公开(公告)号：US20230139085A1

公开(公告)日：2023-05-04

申请号：US17918087

申请日：2021-04-06

Applicant: ASML Netherlands B.V.

Inventor： Shengcheng JIN ,  Haili ZHANG ,  Zhichao CHEN

IPC: G06T7/00 ,  G01N23/2251 ,  G03F7/20

Abstract: An improved apparatus and method for facilitating inspection of a wafer are disclosed. An improved method for facilitating inspection of a wafer comprises identifying a plurality of repeating patterns from reference image data associated with a layout design of the wafer. The method also comprises determining a pattern feature of one of the identified plurality of repeating patterns based on a change of a first characteristic of the reference image data. The method further comprises causing a first area of the wafer corresponding to the determined pattern feature to be evaluated.

公开(公告)号：US20250166166A1

公开(公告)日：2025-05-22

申请号：US18838459

申请日：2023-01-19

Applicant: ASML Netherlands B.V.

Inventor： Shengcheng JIN ,  Yunbo GUO ,  Chen ZHANG

IPC: G06T7/00

Abstract: Apparatuses, systems, and methods for providing beams for defect detection and defect location binning associated with a sample of charged particle beam systems. A method of image analysis may include obtaining an image of a sample, identifying a feature captured in the image of the sample, generating a template image from a design layout of the identified feature, comparing 5 the image of the sample with the template image, and processing the image based on the comparison. In some embodiments, a method of image analysis may include obtaining an image of a sample, identifying a feature captured in the obtained image of the sample, mapping the obtained image to a template image generated from a design layout of the identified feature, and analyzing the image based on the mapping.

公开(公告)号：US20190333205A1

公开(公告)日：2019-10-31

申请号：US16479138

申请日：2018-01-18

Applicant: ASML Netherlands B.V.

Inventor： Wei FANG ,  Haili ZHANG ,  Zhichao CHEN ,  Shengcheng JIN

IPC: G06T7/00 ,  G03F7/20 ,  G05B19/406

Abstract: A defect pattern grouping method is disclosed. The defect pattern grouping method comprises obtaining a first polygon that represents a first defect from an image of a sample, comparing the first polygon with a set of one or more representative polygons of a defect-pattern collection, and grouping the first polygon with any one or more representative polygons identified based on the comparison.

公开(公告)号：US20250005739A1

公开(公告)日：2025-01-02

申请号：US18710127

申请日：2022-10-18

Applicant: ASML Netherlands B.V.

Inventor： Shengcheng JIN ,  Lingling PU ,  Liangjiang YU

IPC: G06T7/00 ,  G06T3/14 ,  G06T5/60 ,  H01J37/22 ,  H01J37/28

Abstract: Apparatuses, systems, and methods for providing beams for defect detection and defect location identification associated with a sample of charged particle beam systems. In some embodiments, a method may include obtaining an image of a sample; determining defect characteristics from the image; generating an updated image based on the determined defect characteristics and the image; and aligning the updated image with a reference image.

公开(公告)号：US20240212317A1

公开(公告)日：2024-06-27

申请号：US18557578

申请日：2022-04-28

Applicant: ASML Netherlands B.V.

Inventor： Jingchun WANG ,  Chuang YE ,  Shengcheng JIN

IPC: G06V10/762 ,  G06T5/10 ,  G06T7/00 ,  G06T7/11 ,  G06V10/44 ,  G06V10/74

CPC classification number: G06V10/762 ,  G06T5/10 ,  G06T7/0004 ,  G06T7/11 ,  G06V10/44 ,  G06V10/761 ,  G06T2207/30148

Abstract: Apparatuses, systems, and methods for grouping a plurality of patterns extracted from image data are disclosed. In some embodiments, the method for grouping the patterns comprises receiving the image data including the plurality of patterns that represent features to be formed on a portion of a wafer. The method also comprises separating the plurality of patterns after Fourier Transform into multiple sets of patterns. The method further comprises performing, to a respective set of patterns, a hierarchical clustering to obtain a plurality of subsets of patterns by recursively evaluating features related to similarity between patterns within the respective set of patterns.