cavities of the wafer assembly. The detector assembly includes one or more light sensors. The detector assembly is further configured to perform a direct or indirect measurement of the intensity of ultraviolet light incident on a surface of the wafer assembly. The detector assembly is further configured to determine a temperature of one or more portions of the wafer assembly based on one or more characteristics of the one or more light sensors.
Abstract translation: 用于测量辐射强度和温度的测量晶片装置包括包括一个或多个空腔的晶片组件。 测量晶片装置还包括检测器组件。 检测器组件设置在晶片组件的一个或多个空腔内。 检测器组件包括一个或多个光传感器。 检测器组件还被配置为对入射在晶片组件的表面上的紫外线的强度进行直接或间接的测量。 检测器组件还被配置为基于一个或多个光传感器的一个或多个特性来确定晶片组件的一个或多个部分的温度。
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Patent Agency Ranking
公开(公告)号：US10460966B2
公开(公告)日：2019-10-29
申请号：US15277792
申请日：2016-09-27
Applicant: KLA-Tencor Corporation
Inventor： Mei Sun , Earl Jensen , Jing G. Zhou , Ran Liu
IPC: H05K5/06 , H01L21/67 , H01L21/687
Abstract: An apparatus includes an instrumented substrate apparatus, a substrate assembly including a bottom and top substrate mechanically coupled, an electronic assembly, a nested enclosure assembly including an outer and inner enclosure wherein the outer enclosure encloses the inner enclosure and the inner enclosure encloses the electronic assembly. An insulating medium between the inner and outer enclosure and a sensor assembly communicatively coupled to the electronic assembly including one or more sensors disposed at one or more locations within the substrate assembly wherein the electronic assembly is configured to receive one or more measurement parameters from the one or more sensors.
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7.发明申请公开(公告)号：US20180052045A1
公开(公告)日：2018-02-22
申请号：US15782692
申请日：2017-10-12
Applicant: KLA-Tencor Corporation
Inventor： Mei Sun , Earl Jensen , Kevin O'Brien
CPC classification number: G01J1/429 , G01J1/0204 , G01J1/0271 , G01J1/0407 , G01J1/58 , G01J5/04 , G01J5/0818 , G01J5/10 , G01K11/20 , H01L21/67248 , H01L21/67253 , H01L22/10
Abstract: A measurement wafer device for measuring radiation intensity and temperature includes a wafer assembly including one or more cavities. The measurement wafer device further includes a detector assembly. The detector assembly includes one or more light sensors. The detector assembly is further configured to perform a direct or indirect measurement of the intensity of ultraviolet light incident on a surface of the wafer assembly.
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公开(公告)号：US09719867B2
公开(公告)日：2017-08-01
申请号：US14290255
申请日：2014-05-29
Applicant: KLA-Tencor Corporation
Inventor： Stephen Sharratt , Farhat Quli , Earl Jensen , Mei Sun
Abstract: A heat flux sensor equipped measurement wafer includes a substrate, a cover thermally coupled to a portion of the substrate, a sensor cavity formed between the substrate and the cover, a thermal barrier disposed within at least a portion of the sensor cavity, a bottom temperature sensor thermally coupled to the substrate and insulated from the cover by a portion of the thermal barrier and a top temperature sensor thermally coupled to the cover and insulated from the substrate by an additional portion of the thermal barrier, wherein a temperature difference between the bottom temperature sensor and the top temperature sensor is related to a heat flux passing through the substrate and cover proximate to the sensor cavity.
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公开(公告)号：US20140253928A1
公开(公告)日：2014-09-11
申请号：US14195390
申请日：2014-03-03
Applicant: KLA-Tencor Corporation
Inventor： Earl Jensen , Kevin O'Brien
CPC classification number: H01J37/32935 , G01B11/0625 , G01B11/0675 , G01B11/0683 , H01J37/32972
Abstract: An etch rate monitor apparatus has a substrate, an optical element and one or more optical detectors mounted to a common substrate with the one or more detectors sandwiched between the substrate and optical element to detect changes in optical interference signal resulting from changes in optical thickness of the optical element. The optical element is made of a material that allows transmission of light of a wavelength of interest. A reference waveform and data waveform can be collected with the apparatus and cross-correlated to determine a thickness change. This abstract is provided to comply with rules requiring an abstract that will allow a searcher or other reader to quickly ascertain the subject matter of the technical disclosure. It is submitted with the understanding that it will not be used to interpret or limit the scope or meaning of the claims.
Abstract translation: 蚀刻速率监测装置具有衬底，光学元件和安装到公共衬底的一个或多个光学检测器，其中一个或多个检测器夹在衬底和光学元件之间，以检测由光学厚度的变化引起的光学干涉信号的变化 光学元件。 光学元件由允许感兴趣的波长的光的透射的材料制成。 可以使用设备收集参考波形和数据波形，并进行交叉相关，以确定厚度变化。 提供该摘要以符合要求抽象的规则，允许搜索者或其他读者快速确定技术公开内容的主题。 提交它的理解是，它不会用于解释或限制权利要求的范围或含义。
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公开(公告)号：US10777393B2
公开(公告)日：2020-09-15
申请号：US15851184
申请日：2017-12-21
Applicant: KLA-Tencor Corporation
Inventor： Earl Jensen , Mei Sun
Abstract: A sensing device for measuring a plasma process parameter in a plasma chamber for processing workpieces may include a substrate with one or more sensor embedded in the substrate. The substrate can have a surface made of substantially the same material as workpieces that are plasma processed in the plasma chamber. Each sensor can include a collector portion made of substantially the same material as the substrate surface. The collector portion includes a surface that is level with the surface of the substrate. The collector portion is the top surface of the substrate. Sensor electronics are embedded into the substrate and coupled to the collector portion. When the substrate surface is exposed to a plasma one or more signals resulting from the plasma can be measured with the sensor(s).
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