-
公开(公告)号：US12109335B2
公开(公告)日：2024-10-08
申请号：US16811636
申请日：2020-03-06
IPC分类号： A61K9/16 , A61B5/00 , A61B8/00 , A61B8/12 , A61L31/02 , A61L31/06 , A61L31/12 , A61L31/14 , C08G77/00 , C08L83/04 , G01S15/89 , G10K11/30
CPC分类号： A61L31/129 , A61B5/0095 , A61B8/12 , A61B8/4444 , A61L31/028 , A61L31/06 , A61L31/128 , A61L31/14 , C08G77/70 , C08L83/04 , G01S15/8906 , G10K11/30 , C08L2205/025 , C08L2205/03
摘要： A composition for an acoustic wave probe, containing the following ingredients (A) to (D): (A) a linear polysiloxane having a vinyl group; (B) a linear polysiloxane having two or more Si—H groups in a molecular chain; (C) a polysiloxane resin; and (D) surface-treated silica particles having an average primary particle diameter more than 16 nm and less than 100 nm, as well as, a silicone resin for an acoustic wave probe, an acoustic wave probe, an ultrasound probe, an acoustic wave measurement apparatus, an ultrasound diagnostic apparatus, a photoacoustic wave measurement apparatus, and an ultrasound endoscope, using the composition for an acoustic wave probe.
-
公开(公告)号：US20230134997A1
公开(公告)日：2023-05-04
申请号：US17989770
申请日：2022-11-18
IPC分类号： H01L25/075 , H01L21/68 , H01L33/00
摘要： A method for transferring alignment marks between substrate systems includes providing a substrate having semiconductor devices and alignment marks in precise alignment with the semiconductor devices; and physically transferring and bonding the semiconductor devices and the alignment marks to a temporary substrate of a first substrate system. The method can also include physically transferring and bonding the semiconductor devices and the alignment marks to a mass transfer substrate of a second substrate system; and physically transferring and bonding the semiconductor devices and the alignment marks to a circuitry substrate of a third substrate system. A system for transferring alignment marks between substrate systems includes the substrate having the semiconductor devices and the alignment marks in precise alignment with the semiconductor devices. The system also includes the first substrate system, and can include the second substrate system and the third substrate system.
-
3.发明授权公开(公告)号：US11417799B2
公开(公告)日：2022-08-16
申请号：US16987478
申请日：2020-08-07
发明人： Chen-Fu Chu , Shih-Kai Chan , Yi-Feng Shih , David Trung Doan , Trung Tri Doan , Yoshinori Ogawa , Kohei Otake , Kazunori Kondo , Keiji Ohori , Taichi Kitagawa , Nobuaki Matsumoto , Toshiyuki Ozai , Shuhei Ueda
摘要： A method for fabricating light emitting diode (LED) dice includes the steps of: providing a substrate, and forming a plurality of die sized semiconductor structures on the substrate. The method also includes the steps of providing a receiving plate having an elastomeric polymer layer, placing the substrate and the receiving plate in physical contact with an adhesive force applied by the elastomeric polymer layer, and performing a laser lift-off (LLO) process by directing a uniform laser beam through the substrate to the semiconductor layer at an interface with the substrate to lift off the semiconductor structures onto the elastomeric polymer layer. During the laser lift-off (LLO) process the elastomeric polymer layer functions as a shock absorber to reduce momentum transfer, and as an adhesive surface to hold the semiconductor structures in place on the receiving plate.
-
公开(公告)号：US11124680B2
公开(公告)日：2021-09-21
申请号：US16619850
申请日：2018-05-07
摘要： An ultraviolet-curable pressure-sensitive silicone adhesive composition which comprises: 100 parts of an organopolysiloxane (A) having, in the molecule, two groups represented by general formula (1) (wherein R1 represents a C1-20 monovalent hydrocarbon group, R2 represents an oxygen atom, etc., R3 represents an acryloyloxyalkyl group, etc., p and a respectively indicate numbers satisfying 0≤p≤10 and 1≤a≤3); 1-500 parts of a monofunctional (meth)acrylate compound (B) containing no siloxane structure and/or a polyfunctional (meth)acrylate compound (C) containing no siloxane structure; 1-5,000 parts of an oranopolysiloxane resin (D) comprising R43SiO1/2 units (a) (wherein R4 represents a C1-10 monovalent hydrocarbon group) and SiO4/2 units (b), the (a)/(b) molar ratio being (0.6-1.2)/1; and 0.01-20 parts of a photopolymerization initiator (E). This composition has satisfactory applicability and curability and gives a cured object which, when used as a temporary fixer, has excellent tackiness and strength.
-
公开(公告)号：US09481818B2
公开(公告)日：2016-11-01
申请号：US14889693
申请日：2014-04-17
发明人： Nobuaki Matsumoto
IPC分类号： C09J183/06 , C08L83/04 , C09J9/00 , C09J11/04 , C09K5/08 , H01L23/29 , C08G77/12 , C08G77/20 , C08K7/18
CPC分类号： C09J183/06 , C08G77/12 , C08G77/20 , C08K3/013 , C08K3/36 , C08K5/56 , C08K7/18 , C08K2003/2227 , C08K2003/2296 , C08L83/00 , C08L83/04 , C08L2205/025 , C08L2205/035 , C09J9/00 , C09J11/04 , C09K5/08 , H01L23/296 , H01L2924/0002 , C08K3/0033 , H01L2924/00
摘要： Thermally-conductive silicone composition, a cured material of which does not impose stress to integrated-circuit packages even upon standing at high temperature, and semi-conductor device provided with cured material obtained by curing the composition, the composition comprising(A) 100 parts by mass of an organopolysiloxane having ≧2 alkenyl groups per molecule and a dynamic viscosity at 25° C. of 10-100,000 mm2/s,(B) an organohydrogenpolysiloxane of formula (1): (C) an organohydrogenpolysiloxane of formula (2): (D) an organohydrogenpolysiloxane of formula (3): (E) 400-3000 parts by mass of thermally conductive filler,(F) a catalytic amount of platinum group metal catalyst, and(G) 0.01-1 part by mass of reaction retardant,wherein the variables in formulas (1)-(3) are as defined in the specification and the amounts of components (B)-(D) enable satisfaction of the relationships regarding Si—H groups and alkenyl groups in components (A)-(D) are as defined in the specification.
摘要翻译： 其中式（1） - （3）中的变量如说明书中所定义，并且组分（B） - （D）的量使得能够满足组分（A）中的Si-H基和烯基的关系 - （ D）如说明书中所定义。
-
公开(公告)号：US20150148273A1
公开(公告)日：2015-05-28
申请号：US14396656
申请日：2013-03-15
IPC分类号： C10M169/04
CPC分类号： C10M169/044 , C08G77/12 , C08G77/18 , C08G77/20 , C08K3/36 , C08K5/56 , C08K2003/2227 , C08K2201/001 , C08L83/00 , C08L83/04 , C10M2201/05 , C10M2201/06 , C10M2229/041 , C10M2229/0435 , C10M2229/047 , C10N2250/10
摘要： Provided is a thermally-curable heat-conductive silicone grease composition which has a high shape-retaining property in an early stage even when the viscosity of the composition is low (i.e., the composition is easy to apply) in the early stage, and which becomes soft (has low hardness) after being cured. A thermally-curable heat-conductive silicone grease composition comprising, as essential components: (A) an organopolysiloxane having a viscosity of 100 to 100,000 mPa·s at 25° C. and containing at least one alkenyl group per molecule; (B) an organopolysiloxane represented by general formula (1) (wherein R1 represents a monovalent hydrocarbon group; R2 represents an alkyl group, an alkoxyalkyl group, an alkenyl group or an acyl group; n represents 2 to 100; and a represents 1 to 3); (C) an organohydrogenpolysiloxane containing at least two hydrogen atoms each directly bound to a silicon atom per molecule; (D) a catalyst selected from the group consisting of platinum and platinum compounds; (F) a heat-conductive filler having a heat conductivity of 10 W/m·° C. or more; and (G) a silica micropowder.
摘要翻译： 提供一种即使在组合物的粘度低（即组合物易于涂布）的情况下也能够在早期阶段具有高的形状保持性的可热固化的导热硅油组合物，其中 固化后变软（硬度低）。 一种可热固化的导热硅氧烷润滑脂组合物，其包含作为必要组分的（A）在25℃下粘度为100至100,000mPa·s且每分子含有至少一个烯基的有机聚硅氧烷; （B）由通式（1）表示的有机聚硅氧烷（其中R1表示一价烃基; R2表示烷基，烷氧基烷基，烯基或酰基），n表示2〜100，a表示1〜 3）; （C）每分子含有至少两个氢原子直接键合到硅原子上的有机氢聚硅氧烷; （D）选自铂和铂化合物的催化剂; （F）导热性为10W / m·℃以上的导热性填料; 和（G）二氧化硅微粉。
-
公开(公告)号：US11370869B2
公开(公告)日：2022-06-28
申请号：US17265025
申请日：2019-07-11
IPC分类号： C08F290/14 , B33Y70/00 , B29C64/112 , C08F2/50
摘要： According to the present invention, an ultraviolet curable silicone composition for stereolithography, which contains
(A) an organopolysiloxane that has two groups represented by formula (1) (wherein each R1 independently represents a monovalent hydrocarbon group having 1-20 carbon atoms; R2 represents an oxygen atom or the like; R3 represents an acryloyloxyalkyl group or the like; p represents a number satisfying 0≤p≤10; and a represents a number satisfying 1≤a≤3) in each molecule, (B) an organopolysiloxane resin that is composed of (a) a unit represented by formula (2) (wherein R1-R3, a and p are as defined above), (b) an R43SiO1/2 unit (wherein each R4 independently represents a monovalent hydrocarbon group having 1-10 carbon atoms) and (c) an SiO4/2 unit, and wherein the molar ratio of the total of the unit (a) and the unit (b) to the unit (c) is within the range of 0.6-1.2:1 and (C) a photopolymerization initiator has a viscosity that is applicable to a stereolithography system such as lifting system and forms a cured product which has excellent physical properties of rubber.-
公开(公告)号：US11180680B2
公开(公告)日：2021-11-23
申请号：US16646743
申请日：2018-09-19
发明人： Kohei Otake , Nobuaki Matsumoto , Eri Asakura
摘要： This composition contains (A) 100 parts of an organopolysiloxane having two groups represented by general formula (1) (R1 represents a monovalent hydrocarbon group having 1-20 carbon atoms, R2 represents an oxygen atom or the like, R3 represents an acryloyloxyalkyl group or the like, p represents a number satisfying 0≤p≤10, and “a” represents a number satisfying 1≤a≤3) per molecule, (B) 1-500 parts of a monofunctional (meth)acrylate compound not containing a siloxane structure, (C) 1-5,000 parts of an organopolysiloxane resin containing (a) an R43SiO1/2 unit (in the formula, R4 represents a monovalent hydrocarbon group having 1-10 carbon atoms) and (b) a SiO4/2 unit, where the molar ratio of the unit (a) to the unit (b) is in the range of 0.6 to 1.2:1, (D) 1-100 parts of fine powder silica, and (E) 0.01-20 parts of an optical polymerization initiator. The compound has good shape retention properties and curability for irradiation with ultraviolet light, and provides a cured product which has excellent adhesion suitable for a temporary fixing material.
-
公开(公告)号：US20210351166A1
公开(公告)日：2021-11-11
申请号：US17241324
申请日：2021-04-27
IPC分类号： H01L25/075 , H01L33/00 , H01L21/68
摘要： A method for transferring alignment marks between substrate systems includes providing a substrate having semiconductor devices and alignment marks in precise alignment with the semiconductor devices; and physically transferring and bonding the semiconductor devices and the alignment marks to a temporary substrate of a first substrate system. The method can also include physically transferring and bonding the semiconductor devices and the alignment marks to a mass transfer substrate of a second substrate system; and physically transferring and bonding the semiconductor devices and the alignment marks to a circuitry substrate of a third substrate system. A system for transferring alignment marks between substrate systems includes the substrate having the semiconductor devices and the alignment marks in precise alignment with the semiconductor devices. The system also includes the first substrate system, and can include the second substrate system and the third substrate system.
-
公开(公告)号：US10590322B2
公开(公告)日：2020-03-17
申请号：US15579509
申请日：2016-05-25
摘要： Provided is a heat dissipation material comprising a mesogen/silicon compound (co)polymer having a number average molecular weight of 1,000-500,000, represented by general formula (1). (Ar is a mesogen group selected from the structure represented by the following formulas. a represents a positive number from 0.5 to 1, b represents a number from 0 to 0.5 (with the caveat that a and b each represent the ratio of each number of repeating units in molecules, and a+b=1). R1 is independently a monovalent hydrocarbon group which does not independently include a C1-8 aliphatic unsaturated bond. R2 is independently a hydrogen atom, —Si(CH3)3, —Si(CH3)2(OH), —Si(CH3)2(CH═CH) or —Si(CH3)2(CH2—CH═CH2)). This heat dissipation material has excellent thermal conductivity, and further shows good thermoplastic properties and has excellent moldability, and hence can be suitably used as a resin material for heat dissipation materials and semiconductor devices and electronic parts in particular.
-
-
-
-
-
-
-
-
-
搜索结果
21 条记录 (耗时 0.029 秒)
