公开(公告)号：US20180204959A1

公开(公告)日：2018-07-19

申请号：US15868081

申请日：2018-01-11

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Ahn Tae Yong ,  Sai Mun Chan ,  Kyu Won Hwang

IPC: H01L31/0203 ,  H01L33/48 ,  H01L33/58 ,  H01L31/0232 ,  H01L31/18 ,  H01L33/00 ,  H01L27/146 ,  H01L27/15

CPC classification number: H01L31/0203 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/15 ,  H01L31/0232 ,  H01L31/02325 ,  H01L31/18 ,  H01L33/005 ,  H01L33/483 ,  H01L33/58

Abstract: Optoelectronic modules, such as imaging cameras, proximity sensors, range cameras, structured-light/pattern generators, and image projectors, and methods for their manufacture, are disclosed. The optoelectronic modules exhibit particularly small dimensions. The optoelectronic modules include an optical assembly, an intermediate substrate, and a base substrate. The optical assembly includes a flange portion. An adhesive layer between the flange portion and the intermediate substrate, and an additional adhesive layer between the intermediate substrate and the base can be substantially non-transmissive to light and can resist dimensional changes dues to moisture absorption, for example.

公开(公告)号：US20180205857A1

公开(公告)日：2018-07-19

申请号：US15742567

申请日：2016-06-29

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Sai Mun Chan ,  Hartmut Rudmann ,  Tae Yong Ahn ,  Kyu Won Hwang

IPC: H04N5/225 ,  H01L27/146 ,  H01L21/56 ,  H01L23/00 ,  G02B13/00 ,  G02B7/02 ,  G02B7/04 ,  H04N5/232

CPC classification number: H04N5/2257 ,  G02B7/021 ,  G02B7/028 ,  G02B7/04 ,  G02B13/0085 ,  H01L21/561 ,  H01L21/566 ,  H01L24/48 ,  H01L24/85 ,  H01L27/14618 ,  H01L27/14625 ,  H01L27/14636 ,  H01L2224/48091 ,  H01L2224/48225 ,  H01L2224/8592 ,  H01L2224/97 ,  H01L2924/00014 ,  H04N5/2253 ,  H04N5/2254 ,  H04N5/23212 ,  H01L2224/45099

Abstract: Optoelectronic modules include overmolds that support an optical assembly and, in some case, protect wiring providing electrical connections between an image sensor and a printed circuit board (PCB) or other substrate. The disclosure also describes wafer-level fabrication methods for making the modules.

公开(公告)号：US20170351049A1

公开(公告)日：2017-12-07

申请号：US15607885

申请日：2017-05-30

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Ahn Tae Yong ,  Sai Mun Chan ,  Kyu Won Hwang

IPC: G02B7/02 ,  G01J1/44 ,  G01J1/42

Abstract: The present disclosure describes subassemblies and optoelectronic modules in which an optics system, or a spacer laterally surrounding a cover glass, includes a flange which facilitates mechanical attachment of the optics system to the spacer.