公开(公告)号：US20200235020A1

公开(公告)日：2020-07-23

申请号：US16633368

申请日：2018-07-24

Applicant: CORNING INCORPORATED

Inventor： Heather Debra Boek ,  Paul Bennett Dohn ,  Jin Su Kim ,  Aize Li ,  Hugh Michael McMahon ,  Jun Ro Yoon

IPC: H01L23/13 ,  C03C15/00 ,  B32B17/06 ,  C03C3/087 ,  C03C3/091 ,  C03C3/093 ,  C03C3/097 ,  H01L23/15 ,  H01L23/498 ,  B81B1/00 ,  H01L21/48

Abstract: The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.

公开(公告)号：US20240140854A1

公开(公告)日：2024-05-02

申请号：US18279254

申请日：2022-03-01

Applicant: CORNING INCORPORATED

Inventor： Qiang Fu ,  Aize Li ,  Hugh Michael McMahon

IPC: C03C3/078 ,  C03B37/02 ,  C03C3/062 ,  C03C3/097 ,  C03C3/112 ,  C03C4/00

CPC classification number: C03C3/078 ,  C03B37/02 ,  C03C3/062 ,  C03C3/097 ,  C03C3/112 ,  C03C4/0021

Abstract: A silicate-based glass composition includes 15-65 wt. % SiO2, 2.5-25 wt. % MgO, 1-30 wt. % P2O5, and 15-50 wt. % CaO, such that the composition has a hydrolytic resistance of glass grains (HGB) of at most 3, when measured by International Organization for Standardization section 719 (ISO 719) and forms a bioactive crystalline phase in a simulated body fluid.

公开(公告)号：US11527452B2

公开(公告)日：2022-12-13

申请号：US17743643

申请日：2022-05-13

Applicant: CORNING INCORPORATED

Inventor： Heather Debra Boek ,  Paul Bennett Dohn ,  Jin Su Kim ,  Aize Li ,  Hugh Michael McMahon ,  Jun-Ro Yoon

IPC: H01L23/495 ,  H01L23/13 ,  B81B1/00 ,  C03C3/087 ,  C03C3/091 ,  C03C3/093 ,  C03C3/097 ,  C03C15/00 ,  H01L21/48 ,  H01L23/15 ,  H01L23/498 ,  B32B17/06 ,  C03C23/00

Abstract: The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.

公开(公告)号：US20240366482A1

公开(公告)日：2024-11-07

申请号：US18642098

申请日：2024-04-22

Applicant: CORNING INCORPORATED

Inventor： Erin Coon ,  Qiang Fu ,  Aize Li ,  Hugh Michael McMahon ,  Charisse Marye Spier ,  Nicholas Michael Stone-Weiss ,  Joanna E. Warzyszynska

IPC: A61K8/24 ,  A61K8/19 ,  A61K8/25 ,  A61Q11/00 ,  C03C3/062 ,  C03C3/097 ,  C03C3/112 ,  C03C4/00

Abstract: An aqueous dentifrice formulation, comprising: a bioactive glass exhibiting at least one of: a hydrolytic resistance of glass grains (HGB) of at most 4, when measured by International Organization for Standardization section 719 (ISO 719); a weight loss of 5 wt. % or less after soaking 5 g of the bioactive glass in powder form in 100 mL of deionized water for 7 days at 37° C.; an XRD spectrum substantially free of crystalline phase after soaking 5 g of the bioactive glass in powder form in 100 mL of deionized water for 7 days at 37° C.; or any combination thereof; wherein, when the bioactive glass is contacted with artificial saliva, the bioactive glass forms a bioactive crystalline phase. A method of using the aqueous dentifrice formulation to remineralize enamel of the tooth, treat caries of the tooth, treat dentin hypersensitivity of the tooth, or any combination thereof.

公开(公告)号：US20220278005A1

公开(公告)日：2022-09-01

申请号：US17743643

申请日：2022-05-13

Applicant: CORNING INCORPORATED

Inventor： Heather Debra Boek ,  Paul Bennett Dohn ,  Jin Su Kim ,  Aize Li ,  Hugh Michael McMahon ,  Jun-Ro Yoon

IPC: H01L23/13 ,  B32B17/06 ,  B81B1/00 ,  C03C3/087 ,  C03C3/091 ,  C03C3/093 ,  C03C3/097 ,  C03C15/00 ,  H01L21/48 ,  H01L23/15 ,  H01L23/498

Abstract: The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.

公开(公告)号：US11367665B2

公开(公告)日：2022-06-21

申请号：US16633368

申请日：2018-07-24

Applicant: CORNING INCORPORATED

Inventor： Heather Debra Boek ,  Paul Bennett Dohn ,  Jin Su Kim ,  Aize Li ,  Hugh Michael McMahon ,  Jun Ro Yoon

IPC: H01L23/495 ,  H01L23/13 ,  B32B17/06 ,  B81B1/00 ,  C03C3/087 ,  C03C3/091 ,  C03C3/093 ,  C03C3/097 ,  C03C15/00 ,  H01L21/48 ,  H01L23/15 ,  H01L23/498 ,  C03C23/00

Abstract: The present disclosure relates to a reconstituted wafer- and/or panel-level package comprising a glass substrate having a plurality of cavities. Each cavity is configured to hold a single IC chip. The reconstituted wafer- and/or panel-level package can be used in a fan-out wafer or panel level packaging process. The glass substrate can include at least two layers having different photosensitivities with one layer being sufficiently photosensitive to be capable of being photomachined to form the cavities.