公开(公告)号：US3512050A

公开(公告)日：1970-05-12

申请号：US3512050D

申请日：1967-11-29

Applicant: GEN MOTORS CORP

Inventor： BURTON ROBERT M ,  LAKE DONALD E ,  SAYERS EUGENE H

IPC: H01L23/40 ,  H01L23/488 ,  H01L1/12 ,  H01L1/14

CPC classification number: H01L23/4006 ,  H01L23/488 ,  H01L2023/4031 ,  H01L2023/405 ,  H01L2924/0002 ,  H01L2924/00

公开(公告)号：US3679946A

公开(公告)日：1972-07-25

申请号：US3679946D

申请日：1970-07-06

Applicant: GEN MOTORS CORP

Inventor： BUCK ROBERT E ,  METZGER ROBERT W JR ,  RITTMANN ALBERT D ,  SAYERS EUGENE H

IPC: H01L23/495 ,  H01L3/00 ,  H01L5/00

CPC classification number: H01L23/49562 ,  H01L23/49568 ,  H01L24/45 ,  H01L24/97 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/49171 ,  H01L2924/1301 ,  H01L2924/181 ,  Y10T29/49121 ,  Y10T428/12194 ,  Y10T428/12201 ,  Y10T428/12361 ,  Y10T428/12368 ,  Y10T428/12431 ,  Y10T428/12528 ,  Y10T428/12889 ,  Y10T428/12903 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/2076

Abstract: A semiconductor package assembly and method of making it. A semiconductive element is mounted on a flat strip. A portion of the strip is partially separated from, and raised above the plane of, the strip. The raised portion is eventually completely separated from the strip, and forms a terminal member for the semiconductive element. The element and connection to the terminal are enclosed, perferably in a plastic potting. Means are provided to increase the rigidity of the strip in the enclosure area. Means are also provided to enhance adhesion of a plastic potting to the strip and terminal members. A plurality of devices can be simultaneously or successively formed from a single strip. Multiple terminal devices can be formed using adjacent multiple raised portions on the strip.

Abstract translation: 一种半导体封装组件及其制造方法。 半导体元件安装在平板上。 条带的一部分与带的平面部分地分离并升高。 凸起部分最终完全与条带分离，并且形成用于半导体元件的端子部件。 元件和与端子的连接被封闭，最好在一个塑料灌封中。 提供装置以增加包围区域中条带的刚度。 还提供了用于增强塑料灌封件与带材和端子构件的粘合性的手段。 可以从单个条带同时或连续地形成多个装置。 可以使用条带上的相邻多个凸起部分形成多个终端设备。

公开(公告)号：US3581387A

公开(公告)日：1971-06-01

申请号：US3581387D

申请日：1967-11-29

Applicant: GEN MOTORS CORP

Inventor： BUCK ROBERT E ,  RITTMANN ALBERT D ,  SAYERS EUGENE H ,  METZGER ROBERT W JR

IPC: H01L23/495 ,  B01J17/00 ,  H01L1/14 ,  H01L5/02

CPC classification number: H01L23/49568 ,  H01L23/49562 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2924/1301 ,  Y10T29/49172 ,  Y10T29/49829 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD OF MAKING IT. A SEMICONDUCTIVE ELEMENT IS MOUNTED ON A FLAT STRIP. A PORTION OF THE STRIP IS PARTIALLY SEPARATED FROM, AND RAISED ABOVE THE PLANE OF, THE STRIP. THE RAISED PORTION IS EVENTUALLY COMPLETELY SEPARATED FROM THE STRIP, AND FORMS A TERMINAL MEMBER FOR THE SEMICONDUCTIVE ELEMENT. THE ELEMENT AND CONNECTION TO THE TERMINAL ARE ENCLOSED, PREFERABLY IN A PLASTIC POTTING. MEANS ARE PROVIDED TO INCREASE THE RIGIDITY OF THE STRIP IN THE ENCLOSURE AREA. MEANS ARE ALSO PROVIDED TO ENHANCE ADHESION OF A PLASTIC POTTING TO THE STRIP AND TERMINAL MEMBERS. A PLURALITY OF DEVICES CAN BE SIMULTANEOUSLY OR SUCCESSIVELY FORMED FROM A SINGLE STRIP. MULITPLE TERMINAL DEVICES CAN BE FORMED USING ADJACENT MULTIPLE RAISED PORTIONS ON THE STRIP.