公开(公告)号：US20210297753A1

公开(公告)日：2021-09-23

申请号：US17338261

申请日：2021-06-03

Applicant: Huawei Technologies Co., Ltd.

Inventor： Duoci KUAI ,  Bingjie PENG ,  Wei HE ,  Liang WU ,  Yong YANG

IPC: H04N21/845 ,  G06F3/0481 ,  G06F3/01 ,  H04N21/472

Abstract: A method for controlling virtual reality (VR) video playing and an apparatus are provided. In this method, a video server device renders a jump icon in a video image. When a user wants to perform video jump based on video content, a jump icon corresponding to a scene in which the user is interested may be selected to form an input. The video server obtains, based on the input of the user, a jump time of a jump target video corresponding to the jump icon, and plays the jump target video for the user from the jump time. The jump target video may be a video that is being played, or may be another video. According to the application, a video can be switched based on preferences of the user

公开(公告)号：US20180262622A1

公开(公告)日：2018-09-13

申请号：US15977259

申请日：2018-05-11

Applicant: Huawei Technologies Co., Ltd.

Inventor： Zhendong WANG ,  Yong YANG ,  Meiyan ZENG

IPC: H04M7/00 ,  H04L5/14 ,  H04W76/27 ,  H04W76/30

Abstract: Embodiments of this application provide a method and an apparatus for processing a terminal that is performing a voice service, and a communications system. In the method, a RAN device actively redirects a voice service terminal, releases an RRC connection of the terminal, and instructs a CN device to retain a GBR bearer of the voice service terminal in a release process. Because a bearer type of a VOIP service is a GBR bearer, a bearer of the VOIP service is not released. When the terminal accesses a network again, the CN device may directly use the GBR bearer to restore the voice service, so as to avoid voice service interruption caused by releasing the bearer of the VOIP service in a redirection process, reduce a call drop rate, and improve user experience.

公开(公告)号：US20220102164A1

公开(公告)日：2022-03-31

申请号：US17459919

申请日：2021-08-27

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Xiaoyun WEI ,  Yong YANG ,  Chaojun DENG

IPC: H01L21/48 ,  H01L21/683 ,  H01L23/00 ,  H01L21/56 ,  H01L25/00 ,  H01L25/065 ,  H01L23/498

Abstract: Embodiments of the application provide a vertical interconnection structure and a manufacturing method thereof, a packaged chip, and a chip packaging method. Conductive pillars are formed on a first surface of a substrate. A first insulated support layer wrapping the conductive pillars is formed on the first surface of the substrate. The conductive pillars are located in the first insulated support layer. An upper surface of the conductive pillar that is away from the substrate is not covered by the first insulated support layer. Then the substrate is removed.

公开(公告)号：US20220216171A1

公开(公告)日：2022-07-07

申请号：US17560583

申请日：2021-12-23

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Chaojun DENG ,  Xiaoyun WEI ,  Yong YANG

IPC: H01L23/00 ,  H01L23/15 ,  H01L23/498 ,  H01L25/065

Abstract: A chip package structure includes a glass substrate, a routing layer, and a plurality of dies. A first surface of the glass substrate has solder joints and a second surface of the glass substrate has substrate solder balls. The routing layer is located in the glass substrate, and the solder joints are electrically connected to the substrate solder balls by using the routing layer. Each die has chip solder balls, is located on the first surface of the glass substrate, and the solder joints are bonded to the chip solder balls. The embodiments can improve connection reliability between the die and the glass substrate and can reduce a signal transmission loss.

公开(公告)号：US20220171424A1

公开(公告)日：2022-06-02

申请号：US17529823

申请日：2021-11-18

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Wei WU ,  Jinhui WANG ,  Hao LI ,  Yong YANG ,  Xinhua HUANG

IPC: G06F1/04 ,  H03H9/215

Abstract: A clock oscillator, a clock oscillator production method and use method, and a chip including the clock oscillator are provided. The clock oscillator includes a resonator, a shock-absorbing material layer, and a base, and at least a part of the shock-absorbing material layer is located between the resonator and the base. In the clock oscillator, the shock-absorbing material layer is added between the resonator and the base, and the shock-absorbing material layer can effectively prevent a mechanical wave from being conducted between the base and the resonator, so that the resonator is protected from external vibration. This can ensure, when there is external vibration, that an output frequency of the resonator is not deteriorated and improve shock absorption performance of the clock oscillator.

公开(公告)号：US20220102237A1

公开(公告)日：2022-03-31

申请号：US17473673

申请日：2021-09-13

Applicant: HUAWEI TECHNOLOGIES CO., LTD.

Inventor： Chaojun DENG ,  Xiaoyun WEI ,  Yong YANG ,  Jiye XU ,  Xing FU

IPC: H01L23/367 ,  H01L23/498 ,  H01L23/00

Abstract: Embodiments of this application provide a chip and a manufacturing method thereof, and an electronic device, and belong to the field of chip heat dissipation technologies. The chip includes a die and a thermal conductive sheet. An active surface of the die is connected to the thermal conductive sheet by using a first bonding layer. Heat generated at a part with a relatively high temperature on the active surface of the die can be quickly conducted and dispersed by using the thermal conductive sheet, so that temperatures on the active surface are evenly distributed to avoid an excessively high local temperature of the chip, thereby preventing running of the chip from being affected.