公开(公告)号：US10418942B2

公开(公告)日：2019-09-17

申请号：US15171373

申请日：2016-06-02

Applicant: Intel IP Corporation

Inventor： Igal Yehuda Kushnir ,  Gil Horovitz ,  Ronen Kronfeld ,  Sarit Zur

IPC: H03B19/00 ,  H03B19/14 ,  H04L7/02 ,  H03L7/24

Abstract: Embodiments of a reference path circuit and communication device are generally described herein. The reference path circuit may include an injection locked multiplier (ILM) and a group of one or more buffer amplifiers. The ILM may receive a sinusoidal reference signal from a reference oscillator at a reference frequency. The ILM may generate a sinusoidal ILM output signal at an ILM output frequency that is based on an integer multiple of the reference frequency. The integer multiple of the reference frequency may be within a locking range of the ILM that may be based on a resonant frequency of the ILM. The group of one or more buffer amplifiers may generate an output clock signal for input to the frequency synthesizer. The output clock signal may be based on a sign function of the ILM output signal.

公开(公告)号：US20190139915A1

公开(公告)日：2019-05-09

申请号：US16306833

申请日：2016-06-03

Applicant: Intel IP Corporation

Inventor： Sidharth Dalmia ,  Igal Yehuda Kushnir

IPC: H01L23/66 ,  H01Q1/22 ,  H01L23/00 ,  H01L23/522 ,  H01L23/552 ,  H01L23/42

Abstract: Wireless modules having a semiconductor package attached to an antenna package and cap package are disclosed. The semiconductor package may have one or more electronic components disposed thereon. The antenna package may be communicatively coupled to the semiconductor package using by one or more coupling pads. The antenna package may further have one or more radiating elements for transmitting and or receiving wireless signals. The cap package may also be attached to the semiconductor package on a side opposing the side on which the antenna package is disposed. The cap package may provide routing and/or additional antenna elements. The cap package may also allow for thermal grease to be dispensed therethrough. The antenna package, the cap package, and the semiconductor package may have dissimilar number of interconnect layers and/or dissimilar materials of construct.

公开(公告)号：US10756033B2

公开(公告)日：2020-08-25

申请号：US16306833

申请日：2016-06-03

Applicant: Intel IP Corporation

Inventor： Sidharth Dalmia ,  Igal Yehuda Kushnir

IPC: H01L23/66 ,  H01L23/552 ,  H01L25/10 ,  H01L23/538 ,  H01L23/42 ,  H01L23/522 ,  H01L23/00 ,  H01Q1/22 ,  H01L25/065 ,  H01L23/367 ,  H01L23/31

Abstract: Wireless modules having a semiconductor package attached to an antenna package and cap package are disclosed. The semiconductor package may have one or more electronic components disposed thereon. The antenna package may be communicatively coupled to the semiconductor package using by one or more coupling pads. The antenna package may further have one or more radiating elements for transmitting and or receiving wireless signals. The cap package may also be attached to the semiconductor package on a side opposing the side on which the antenna package is disposed. The cap package may provide routing and/or additional antenna elements. The cap package may also allow for thermal grease to be dispensed therethrough. The antenna package, the cap package, and the semiconductor package may have dissimilar number of interconnect layers and/or dissimilar materials of construct.