公开(公告)号：US09719867B2

公开(公告)日：2017-08-01

申请号：US14290255

申请日：2014-05-29

Applicant: KLA-Tencor Corporation

Inventor： Stephen Sharratt ,  Farhat Quli ,  Earl Jensen ,  Mei Sun

IPC: G01K17/00 ,  G01K19/00

CPC classification number: G01K19/00 ,  G01K17/00

Abstract: A heat flux sensor equipped measurement wafer includes a substrate, a cover thermally coupled to a portion of the substrate, a sensor cavity formed between the substrate and the cover, a thermal barrier disposed within at least a portion of the sensor cavity, a bottom temperature sensor thermally coupled to the substrate and insulated from the cover by a portion of the thermal barrier and a top temperature sensor thermally coupled to the cover and insulated from the substrate by an additional portion of the thermal barrier, wherein a temperature difference between the bottom temperature sensor and the top temperature sensor is related to a heat flux passing through the substrate and cover proximate to the sensor cavity.

公开(公告)号：US20140355643A1

公开(公告)日：2014-12-04

申请号：US14290255

申请日：2014-05-29

Applicant: KLA-Tencor Corporation

Inventor： Stephen Sharratt ,  Farhat Quli ,  Earl Jensen ,  Mei Sun

IPC: G01K7/00 ,  G01K15/00

CPC classification number: G01K19/00 ,  G01K17/00

Abstract: A heat flux sensor equipped measurement wafer includes a substrate, a cover thermally coupled to a portion of the substrate, a sensor cavity formed between the substrate and the cover, a thermal barrier disposed within at least a portion of the sensor cavity, a bottom temperature sensor thermally coupled to the substrate and insulated from the cover by a portion of the thermal barrier and a top temperature sensor thermally coupled to the cover and insulated from the substrate by an additional portion of the thermal barrier, wherein a temperature difference between the bottom temperature sensor and the top temperature sensor is related to a heat flux passing through the substrate and cover proximate to the sensor cavity.

Abstract translation: 配备有热量传感器的测量晶片包括基板，热耦合到基板的一部分的盖，形成在基板和盖之间的传感器腔，设置在传感器腔的至少一部分内的热障，底部温度 传感器热耦合到衬底并且由热屏障的一部分与盖隔离，并且顶部温度传感器热耦合到盖并通过热障的另外部分与衬底绝缘，其中底部温度 传感器和顶部温度传感器与通过基板和靠近传感器腔的盖子的热通量有关。