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公开(公告)号:US20180124327A1
公开(公告)日:2018-05-03
申请号:US15121459
申请日:2015-02-23
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Jukka Alasirnio , Tobias Senn , Ohad Meitav , Moshe Doron , Alireza Yasan , Mario Cesana , Florin Cutu , Hartmut Rudmann , Markus Rossi , Peter Roentgen , Daniel Perez Calero , Bassam Hallal , Jens Geiger
Abstract: Image sensor modules include primary high-resolution imagers and secondary imagers. For example, an image sensor module may include a semiconductor chip including photosensitive regions defining, respectively, a primary camera and a secondary camera. The image sensor module may include an optical assembly that does not substantially obstruct the field-of-view of the secondary camera. Some modules include multiple secondary cameras that have a field-of-view at least as large as the field-of-view of the primary camera. Various features are described to facilitate acquisition of signals that can be used to calculate depth information.
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2.
公开(公告)号:US20170108699A1
公开(公告)日:2017-04-20
申请号:US15318025
申请日:2015-06-04
Applicant: Heptagon Micro Optics Pte. Ltd.
Inventor: Daniel Perez Calero , Kai Engelhardt , Hartmut Rudmann , Tobias Senn
CPC classification number: G02B27/0961 , G02B1/10 , G02B3/0056 , G02B3/0075 , G02B27/123 , H04N5/2253
Abstract: The present disclosure describes optoelectronic modules (e.g., hybrid lens array packages) that have multiple optical channels, each of which includes at least one beam shaping element (e.g., a lens) that is part of a laterally contiguous array. Each optical channel is associated with a respective light sensitive region of an image sensor. Some or all of the channels also can include at least one beam shaping element (e.g., a lens) that is not part of a laterally contiguous array. In some cases, the arrays can include alignment features to facilitate alignment of the arrays with one another.
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