公开(公告)号：US11367665B2

公开(公告)日：2022-06-21

申请号：US16633368

申请日：2018-07-24

Applicant: CORNING INCORPORATED

Inventor： Heather Debra Boek ,  Paul Bennett Dohn ,  Jin Su Kim ,  Aize Li ,  Hugh Michael McMahon ,  Jun Ro Yoon

IPC: H01L23/495 ,  H01L23/13 ,  B32B17/06 ,  B81B1/00 ,  C03C3/087 ,  C03C3/091 ,  C03C3/093 ,  C03C3/097 ,  C03C15/00 ,  H01L21/48 ,  H01L23/15 ,  H01L23/498 ,  C03C23/00

Abstract: The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.

公开(公告)号：US11584683B2

公开(公告)日：2023-02-21

申请号：US16491363

申请日：2018-03-09

Applicant: CORNING INCORPORATED

Inventor： Seo-Yeong Cho ,  Kyung-jin Lee ,  Yoon-seuk Oh ,  Jun Ro Yoon

IPC: C03C15/00 ,  C03C17/36 ,  C03C21/00

Abstract: A method of fabricating a metal thin film-on-glass structure. A glass substrate, on a top surface of which a layer is formed, is prepared. A local area of the glass substrate is etched from a bottom of the glass substrate to expose the layer downwardly, thereby forming an exposed area of the layer. The layer is a metal thin film. The etching includes first-etching the glass substrate to a depth less than a thickness of the glass substrate using a first etching solution containing hydrofluoric acid and at least one of nitric acid and sulfuric acid, resulting in a first-etched portion of the glass substrate; and second-etching the first-etched portion of the glass substrate using an etching solution containing hydrofluoric acid without nitric acid or sulfuric acid, so that the layer is exposed downwardly, whereby the metal thin film is supported by a remaining portion of the glass substrate.

公开(公告)号：US20220140227A1

公开(公告)日：2022-05-05

申请号：US17515630

申请日：2021-11-01

Applicant: CORNING INCORPORATED

Inventor： Indrani Bhattacharyya ,  Julia Anne Dorothee Brueckner ,  Ya-Huei Chang ,  Bokyung Kong ,  Prantik Mazumder ,  Jun Ro Yoon ,  Jian-Zhi Jay Zhang

IPC: H01L41/312 ,  H01L41/337 ,  H01L41/187 ,  H01L41/08

Abstract: An article including a support unit, the support unit including a support substrate and a bonding layer such that the bonding layer is bonded to a surface of the support substrate. Furthermore, a total thickness variation TTV across a width of the support unit is about 2.0 microns or less.

公开(公告)号：US20200235020A1

公开(公告)日：2020-07-23

申请号：US16633368

申请日：2018-07-24

Applicant: CORNING INCORPORATED

Inventor： Heather Debra Boek ,  Paul Bennett Dohn ,  Jin Su Kim ,  Aize Li ,  Hugh Michael McMahon ,  Jun Ro Yoon

IPC: H01L23/13 ,  C03C15/00 ,  B32B17/06 ,  C03C3/087 ,  C03C3/091 ,  C03C3/093 ,  C03C3/097 ,  H01L23/15 ,  H01L23/498 ,  B81B1/00 ,  H01L21/48

Abstract: The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.