摘要:
Embodiments of the invention relate to a mobile computing device with ambient energy harvesting capability. Embodiments of the invention, when manually operated by a user, convert the kinetic motion of a part of the user's hand, applied onto a controller of the device, to electrical energy. The energy can be used to power the device, or to charge the battery of the device. Embodiments of the invention include an electrical power storage device disposed in a housing, a display screen attached to the housing to display a plurality of user-interactive interfaces, and a manually operable input controller interactable with the interfaces and being coupled to an energy transformer in the housing to electrically charge the power storage device when operated.
摘要:
Embodiments of the invention relate to a mobile computing device with ambient energy harvesting capability. Embodiments of the invention, when manually operated by a user, convert the kinetic motion of a part of the user's hand, applied onto a controller of the device, to electrical energy. The energy can be used to power the device, or to charge the battery of the device. Embodiments of the invention include an electrical power storage device disposed in a housing, a display screen attached to the housing to display a plurality of user-interactive interfaces, and a manually operable input controller interactable with the interfaces and being coupled to an energy transformer in the housing to electrically charge the power storage device when operated.
摘要:
Disclosed are embodiments of a glass core substrate for an integrated circuit (IC) device. The glass core substrate includes a glass core and build-up structures on opposing sides of the glass core. Electrically conductive terminals may be formed on both sides of the glass core substrate. An IC die may be coupled with the terminals on one side of the substrate, whereas the terminals on the opposing side may be coupled with a next-level component, such as a circuit board. The glass core may comprise a single piece of glass in which conductors have been formed, or the glass core may comprise two or more glass sections that have been joined together, each section having conductors. The conductors extend through the glass core, and one or more of the conductors may be electrically coupled with the build-up structures disposed over the glass core. Other embodiments are described and claimed.
摘要:
Embodiments of the present description relate to the field of fabricating microelectronic substrates. The microelectronic substrate may include a trace routing structure disposed between opposing glass layers. The trace routing structure may comprise one or more dielectric layers having conductive traces formed thereon and therethrough. Also disclosed are embodiments of a microelectronic package including a microelectronic device disposed proximate one glass layer of the microelectronic substrate and coupled with the microelectronic substrate by a plurality of interconnects.
摘要:
The present invention provides a method of treating, ameliorating or preventing myocardial ischemia/reperfusion injury in a subject in need thereof, by administering to the subject a therapeutically effective amount of an annexin A1 short peptide (ANXA1sp).
摘要:
Techniques and mechanisms to provide for metering acceleration. In an embodiment, a microelectromechanical accelerometer includes a magnet, a mass, and a first support beam portion and second support beam portion for suspension of the mass. Resonance frequency characteristics of the first support beam portion and second support beam portion, based on the magnet and a current conducted by the first support beam portion and second support beam portion, are indicative of acceleration of the mass. In another embodiment, the accelerometer further includes a first wire portion and a second wire portion which are each coupled to the mass and further coupled to a respective anchor for exchanging a signal with the first wire portion and the second wire portion. The first wire portion and the second wire portion provide for biasing of the mass.
摘要:
A semiconductor package having a mechanical fuse therein and methods to form a semiconductor package having a mechanical fuse therein are described. For example, a semiconductor structure includes a semiconductor package. A semiconductor die is housed in the semiconductor package. A microelectromechanical system (MEMS) device is housed in the semiconductor package. The MEMS device has a suspended portion. A mechanical fuse is housed in the semiconductor package and either coupled to, or decoupled from, the suspended portion of the MEMS device.
摘要:
Embodiments of the invention provides an electromagnetic induction antenna plate, a back-light and a display device, and the electromagnetic induction antenna plate comprises a wiring layer and a fixing structure for attaching the wiring layer to a back plate of a back-light, wherein the wiring layer comprises a first surface facing the back plate and a second surface coated with a reflective material and facing a light guide plate of the back-light when amounted to the back-light.
摘要:
A direct-type backlight device and a display device having the direct-type backlight device are disclosed. The direct-type backlight device comprises: a backplane, a plurality of light-emitting units arranged on the backplane, and a diffusion plate over the light-emitting units, wherein at least one of the light-emitting units is provided at an upper end thereof with a transparent supporter for supporting the diffusion plate.