公开(公告)号：US09323392B2

公开(公告)日：2016-04-26

申请号：US14852353

申请日：2015-09-11

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Ki Uk Kyung ,  Young Sung Kim ,  Sun Tak Park ,  Il Yeon Cho ,  Jun Seok Park

IPC: G01L9/00 ,  G06F3/042 ,  G01L1/24 ,  G01D5/26

CPC classification number: G06F3/042 ,  G01D5/268 ,  G01L1/243 ,  G01L9/0077 ,  G06F3/0421 ,  G06F2203/04109

Abstract: Disclosed are an apparatus and a method for sensing pressure using an optical waveguide sensor. The apparatus for sensing pressure using an optical waveguide sensor, includes: a light source radiating light; an optical waveguide panel emitting some of the radiated light outside through a plurality of light transmitting regions previously formed, and changing an amount of totally reflected light according to pressure applied to at least one of the plurality of light transmitting regions; a detector detecting the amount of light; and an analyzer determining intensity and a location of the pressure according to the detected amount of light.

公开(公告)号：US09018752B2

公开(公告)日：2015-04-28

申请号：US13788494

申请日：2013-03-07

Applicant: Electronics and Telecommunications Research Institute

Inventor： Ji Eun Kim ,  Yong Ki Son ,  Baesun Kim ,  Il Yeon Cho

IPC: H01L23/12 ,  H01L21/4763 ,  H05K1/03 ,  H01L23/495 ,  H05K1/11 ,  H05K3/00 ,  H01L23/48 ,  H01L23/522 ,  H01L23/14 ,  H05K3/46 ,  H01L23/498 ,  H01L23/00

CPC classification number: H05K1/0313 ,  H01L23/145 ,  H01L23/481 ,  H01L23/49572 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/4985 ,  H01L23/5226 ,  H01L24/81 ,  H01L2224/16225 ,  H01L2224/81192 ,  H05K1/038 ,  H05K1/115 ,  H05K3/0094 ,  H05K3/4635 ,  Y10T29/49165

Abstract: Provided is a circuit board, which may include a base layer, an adhesive film, a conductive circuit, and a through via. The adhesive film and the conductive circuit may be provided in plurality to be alternately stacked on the base layer. The through via may be formed through soldering. Since the base layer is not damaged during the soldering, the through via may include various conductive materials. The through via makes it possible to easily connect the conductive circuits having different functions to one another. Accordingly, the circuit board may have multi functions. Thicknesses of the conductive circuits may be adjusted to protect the conductive circuits from folding or bending of the base layer. The circuit board having a multi-layered structure can function not only as a fabric or clothes but also as an electronic circuit.

Abstract translation: 提供一种电路板，其可以包括基底层，粘合剂膜，导电电路和通孔。 粘合膜和导电电路可以多个设置成交替堆叠在基底层上。 通孔可以通过焊接形成。 由于在焊接期间基底层不被损坏，通孔可以包括各种导电材料。 通孔使得可以容易地将具有不同功能的导电电路彼此连接。 因此，电路板可以具有多种功能。 可以调节导电电路的厚度，以保护导电电路免受基层的折叠或弯曲。 具有多层结构的电路板不仅可以作为织物或衣服而且可以用作电子电路。