ARRAY SUBSTRATE AND REPAIRING METHOD THEREOF

    公开(公告)号:US20180294289A1

    公开(公告)日:2018-10-11

    申请号:US15567193

    申请日:2016-10-14

    Inventor: Ming Wang Jun Wang

    Abstract: The present application discloses an array substrate including a first signal line layer having a plurality of rows of first signal lines; a second signal line layer having a plurality of columns of second signal lines; the plurality of rows of first signal lines crossing over the plurality of columns of second signal lines defining a plurality of subpixels; a first insulating layer and a second insulating layer between the first signal line layer and the second signal line layer; the first insulating layer on a side of the second insulating layer proximal to the first signal line layer; a repair line between the first insulating layer and the second insulating layer, the repair line corresponding to one of the plurality of columns of second signal lines; and a first via and a second via extending through the second insulating layer; the repair line being electrically connected to the corresponding one of the plurality of columns of second signal lines through the first via and the second via, respectively.

    Display substrate, preparation method therefor, and display device

    公开(公告)号:US11616113B2

    公开(公告)日:2023-03-28

    申请号:US16966847

    申请日:2020-01-03

    Abstract: A method of manufacturing a display substrate includes: providing a base substrate; and forming a base insulating layer, a first conductive layer and an interlayer insulating layer that are sequentially stacked on top of one another at a side of the base substrate. The first conductive layer includes at least one break face, the base insulating layer includes a portion extending outward with respect to each of the at least one break face, and the break face and the corresponding portion extending outward constitute an unevenness portion having a stepped shape. The interlayer insulating layer covers at least the unevenness portion(s). Forming the interlayer insulating layer, includes: forming a first insulating sub-layer and a second insulating sub-layer that are sequentially stacked on top of one another; and forming one of the first insulating sub-layer and the second insulating sub-layer by curing a flowable insulating material.

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