公开(公告)号：US20220102237A1

公开(公告)日：2022-03-31

申请号：US17473673

申请日：2021-09-13

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Chaojun DENG ,  Xiaoyun WEI ,  Yong YANG ,  Jiye XU ,  Xing FU

IPC: H01L23/367 ,  H01L23/498 ,  H01L23/00

Abstract: Embodiments of this application provide a chip and a manufacturing method thereof, and an electronic device, and belong to the field of chip heat dissipation technologies. The chip includes a die and a thermal conductive sheet. An active surface of the die is connected to the thermal conductive sheet by using a first bonding layer. Heat generated at a part with a relatively high temperature on the active surface of the die can be quickly conducted and dispersed by using the thermal conductive sheet, so that temperatures on the active surface are evenly distributed to avoid an excessively high local temperature of the chip, thereby preventing running of the chip from being affected.

公开(公告)号：US20180247880A1

公开(公告)日：2018-08-30

申请号：US15907598

申请日：2018-02-28

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： HuiLi FU ,  Xing FU ,  Shujie CAI ,  Xiangxiong ZHANG

IPC: H01L23/38 ,  H01L23/367

CPC classification number: H01L23/38 ,  H01L23/3675

Abstract: This application provides a chip packaging system, including multiple chips, a substrate, a heat dissipating component, and at least one thermoelectric refrigeration chip. A heat dissipating ring and a heat dissipating lid are provided on the heat dissipating component. One end of the heat dissipating ring is secured to the substrate, and the other end, opposite to the end secured to the substrate. The multiple chips are disposed in space enclosed by the substrate, the heat dissipating ring, and the heat dissipating lid, and all of the multiple chips are separated each other by using a thermal insulation material or by air. One surface of each of the at least one thermoelectric refrigeration chip is a hot end and the other surface thereof is a cold end. The cold end of each thermoelectric refrigeration chip is disposed on a side close to the multiple chips.