A logic semiconductor device includes a plurality of active patterns extending in a horizontal direction and being spaced apart from each other in a vertical direction, an isolation layer defining the active patterns, a plurality of gate patterns extending in the vertical direction on the active patterns and the isolation layer, the gate patterns being spaced apart from each other in the horizontal direction, a plurality of lower wirings extending in the horizontal direction over the gate patterns, a plurality of upper wirings extending in the vertical direction over the lower wirings, a through contact connecting at least one upper wiring of the upper wirings and at least one gate pattern of the gate patterns, the through contact extending from a bottom surface of the upper wiring to a position under a bottom surface of one of the lower wirings relative to the active patterns.