公开(公告)号：US20210222919A1

公开(公告)日：2021-07-22

申请号：US17224539

申请日：2021-04-07

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xing Fu ,  Chengpeng Yang ,  Ningjun Zhu ,  Quanming Li

IPC: F25B21/02 ,  H01L23/38 ,  H01L35/04 ,  H01S5/024 ,  H01S5/06

Abstract: A thermoelectric cooler (TEC) configured to support a heat source device and perform temperature control on the heat source device. The TEC includes a first base plate, a second base plate disposed opposite to the first base plate, and first elements. The first base plate is configured to support the heat source device. An accommodation space is formed between the first base plate and the second base plate. The first elements are arranged at intervals within the accommodation space, and are all connected to the first base plate and the second base plate.

公开(公告)号：US20240410658A1

公开(公告)日：2024-12-12

申请号：US18810132

申请日：2024-08-20

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xing Fu ,  Tao Yan ,  Sergey Khairnasov ,  Wenqiang Shi

IPC: F28D15/04

Abstract: A heat pipe includes a pipe body having a sealed cavity. A heat transfer medium and a capillary structure are disposed in the sealed cavity. The pipe body includes a first additional pipe section and a main pipe section including an evaporation section, a heat insulation section, and a condensation section. The first additional pipe section, where a first additional cavity is disposed, is connected to an end part of the evaporation section. The first additional cavity is used to accommodate all or a part of the heat transfer medium when the heat pipe is vertically placed and the first additional pipe section is located below a gravity direction, and when the heat pipe is mounted on a heat dissipation device that requires heat dissipation, the first additional pipe section is not in contact with a heat emitting component of the heat dissipation device.

公开(公告)号：US20240168538A1

公开(公告)日：2024-05-23

申请号：US18425734

申请日：2024-01-29

Applicant: Huawei Technologies Co., Ltd.

Inventor： Di Hu ,  Xing Fu ,  Dmytro Kutra ,  Yurii Mariiash ,  Zhen Liu

IPC: G06F1/3234 ,  G06F1/28 ,  G06F1/324 ,  G06F1/3296

CPC classification number: G06F1/3243 ,  G06F1/28 ,  G06F1/324 ,  G06F1/3296

Abstract: A power consumption adjustment method includes: adjusting, based on state information of a processing unit, a time parameter corresponding to a power limit, determining power consumption of the processing unit based on an adjusted time parameter, and adjusting a frequency and a voltage of the processing unit based on the power consumption and the power limit of the processing unit. The time parameter corresponding to the power limit may be used to represent a time point at which an overclocking adjustment is performed on the processing unit.

公开(公告)号：US11862529B2

公开(公告)日：2024-01-02

申请号：US17473673

申请日：2021-09-13

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Chaojun Deng ,  Xiaoyun Wei ,  Yong Yang ,  Jiye Xu ,  Xing Fu

IPC: H01L23/48 ,  H01L23/52 ,  H01L29/40 ,  H01L23/367 ,  H01L23/498 ,  H01L23/00

CPC classification number: H01L23/367 ,  H01L23/49827 ,  H01L24/08 ,  H01L2224/05611 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05684 ,  H01L2224/08233

Abstract: Embodiments of this application provide a chip and a manufacturing method thereof, and an electronic device, and belong to the field of chip heat dissipation technologies. The chip includes a die and a thermal conductive sheet. An active surface of the die is connected to the thermal conductive sheet by using a first bonding layer. Heat generated at a part with a relatively high temperature on the active surface of the die can be quickly conducted and dispersed by using the thermal conductive sheet, so that temperatures on the active surface are evenly distributed to avoid an excessively high local temperature of the chip, thereby preventing running of the chip from being affected.

公开(公告)号：US20180187930A1

公开(公告)日：2018-07-05

申请号：US15907975

申请日：2018-02-28

Applicant: Huawei Technologies Co., Ltd.

Inventor： Xing Fu ,  Chengpeng Yang ,  Ningjun Zhu ,  Quanming Li

IPC: F25B21/02 ,  H01S5/024 ,  H01L35/04 ,  H01L23/38 ,  H01S5/06

CPC classification number: F25B21/02 ,  H01L23/38 ,  H01L35/04 ,  H01S5/02415 ,  H01S5/0612

Abstract: A thermoelectric cooler (TEC) configured to support a heat source device and perform temperature control on the heat source device. The TEC includes a first base plate, a second base plate disposed opposite to the first base plate, and first elements. The first base plate is configured to support the heat source device. An accommodation space is formed between the first base plate and the second base plate. The first elements are arranged at intervals within the accommodation space, and are all connected to the first base plate and the second base plate.