- 专利标题: Semiconductor structure with multi spacer
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申请号: US14858862申请日: 2015-09-18
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公开(公告)号: US09911824B2公开(公告)日: 2018-03-06
- 发明人: Kuo-Cheng Ching , Ching-Wei Tsai , Chih-Hao Wang , Ying-Keung Leung
- 申请人: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD
- 申请人地址: TW Hsinchu
- 专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人: Taiwan Semiconductor Manufacturing Co., Ltd.
- 当前专利权人地址: TW Hsinchu
- 代理机构: Birch, Stewart, Kolasch & Birch, LLP
- 主分类号: H01L27/088
- IPC分类号: H01L27/088 ; H01L29/66 ; H01L29/78 ; H01L27/11 ; H01L27/02
摘要:
A semiconductor structure and a method for forming the same are provided. The semiconductor structure includes a fin structure formed over a substrate and a gate structure formed across the fin structure. The semiconductor structure further includes a bottom spacer formed on a lower part of a sidewall of the gate structure and an upper spacer formed on an upper part of the sidewall of the gate structure. In addition, the upper spacer includes an air gap formed in a dielectric material.
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