公开(公告)号：US20180247880A1

公开(公告)日：2018-08-30

申请号：US15907598

申请日：2018-02-28

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： HuiLi FU ,  Xing FU ,  Shujie CAI ,  Xiangxiong ZHANG

IPC: H01L23/38 ,  H01L23/367

CPC classification number: H01L23/38 ,  H01L23/3675

Abstract: This application provides a chip packaging system, including multiple chips, a substrate, a heat dissipating component, and at least one thermoelectric refrigeration chip. A heat dissipating ring and a heat dissipating lid are provided on the heat dissipating component. One end of the heat dissipating ring is secured to the substrate, and the other end, opposite to the end secured to the substrate. The multiple chips are disposed in space enclosed by the substrate, the heat dissipating ring, and the heat dissipating lid, and all of the multiple chips are separated each other by using a thermal insulation material or by air. One surface of each of the at least one thermoelectric refrigeration chip is a hot end and the other surface thereof is a cold end. The cold end of each thermoelectric refrigeration chip is disposed on a side close to the multiple chips.