Invention Grant
- Patent Title: Structure and method for FinFET device
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Application No.: US14924422Application Date: 2015-10-27
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Publication No.: US09698058B2Publication Date: 2017-07-04
- Inventor: Kuo-Cheng Ching , Ka-Hing Fung , Chih-Sheng Chang , Zhiqiang Wu
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsin-Chu
- Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
- Current Assignee Address: TW Hsin-Chu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L21/8238
- IPC: H01L21/8238 ; H01L29/78 ; H01L29/06 ; H01L27/092 ; H01L29/423 ; H01L29/772 ; H01L27/088 ; H01L27/12 ; H01L29/66 ; H01L21/02 ; H01L21/84 ; H01L29/165

Abstract:
The present disclosure provides an embodiment of a fin-like field-effect transistor (FinFET) device. The device includes a substrate having a first gate region, a first fin structure over the substrate in the first gate region. The first fin structure includes an upper semiconductor material member, a lower semiconductor material member, surrounded by an oxide feature and a liner wrapping around the oxide feature of the lower semiconductor material member, and extending upwards to wrap around a lower portion of the upper semiconductor material member. The device also includes a dielectric layer laterally proximate to an upper portion of the upper semiconductor material member. Therefore the upper semiconductor material member includes a middle portion that is neither laterally proximate to the dielectric layer nor wrapped by the liner.
Public/Granted literature
- US20160049338A1 STRUCTURE AND METHOD FOR FINFET DEVICE Public/Granted day:2016-02-18
Information query
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