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公开(公告)号：US20200235020A1
公开(公告)日：2020-07-23
申请号：US16633368
申请日：2018-07-24
Applicant: CORNING INCORPORATED
Inventor： Heather Debra Boek , Paul Bennett Dohn , Jin Su Kim , Aize Li , Hugh Michael McMahon , Jun Ro Yoon
IPC: H01L23/13 , C03C15/00 , B32B17/06 , C03C3/087 , C03C3/091 , C03C3/093 , C03C3/097 , H01L23/15 , H01L23/498 , B81B1/00 , H01L21/48
Abstract: The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.
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公开(公告)号：US20190263708A1
公开(公告)日：2019-08-29
申请号：US16307797
申请日：2017-06-06
Applicant: CORNING INCORPORATED
Inventor： Dana Craig Bookbinder , David Alan Deneka , Paul Bennett Dohn , Paul Oakley Johnson , William Edward Lock , David John McEnroe , Pushkar Tandon , Natesan Venkataraman , Sam Samer Zoubi
IPC: C03B23/203 , C03B23/03 , C03B23/025
Abstract: According to one or more embodiments described herein, a three-dimensional laminate glass article may be manufactured by a process which may include heating a glass stack including at least two glass sheets that are unbonded with one another at a first temperature range, fusing the first glass sheet with the second glass sheet by heating the glass stack at a second temperature range, and shaping the glass stack. The first temperature range may be from about 150° C. to about 400° C. for a first period of time of at least about 5 minutes. The second temperature range may be from about 400° C. to about 1200° C.
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公开(公告)号：US20200018459A1
公开(公告)日：2020-01-16
申请号：US16464450
申请日：2017-11-28
Applicant: CORNING INCORPORATED
Inventor： Paul Bennett Dohn , Jin Su Kim
Abstract: A strengthened glass cover for a light fixture includes a glass core layer, a first glass cladding layer fused to a first surface of the glass core layer, and a second glass cladding layer fused to a second surface of the glass core layer. A coefficient of thermal expansion (CTE) of the glass core layer is greater than a CTE of each of the first glass cladding layer and the second glass cladding layer, whereby the glass core layer is in tension and each of the first glass cladding layer and the second glass cladding layer is in compression. A light fixture includes a housing and the cover coupled to the housing.
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公开(公告)号：US11527452B2
公开(公告)日：2022-12-13
申请号：US17743643
申请日：2022-05-13
Applicant: CORNING INCORPORATED
Inventor： Heather Debra Boek , Paul Bennett Dohn , Jin Su Kim , Aize Li , Hugh Michael McMahon , Jun-Ro Yoon
IPC: H01L23/495 , H01L23/13 , B81B1/00 , C03C3/087 , C03C3/091 , C03C3/093 , C03C3/097 , C03C15/00 , H01L21/48 , H01L23/15 , H01L23/498 , B32B17/06 , C03C23/00
Abstract: The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.
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Patent Agency Ranking
公开(公告)号：US20200307173A1
公开(公告)日：2020-10-01
申请号：US16307786
申请日：2017-06-07
Applicant: CORNING INCORPORATED
Inventor： Paul Bennett Dohn , Vladislav Yuryevich Golyatin , Butchi Reddy Vaddi , Natesan Venkataraman
Abstract: According to one or more embodiments described herein, a laminate glass article may be produced by a method that includes providing a first glass sheet and a second glass sheet, assembling the first glass sheet and second glass sheet into a glass stack, and bonding the first glass sheet to the second glass sheet to form the laminate glass article. In one or more embodiments, an intermediate layer may be positioned between the first bonding surface and the second bonding surface, the first bonding surface and the second bonding surface may be roughened surfaces, or the first bonding surface and the second bonding surface may be chemically treated by vacuum deposition.
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公开(公告)号：US20220278005A1
公开(公告)日：2022-09-01
申请号：US17743643
申请日：2022-05-13
Applicant: CORNING INCORPORATED
Inventor： Heather Debra Boek , Paul Bennett Dohn , Jin Su Kim , Aize Li , Hugh Michael McMahon , Jun-Ro Yoon
IPC: H01L23/13 , B32B17/06 , B81B1/00 , C03C3/087 , C03C3/091 , C03C3/093 , C03C3/097 , C03C15/00 , H01L21/48 , H01L23/15 , H01L23/498
Abstract: The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.
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公开(公告)号：US11367665B2
公开(公告)日：2022-06-21
申请号：US16633368
申请日：2018-07-24
Applicant: CORNING INCORPORATED
Inventor： Heather Debra Boek , Paul Bennett Dohn , Jin Su Kim , Aize Li , Hugh Michael McMahon , Jun Ro Yoon
IPC: H01L23/495 , H01L23/13 , B32B17/06 , B81B1/00 , C03C3/087 , C03C3/091 , C03C3/093 , C03C3/097 , C03C15/00 , H01L21/48 , H01L23/15 , H01L23/498 , C03C23/00
Abstract: The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.
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公开(公告)号：US20180155236A1
公开(公告)日：2018-06-07
申请号：US15578055
申请日：2016-06-01
Applicant: CORNING INCORPORATED
Inventor： Megan Aurora DeLamielleure , Paul Bennett Dohn , Timothy James Kiczenski , Irene Mona Peterson , Robert Anthony Schaut , Elizabeth Mary Sturdevant , Natesan Venkataraman
CPC classification number: C03C14/006 , B32B17/06 , B32B17/10036 , B32B2307/418 , C03B5/16 , C03B5/163 , C03B17/02 , C03B17/064 , C03C3/091 , C03C2214/16 , C03C2214/30
Abstract: According to embodiments disclosed herein, light-scattering laminated glass articles may include a first glass layer, a second glass layer, and a light-scattering component. The first glass layer may be formed from a first glass composition. The second glass layer may be formed from a second glass composition and fused to the first glass layer. The light-scattering component may be disposed at an interface of the first glass layer and the second glass layer. The light-scattering component may include a different composition or material phase than the first glass layer and the second glass layer. Also disclosed herein are methods for producing light-scattering laminated glass articles.
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公开(公告)号：US20180154615A1
公开(公告)日：2018-06-07
申请号：US15578128
申请日：2016-06-01
Applicant: CORNING INCORPORATED
Inventor： Paul Bennett Dohn , Viadislav Yuryevich Golyatin , Butchi Reddy Vaddi , Natesan Venkataraman
CPC classification number: B32B17/10137 , B32B17/10036 , B32B17/10091 , B32B17/10247 , B32B17/10266 , B32B17/10743 , B32B17/10761 , B32B17/1077 , B32B17/10788 , B32B37/08 , B32B2309/105 , B32B2605/006
Abstract: A glass laminate includes a first pane having a glass-glass laminate structure, a second pane, and an interlayer disposed between the first pane and the second pane and including a polymeric material.
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