公开(公告)号：US20240356225A1

公开(公告)日：2024-10-24

申请号：US18306063

申请日：2023-04-24

Applicant: Apple Inc.

Inventor： Trang T. Thai ,  Jennifer M. Edwards ,  Sidharth S. Dalmia ,  Menglu Li ,  Taegui Kim ,  Hai H. Ta

IPC: H01Q9/04 ,  H01Q1/14 ,  H01Q1/48 ,  H01Q1/50 ,  H01Q23/00

CPC classification number: H01Q9/0407 ,  H01Q1/14 ,  H01Q1/48 ,  H01Q1/50 ,  H01Q23/00

Abstract: An electronic device may be provided with a phased antenna array with antennas on an antenna module. The module may include a primary substrate and a secondary substrate mounted to the primary substrate by an interconnect. An antenna may include patch elements in the primary substrate and patch elements in the secondary substrate that are fed using conductive vias. Fences of conductive vias may couple the patch elements in the primary substrate to ground to isolate the patch elements in the primary substrate from the patch elements in the secondary substrate. The secondary substrate may be smaller than the primary substrate, allowing the secondary substrate to fit into relatively small portions of the electronic device while locating the patch elements in the secondary substrates closer to free space, thereby maximizing antenna performance.

公开(公告)号：US12074077B2

公开(公告)日：2024-08-27

申请号：US16952567

申请日：2020-11-19

Applicant: Apple Inc.

Inventor： Karthik Shanmugam ,  Flynn P. Carson ,  Jun Zhai ,  Raymundo M. Camenforte ,  Menglu Li

IPC: H01L23/31 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00 ,  H01L23/498 ,  H01L23/538 ,  H01L25/065 ,  H01L25/10 ,  H05K1/02 ,  H01L23/48

CPC classification number: H01L23/3121 ,  H01L21/4857 ,  H01L21/568 ,  H01L23/31 ,  H01L23/3157 ,  H01L23/49816 ,  H01L23/4985 ,  H01L23/5385 ,  H01L23/5386 ,  H01L23/5387 ,  H01L24/24 ,  H01L25/0655 ,  H01L25/105 ,  H05K1/0278 ,  H01L23/481 ,  H01L23/5384 ,  H01L2224/24137 ,  H01L2225/06548 ,  H01L2924/18162

Abstract: Flexible packages and electronic devices with integrated flexible packages are described. In an embodiment, a flexibly package includes a first die and a second die encapsulated in a molding compound layer. A compliant redistribution layer (RDL) spans the molding compound layer and both dies, and includes electrical routing formed directly on landing pads of the dies. A notch is formed in the molding compound layer between the dies to facilitate flexure of the compliant RDL.

公开(公告)号：US12165956B2

公开(公告)日：2024-12-10

申请号：US17643247

申请日：2021-12-08

Applicant: Apple Inc.

Inventor： Kumar Nagarajan ,  Flynn P. Carson ,  Karthik Shanmugam ,  Menglu Li ,  Raymundo M. Camenforte ,  Scott D. Morrison

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/532 ,  H01L23/538 ,  H01L25/16 ,  H01L49/02

Abstract: Package structures, modules containing such packages and methods of manufacture. are described. In an embodiment, a package includes a plurality of terminal pads, a plurality of passive components bonded to top sides of the plurality of terminal pads, a die bonded to top sides of the plurality of passive components and a molding compound encapsulating at least the plurality of passive components and the die.

公开(公告)号：US20230178458A1

公开(公告)日：2023-06-08

申请号：US17643247

申请日：2021-12-08

Applicant: Apple Inc.

Inventor： Kumar Nagarajan ,  Flynn P. Carson ,  Karthik Shanmugam ,  Menglu Li ,  Raymundo M. Camenforte ,  Scott D. Morrison

IPC: H01L23/495 ,  H01L23/31 ,  H01L23/538 ,  H01L23/532 ,  H01L49/02

CPC classification number: H01L23/4952 ,  H01L23/31 ,  H01L23/5381 ,  H01L23/53228 ,  H01L28/00

Abstract: Package structures, modules containing such packages and methods of manufacture. are described. In an embodiment, a package includes a plurality of terminal pads, a plurality of passive components bonded to top sides of the plurality of terminal pads, a die bonded to top sides of the plurality of passive components and a molding compound encapsulating at least the plurality of passive components and the die.

公开(公告)号：US20220157680A1

公开(公告)日：2022-05-19

申请号：US16952567

申请日：2020-11-19

Applicant: Apple Inc.

Inventor： Karthik Shanmugam ,  Flynn P. Carson ,  Jun Zhai ,  Raymundo M. Camenforte ,  Menglu Li

IPC: H01L23/31 ,  H01L23/498 ,  H01L21/56 ,  H01L21/48

Abstract: Flexible packages and electronic devices with integrated flexible packages are described. In an embodiment, a flexibly package includes a first die and a second die encapsulated in a molding compound layer. A compliant redistribution layer (RDL) spans the molding compound layer and both dies, and includes electrical routing formed directly on landing pads of the dies. A notch is formed in the molding compound layer between the dies to facilitate flexure of the compliant RDL.