公开(公告)号：US20220336270A1

公开(公告)日：2022-10-20

申请号：US17810466

申请日：2022-07-01

Applicant: Applied Materials, Inc.

Inventor： Ludovic GODET ,  Wayne MCMILLAN ,  Rutger MEYER TIMMERMAN THIJSSEN ,  Naamah ARGAMAN ,  Tapashree ROY ,  Sage Toko Garrett DOSHAY

IPC: H01L21/768 ,  H01L21/3213 ,  H01L21/311 ,  H01L25/04 ,  H01L25/16

Abstract: Systems and methods herein are related to the formation of optical devices including stacked optical element layers using silicon wafers, glass, or devices as substrates. The optical elements discussed herein can be fabricated on temporary or permanent substrates. In some examples, the optical devices are fabricated to include transparent substrates or devices including charge-coupled devices (CCD), or complementary metal-oxide semiconductor (CMOS) image sensors, light-emitting diodes (LED), a micro-LED (uLED) display, organic light-emitting diode (OLED) or vertical-cavity surface-emitting laser (VCSELs). The optical elements can have interlayers formed in between optical element layers, where the interlayers can range in thickness from 1 nm to 3 mm.

公开(公告)号：US20220018792A1

公开(公告)日：2022-01-20

申请号：US17360715

申请日：2021-06-28

Applicant: Applied Materials, Inc.

Inventor： Sage Toko Garrett DOSHAY ,  Rutger MEYER TIMMERMAN THIJSSEN

IPC: G01N23/2251 ,  G01N21/956 ,  H01J37/28

Abstract: Embodiments of the present disclosure relate to optical devices having one or more metrology features and a method of optical device metrology that provides for metrology tool location recognition with negligible impact to optical performance of the optical devices. The optical device includes one or more target features. The target features described herein provide for metrology tool location recognition with negligible impact to optical performance of the optical devices. In metrology processes, the target features allow for metrology tools to determine one or more locations of the optical device having a macroscale surface area. The target features correspond to one or more structures merged together, one or more structures merged together surrounded by one or more structures that have been removed, or one or more structures that have been removed having one or more profiles defined by adjacent structures to the target features.

公开(公告)号：US20230280511A1

公开(公告)日：2023-09-07

申请号：US18314953

申请日：2023-05-10

Applicant: Applied Materials, Inc.

Inventor： Sage Toko Garrett DOSHAY ,  Rutger MEYER TIMMERMAN THIJSSEN ,  Ludovic GODET ,  Chien-An CHEN ,  Pinkesh Rohit SHAH

IPC: G02B5/20

CPC classification number: G02B5/20 ,  G02B2207/101

Abstract: Embodiments of the present disclosure relate to methods for fabricating optical devices. One embodiment of the method includes disposing a structure material layer on a surface of a substrate and disposing a patterned photoresist over the structure material layer. The patterned photoresist has at least one device portion and at least one auxiliary portion. Each device portion and each auxiliary portion exposes unmasked portions of the structure material layer. The unmasked portions of structure material layer corresponding to each device portion and each auxiliary portion are etched. The etching the unmasked portions forms at least one optical device having device structures corresponding to the unmasked portions of at least one device portion and at least one auxiliary region having auxiliary structures corresponding to the unmasked portions of at least one auxiliary portion.

公开(公告)号：US20200286778A1

公开(公告)日：2020-09-10

申请号：US16882177

申请日：2020-05-22

Applicant: Applied Materials, Inc.

Inventor： Ludovic GODET ,  Wayne MCMILLAN ,  Rutger MEYER TIMMERMAN THIJSSEN ,  Naamah ARGAMAN ,  Tapashree ROY ,  Sage Toko Garrett DOSHAY

IPC: H01L21/768 ,  H01L21/3213 ,  H01L21/311 ,  H01L25/04 ,  H01L25/16

Abstract: Systems and methods herein are related to the formation of optical devices including stacked optical element layers using silicon wafers, glass, or devices as substrates. The optical elements discussed herein can be fabricated on temporary or permanent substrates. In some examples, the optical devices are fabricated to include transparent substrates or devices including charge-coupled devices (CCD), or complementary metal-oxide semiconductor (CMOS) image sensors, light-emitting diodes (LED), a micro-LED (uLED) display, organic light-emitting diode (OLED) or vertical-cavity surface-emitting laser (VCSELs). The optical elements can have interlayers formed in between optical element layers, where the interlayers can range in thickness from 1 nm to 3 mm.

公开(公告)号：US20220018998A1

公开(公告)日：2022-01-20

申请号：US17371429

申请日：2021-07-09

Applicant: Applied Materials, Inc.

Inventor： Sage Toko Garrett DOSHAY ,  Naamah ARGAMAN

IPC: G02B5/00

Abstract: Embodiments of the present disclosure generally relate to optical devices. Specifically, embodiments of the present disclosure relate to optical devices with one or more optical component circuits. The optical devices including one or more optical component circuits prevent the user from exposure to light when a conductive pathway is interrupted via aperture breakage, for example, from the user dropping the substrate, or from the user dropping the optical device. The conductive pathway allows for current to flow from a power source through the apertures and to one or more light sources and, in some embodiments, one or more light detectors. Aperture breakage resulting in the interruption of the conductive pathway prevents current from being provided to the one or more light sources and/or one or more light detectors to prevent (e.g., automatically prevent) light exposure to the user.

公开(公告)号：US20220011471A1

公开(公告)日：2022-01-13

申请号：US17354667

申请日：2021-06-22

Applicant: Applied Materials, Inc.

Inventor： Sage Toko Garrett DOSHAY ,  Kenichi OHNO ,  Rutger MEYER TIMMERMAN THIJSSEN ,  Russell Chin Yee TEO ,  Jinrui GUO

IPC: G02B3/08 ,  C03C15/00

Abstract: Embodiments described herein relate to encapsulated optical devices and methods of forming optical devices with controllable air-gapped encapsulation. In one embodiment, a plurality of openings are formed in a support layer surrounding the plurality of optical device structures to create a high refractive index contrast between the optical device structures, the support layer, and the openings. In another embodiment, sacrificial material is disposed in-between the optical device structures and then an encapsulation layer is disposed on the optical device structures. The sacrificial material is removed, forming a space bounded by the encapsulation layer, the substrate, and each of the optical device structures. In yet another embodiment, the encapsulation layer is disposed over the optical device structures forming a space bounded by the encapsulation layer, the substrate, and each of the optical device structures.