A SEMICONDUCTOR PACKAGE ASSEMBLY AND METHOD OF MAKING IT. A SEMICONDUCTIVE ELEMENT IS MOUNTED ON A FLAT STRIP. A PORTION OF THE STRIP IS PARTIALLY SEPARATED FROM, AND RAISED ABOVE THE PLANE OF, THE STRIP. THE RAISED PORTION IS EVENTUALLY COMPLETELY SEPARATED FROM THE STRIP, AND FORMS A TERMINAL MEMBER FOR THE SEMICONDUCTIVE ELEMENT. THE ELEMENT AND CONNECTION TO THE TERMINAL ARE ENCLOSED, PREFERABLY IN A PLASTIC POTTING. MEANS ARE PROVIDED TO INCREASE THE RIGIDITY OF THE STRIP IN THE ENCLOSURE AREA. MEANS ARE ALSO PROVIDED TO ENHANCE ADHESION OF A PLASTIC POTTING TO THE STRIP AND TERMINAL MEMBERS. A PLURALITY OF DEVICES CAN BE SIMULTANEOUSLY OR SUCCESSIVELY FORMED FROM A SINGLE STRIP. MULITPLE TERMINAL DEVICES CAN BE FORMED USING ADJACENT MULTIPLE RAISED PORTIONS ON THE STRIP.