公开(公告)号：US20240282709A1

公开(公告)日：2024-08-22

申请号：US18112564

申请日：2023-02-22

Applicant: Applied Materials, Inc.

Inventor： Zhaoxuan WANG ,  Jianxin LEI ,  Wenting HOU ,  David Maxwell GAGE ,  Zihao HE

IPC: H01L23/532 ,  H01L21/02 ,  H01L21/3205 ,  H01L21/321 ,  H01L21/768

CPC classification number: H01L23/53266 ,  H01L21/0217 ,  H01L21/02183 ,  H01L21/02186 ,  H01L21/02189 ,  H01L21/02381 ,  H01L21/02414 ,  H01L21/02631 ,  H01L21/32051 ,  H01L21/3212 ,  H01L21/76834 ,  H01L21/7684 ,  H01L23/5329

Abstract: A method to produce a layered substrate includes depositing a ruthenium layer having a first average grain size on a substrate; annealing the substrate at a temperature and for a period of time sufficient to produce an annealed ruthenium layer having a second average grain size which is greater than the first average grain size; and removing a portion of the ruthenium layer by chemical mechanical planarization to form a planarized ruthenium layer, to produce the layered substrate. A layered substrate is also disclosed.

公开(公告)号：US20240359291A1

公开(公告)日：2024-10-31

申请号：US18139091

申请日：2023-04-25

Applicant: Applied Materials, Inc.

Inventor： Wei LU ,  Shih-Haur SHEN ,  David Maxwell GAGE ,  Jimin ZHANG ,  Taketo SEKINE ,  Haosheng WU ,  Kun XU ,  Jianshe TANG ,  Brian J. BROWN

IPC: B24B49/10 ,  B24B37/34

CPC classification number: B24B49/10 ,  B24B37/345 ,  H01L21/68

Abstract: A method of processing a substrate includes polishing a front surface of a substrate on a first pad coupled to a first platen. The method further includes transferring the substrate from the first pad to a second pad coupled to a second platen with a carrier head. The method further includes moving the carrier head to a scan position to place an edge of the substrate above an orientation sensor disposed at a rotational center of the second pad. The method further includes scanning the edge of the substrate with the orientation sensor to produce a signal. The method further includes analyzing the signal to locate a reference mark of the substrate to determine a rotational orientation of the substrate relative to the carrier head.