发明授权
- 专利标题: MOSFET device with reduced breakdown voltage
- 专利标题(中): MOSFET器件具有降低的击穿电压
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申请号: US14057465申请日: 2013-10-18
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公开(公告)号: US09312336B2公开(公告)日: 2016-04-12
- 发明人: Ji Pan , Anup Bhalla
- 申请人: Alpha and Omega Semiconductor Incorporated
- 申请人地址: US CA Sunnyvale
- 专利权人: Alpha and Omega Semiconductor Incorporated
- 当前专利权人: Alpha and Omega Semiconductor Incorporated
- 当前专利权人地址: US CA Sunnyvale
- 代理机构: Van Pelt, Yi & James LLP
- 主分类号: H01L29/76
- IPC分类号: H01L29/76 ; H01L29/94 ; H01L31/062 ; H01L31/113 ; H01L31/119 ; H01L29/10 ; H01L29/08 ; H01L29/66 ; H01L29/78 ; H01L29/861 ; H01L29/872 ; H01L21/265 ; H01L29/417 ; H01L29/423 ; H01L29/47
摘要:
A semiconductor device includes a drain region, an epitaxial layer overlaying the drain region, and an active region. The active region includes: a body disposed in the epitaxial layer; a source embedded in the body; a gate trench extending into the epitaxial layer; a gate disposed in the gate trench; a contact trench extending through the source and at least part of the body; a contact electrode disposed in the contact trench; and an implant disposed at least in part along a contact trench wall; and an epitaxial enhancement portion disposed below the contact trench and in contact with the implant.
公开/授权文献
- US20140054687A1 MOSFET DEVICE WITH REDUCED BREAKDOWN VOLTAGE 公开/授权日:2014-02-27
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